SLVS736C February   2008  – October 2023 TPS2550 , TPS2551

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Overcurrent
      2. 9.3.2 Reverse-Voltage Protection
      3. 9.3.3 FAULT Response
      4. 9.3.4 Undervoltage Lockout (UVLO)
      5. 9.3.5 ENABLE ( EN or EN)
      6. 9.3.6 Thermal Sense
      7. 9.3.7 Device Functional Modes
    4. 9.4 Programming
      1. 9.4.1 Programming the Current-Limit Threshold
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Two-Level Current-Limit Circuit
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detail Design Procedures
        1. 10.2.3.1 Designing Above a Minimum Current Limit
        2. 10.2.3.2 Designing Below a Maximum Current Limit
        3. 10.2.3.3 Input and Output Capacitance
      4. 10.2.4 Auto-Retry Functionality
      5. 10.2.5 Latch-Off Functionality
      6. 10.2.6 Typical Application as USB Power Switch
        1. 10.2.6.1 Design Requirements
          1. 10.2.6.1.1 USB Power-Distribution Requirements
        2. 10.2.6.2 Detail Design Procedures
          1. 10.2.6.2.1 Universal Serial Bus (USB) Power-Distribution Requirements
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Self-Powered and Bus-Powered Hubs
      2. 10.3.2 Low-Power Bus-Powered and High-Power Bus-Powered Functions
      3. 10.3.3 Power Dissipation and Junction Temperature
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.3.3 Input and Output Capacitance

Input and output capacitance improve the performance of the device; make sure to optimize the actual capacitance for the particular application. For all applications, a 0.01 μF to 0.1μF ceramic bypass capacitor between IN and GND is recommended as close to the device as possible for local noise de-coupling. This precaution reduces ringing on the input due to power-supply transients. Additional input capacitance may be needed on the input to reduce voltage overshoot from exceeding the absolute maximum voltage of the device during heavy transients, which is especially important during bench testing when long, inductive cables are used to connect the evaluation board to the bench power-supply.

Placing a high-value electrolytic capacitor on the output pin is recommended when the large transient currents are expected on the output. Additionally, bypassing the output with a 0.01 μF to 0.1 μF ceramic capacitor improves the immunity of the device to short-circuit transients.