SBOS780C March   2016  – June 2021 THS3215

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: D2S
    6. 6.6  Electrical Characteristics: OPS
    7. 6.7  Electrical Characteristics: D2S + OPS
    8. 6.8  Electrical Characteristics: Midscale (DC) Reference Buffer
    9. 6.9  Typical Characteristics: D2S + OPS
    10. 6.10 Typical Characteristics: D2S Only
    11. 6.11 Typical Characteristics: OPS Only
    12. 6.12 Typical Characteristics: Midscale (DC) Reference Buffer
    13. 6.13 Typical Characteristics: Switching Performance
    14. 6.14 Typical Characteristics: Gain Drift
  7. Parameter Measurement Information
    1. 7.1 Overview
    2. 7.2 Frequency Response Measurement
    3. 7.3 Harmonic Distortion Measurement
    4. 7.4 Noise Measurement
    5. 7.5 Output Impedance Measurement
    6. 7.6 Step-Response Measurement
    7. 7.7 Feedthrough Measurement
    8. 7.8 Midscale Buffer ROUT Versus CLOAD Measurement
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Differential to Single-Ended Stage (D2S) With Fixed Gain of 2 V/V (Pins 2, 3, 6, and 14)
      2. 8.3.2 Midscale (DC) Reference Buffer (Pin 1 and Pin 15)
      3. 8.3.3 Output Power Stage (OPS) (Pins 4, 7, 9, 10, 11, and 12)
        1. 8.3.3.1 Output DC Offset and Drift for the OPS
        2. 8.3.3.2 OPS Harmonic Distortion (HD) Performance
        3. 8.3.3.3 Switch Feedthrough to the OPS
        4. 8.3.3.4 Driving Capacitive Loads
      4. 8.3.4 Digital Control Lines
    4. 8.4 Device Functional Modes
      1. 8.4.1 Full-Signal Path Mode
        1. 8.4.1.1 Internal Connection With Fixed Common-Mode Output Voltage
        2. 8.4.1.2 Internal Connection With Adjustable Common-Mode Output Voltage
        3. 8.4.1.3 External Connection
      2. 8.4.2 Dual-Output Mode
      3. 8.4.3 Differential I/O Voltage Mode
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Applications
        1. 9.1.1.1 High-Frequency, High-Voltage, Dual-Output Line Driver for AWGs
          1. 9.1.1.1.1 Design Requirements
          2. 9.1.1.1.2 Detailed Design Procedure
          3. 9.1.1.1.3 Application Curves
        2. 9.1.1.2 High-Voltage Pulse-Generator
          1. 9.1.1.2.1 Design Requirements
          2. 9.1.1.2.2 Detailed Design Procedure
          3. 9.1.1.2.3 Application Curves
        3. 9.1.1.3 Single-Supply, AC-Coupled, Piezo Element Driver
          1. 9.1.1.3.1 Detailed Design Procedure
        4. 9.1.1.4 Output Common-Mode Control Using the Midscale Buffer as a Level Shifter
          1. 9.1.1.4.1 Detailed Design Procedure
        5. 9.1.1.5 Differential I/O Driver With independent Common-Mode Control
          1. 9.1.1.5.1 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Thermal Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI (Free Software Download)
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Detailed Design Procedure

The THS3215 is well suited for high-speed, low-distortion arbitrary waveform generator (AWG) applications commonly used in laboratory equipment. In this typical application, a high-speed, complementary-current-output DAC is used to drive the D2S. The OPS of the THS3215 easily drives a 50 MHz, 2.5 VPP signal into a matched 50 Ω load. When a larger output signal is required, consider using the THS3095 as the final driver stage.

A passive RLC filter is commonly used on DAC outputs to reduce the high-frequency content in the DAC steps. The filtering between the DAC output and the input to the D2S reduces higher-order DAC harmonics from feeding into the internal OPS path when the external input path is selected. Feedthrough between the internal and external OPS paths increases with increasing frequency; however, the input filter rolls off the DAC harmonics before the harmonics couple to VOUT (pin 10) through the deselected OPS signal path. Figure 9-2 shows an example of a doubly-terminated differential filter from the DAC to the THS3215 D2S inputs at +IN (pin 2) and –IN (pin 3). The DAC is modeled as two, fixed, 10 mA currents and a differential, ac-current source. The 10 mA dc midscale currents set up the average common-mode voltage at the DAC outputs and D2S inputs at 10 mA × 25 Ω = 0.25 VCM. The total voltage swing on each DAC output is 0 V to 0.5 V.

GUID-174EB027-5C49-4615-B53F-68CE5FEC435A-low.gifFigure 9-2 105 MHz Butterworth Filter Between DAC and D2S Inputs

Some of the guidelines to consider in this filter design are:

  1. The filter cutoff is adjusted to hit a standard value in the standard high-frequency, chip inductors kits.
  2. The required filter output capacitance is reduced from the design value of 29.4 pF to 27 pF to account for the D2S input capacitance of 2.4 pF, as reported in the D2S Electrical Characteristics table.
  3. The capacitor at the DAC output pins must also be reduced by the expected DAC output pin capacitance. The DAC output capacitance is often specified as 5 pF, but is usually much lower. Contact the DAC manufacturer for an accurate value.

Figure 9-3 shows the TINA-simulated filter response for the input-stage filter. The low-frequency 34 dBΩ gain is due to the 50 Ω differential resistance at the DAC output terminals. At 200 MHz, this filter is down 17 dB from the 50 Ω level; it is also very flat through 50 MHz.

GUID-C38DA6AF-D33E-4DE5-A059-AB4E068C0A83-low.gifFigure 9-3 Simulated, Differential-Input Filter Response

In the example design of Figure 9-1, a 50 MHz, third-order Bessel filter is placed between the D2S output and the external OPS input. Another 25 MHz, third-order Bessel filter is placed at the input of a very-high output-swing THS3095 stage. A double-pole, double-throw (DPDT) relay selects the THS3095 path when the internal OPS path is selected in the THS3215. Figure 9-1 shows this design. The key operational considerations in this design include:

  1. When the external input OPS path is selected, the 2 VPP maximum D2S output swing experiences a 1.55 dB insertion loss from the interstage filter between VO1 (pin 6) and VIN+ (pin 9). A standard value inductor is used and the 464 Ω termination accounts for the internal 18.5 kΩ element. The 10 Ω resistor at VIN+ isolates the OPS input from the 52 pF filter capacitor. To recover the insertion loss and produce a maximum 5 VPP output, the OPS gain is set to 2.96 V/V. When the interstage filter path is selected, the two DPDT relays pass the OPS output on directly from the 49.9 Ω output matching resistor to VO. Disable the THS3095 to conserve power.
  2. To deliver 20 VPP at the VO output, select the THS3095 path. Select the internal OPS path to bypass the 50 MHz filter (1.55 dB insertion loss) in order to give a maximum 5.9 VPP output at VOUT (pin 11). The two DPDT relays switch position, and the 49.9 Ω at the OPS output becomes part of the 25 MHz, third-order Bessel filter into the THS3095 stage. This filter has a 1 dB insertion loss requiring a gain of 3.8 V/V in the THS3095 to deliver 20 VPP from the OPS output.
  3. Figure 9-4 and Figure 9-5 show the frequency response and harmonic distortion performance of the dual output-voltage system. The frequency response is normalized to 0 dB to make bandwidth comparisons easier.