SLLSEZ1C September   2017  – May 2019 TDP142

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematics
      2.      Display
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DisplayPort
      2. 8.3.2 4-level Inputs
      3. 8.3.3 Receiver Linear Equalization
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration in GPIO Mode
      2. 8.4.2 Device Configuration In I2C Mode
      3. 8.4.3 Linear EQ Configuration
      4. 8.4.4 Operation Timing – Power Up
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 General Register (address = 0x0A) [reset = 00000001]
        1. Table 6. General Registers
      2. 8.6.2 DisplayPort Control/Status Registers (address = 0x10) [reset = 00000000]
        1. Table 7. DisplayPort Control/Status Registers (0x10)
      3. 8.6.3 DisplayPort Control/Status Registers (address = 0x11) [reset = 00000000]
        1. Table 8. DisplayPort Control/Status Registers (0x11)
      4. 8.6.4 DisplayPort Control/Status Registers (address = 0x12) [reset = 00000000]
        1. Table 9. DisplayPort Control/Status Registers (0x12)
      5. 8.6.5 DisplayPort Control/Status Registers (address = 0x13) [reset = 00000000]
        1. Table 10. DisplayPort Control/Status Registers (0x13)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Source Application Implementation
        1. 9.2.1.1 Design Requirement
        2. 9.2.1.2 Detail Design Procedure
      2. 9.2.2 Sink Application Implementation
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 DC Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
4-State CMOS Inputs(DPEQ[1:0], I2C_EN)
IIH High level input current VCC = 3.6 V; VIN = 3.6 V 20 80 µA
IIL Low level input current VCC = 3.6 V; VIN = 0 V –160 -40 µA
4-Level VTH Threshold 0 / R VCC = 3.3 V 0.55 V
Threshold R/ Float VCC = 3.3 V 1.65 V
Threshold Float / 1 VCC = 3.3 V 2.7 V
RPU Internal pull-up resistance 35 kΩ
RPD Internal pull-down resistance 95 kΩ
2-State CMOS Input (DPEN, Test1, Test2, SNOOPENZ, HPDIN) DPEN, TEST1 and TEST2 are Failsafe.
VIH High-level input voltage 2 3.6 V
VIL Low-level input voltage 0 0.8 V
RPD Internal pull-down resistance for DPEN 500 kΩ
R(ENPD) Internal pull-down resistance for SNOOPENZ (pin 29), and HPDIN (pin 32) 150 kΩ
IIH High-level input current VIN = 3.6 V –25 25 µA
IIL Low-level input current VIN = GND, VCC = 3.6 V –25 25 µA
I2C Control Pins SCL, SDA
VIH High-level input voltage I2C_EN = 0 0.7 x V(I2C) 3.6 V
VIL Low-level input voltage I2C_EN = 0 0 0.3 x V(I2C) V
VOL Low-level output voltage I2C_EN = 0; IOL = 3 mA 0 0.4 V
IOL Low-level output current I2C_EN = 0; VOL = 0.4 V 20 mA
II(I2C) Input current on SDA pin 0.1 x V(I2C) < Input voltage < 3.3 V –10 10 µA
CI(I2C) Input capacitance 10 pF
C(I2C_FM+_BUS) I2C bus capacitance for FM+ (1MHz) 150 pF
C(I2C_FM_BUS) I2C bus capacitance for FM (400kHz) 150 pF
R(EXT_I2C_FM+) External resistors on both SDA and SCL when operating at FM+ (1MHz) C(I2C_FM+_BUS) = 150 pF 620 820 910 Ω
R(EXT_I2C_FM) External resistors on both SDA and SCL when operating at FM (400kHz) C(I2C_FM_BUS) = 150 pF 620 1500 2200 Ω