SCDS436 September   2023 TMUX9616

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics: TMUX9616
    6. 6.6 Switching Characteristics: TMUX9616
    7. 6.7 Digital Timings: TMUX9616
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Off-Leakage Current
    2. 7.2 Device Turn On/Off Time
    3. 7.3 Off Isolation
    4. 7.4 Inter-Channel Crosstalk
    5. 7.5 Output Voltage Spike
    6. 7.6 Switch DC Offset Voltage
    7. 7.7 Isolation Diode Current
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Wide Input Signal Range (up to ±110 V, 220 VPP)
      2. 8.3.2 Bidirectional Operation
      3. 8.3.3 Device Digital Logic Control
      4. 8.3.4 Latch-Up Immunity by Device Construction
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Device Power Up
    5. 8.5 Device Logic Table
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD – VSS Power supply voltage differential 40 200 220 V
VDD Positive power supply voltage 20 100 110 V
VSS Negative power supply voltage –110 –100 0 V
VS or VD Signal path input/output voltage (source or drain pin) (Sx, D)(1) VSS + 10 VDD – 10 V
VLL SPI/Logic power supply voltage 1.7 5.5 V
VL Logic control pin voltage (DIN, DOUT, CLK, LE, CLR) 0 VLL V
VIH Logic control pin high-level input voltage (DIN, DOUT, CLK, LE, CLR) 0.9 x VLL V
VIL Logic control pin low-level input voltage (DIN, DOUT, CLK, LE, CLR) 0.1 x VLL V
TA Ambient temperature –40 85 °C
TJ Junction temperature –40 125 °C
VS, VD operation up to VSS and VDD is acceptable for recommended operation. RON FLAT may increase when operating beyond VSS + 10 V and VDD – 10 V