SLUSDL4 February   2020 TPS59632-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation
      2. 7.3.2  Current Sensing
      3. 7.3.3  Load-line (Droop)
      4. 7.3.4  Load Transients
      5. 7.3.5  Overshoot Reduction (OSR)
      6. 7.3.6  Undershoot Reduction (USR)
      7. 7.3.7  Autobalance Current Sharing
      8. 7.3.8  PWM And SKIP Signals
      9. 7.3.9  Bias Power (V5A, VDD, And VINTF) UVLO
      10. 7.3.10 Start-Up Sequence
      11. 7.3.11 Power Good Operation
      12. 7.3.12 Analog Current Monitor, IMON, And Corresponding Digital Output Current
      13. 7.3.13 Fault Behavior
      14. 7.3.14 Output Under Voltage Protection (UVP)
      15. 7.3.15 Output Over Voltage Protection (OVP)
      16. 7.3.16 Over Current Protection (OCP)
      17. 7.3.17 Over Current Warning
      18. 7.3.18 Input Voltage Limits
      19. 7.3.19 VID Table
    4. 7.4 User Selections
    5. 7.5 I2C Interface Operation
      1. 7.5.1 Key For Protocol Examples
      2. 7.5.2 Protocol Examples
    6. 7.6 I2C Register Maps
      1. 7.6.1 Voltage Select Register (VSR) (Address = 00h)
      2. 7.6.2 IMON Register (Address = 03h)
      3. 7.6.3 VMAX Register (Address = 04h)
      4. 7.6.4 Power State Register (Address = 06h)
      5. 7.6.5 Slew Register (Address = 07h)
      6. 7.6.6 Lot Code Registers (Address = 10-13h)
      7. 7.6.7 Fault Register (Address = 14h)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 3-Phase D-CAP+™, Step-Down Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Step 1: Select Switching Frequency
          2. 8.2.1.2.2  Step 2: Set The Slew Rate
          3. 8.2.1.2.3  Step 3: Set The I2C Address
          4. 8.2.1.2.4  Step 4: Determine Inductor Value And Choose Inductor
          5. 8.2.1.2.5  Step 5: Current Sensing Resistance
          6. 8.2.1.2.6  Step 6: Select Over Current Protection (OCP) Setting
          7. 8.2.1.2.7  Step 7: Current Monitor (IMON) Setting
          8. 8.2.1.2.8  Step 8: Set the Load-Line Slope
          9. 8.2.1.2.9  Step 9: Voltage Feedback Resistor Calculation
          10. 8.2.1.2.10 Step 10: Ramp Compensation Selection
          11. 8.2.1.2.11 Step 11 Overshoot Reduction (OSR) selection
          12. 8.2.1.2.12 Step 12: Undershoot Reduction (USR) selection
          13. 8.2.1.2.13 Step 13: Loop Compensation
        3. 8.2.1.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1  Layout Guidelines
    2. 10.2  Layout Example
    3. 10.3  Current Sensing Lines
    4. 10.4  Feedback Voltage Sensing Lines
    5. 10.5  PWM And SKIP Lines
    6. 10.6  Power Chain Symmetry
    7. 10.7  Component Location
    8. 10.8  Grounding Recommendations
    9. 10.9  Decoupling Recommendations
    10. 10.10 Conductor Widths
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.11 Power Good Operation

PGOOD is an open-drain output pin that is designed to be pulled-up with an external resistor to a voltage 3.6 V or less. Normal PGOOD operation (exclusive of activation of any faults) is shown in Figure 7-8. On initial power-up PGOOD happens within 6 µs of the DAC reaching its target value. When EN is brought low, PGOOD is also brought low for 250 µs, then is allowed to float. The TPS59632-Q1 device pulls down the PGOOD signal when the EN signal subsequently goes high and returns high again within 6 µs of the end of the DAC ramp. The delay period between EN going high and PGOOD going low in this case is less than 1 µs. Figure 7-8 shows the power good operation at initial start-up and with falling and rising EN.

For applications where it is undesirable to have PGOOD high when EN is low, an alternate method of pulling up the open-drain PGOOD signal is possible. In this method, the PGOOD is pulled up to EN logic signal. This ensures that the PGOOD is low when EN goes low.

GUID-F29C18E5-6E1C-4E74-B4CD-DBA580BC213D-low.gifFigure 7-8 Power Good Operation