SLVSCJ5B December   2015  – June 2020 TPS7H3301-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Standard DDR Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VTT/VO Sink and Source Regulator
      2. 7.3.2 Reference Input (VDDQSNS)
      3. 7.3.3 Reference Output (VTTREF)
      4. 7.3.4 EN Control (EN)
      5. 7.3.5 Power-Good Function (PGOOD)
      6. 7.3.6 VTT Current Protection
      7. 7.3.7 VIN UVLO Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD/VIN Capacitor
        2. 8.2.2.2 VLDO Input Capacitor
        3. 8.2.2.3 VTT Output Capacitor
        4. 8.2.2.4 VTTSNS Connection
        5. 8.2.2.5 Low VIN Applications
        6. 8.2.2.6 S3 and Pseudo-S5 Support
        7. 8.2.2.7 Tracking Startup and Shutdown
        8. 8.2.2.8 Output Tolerance Consideration for VTT DIMM or Module Applications
        9. 8.2.2.9 LDO Design Guidelines
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TPS7H3301-SP is a TID and SEE radiation-hardened double data rate (DDR) 3-A termination regulator with built-in VTTREF buffer. The regulator is specifically designed to provide a complete, compact, low-noise solution for space DDR termination applications such as single board computers, solid state recorders, and payload processing.

The TPS7H3301-SP supports DDR VTT termination applications using DDR, DDR2, DDR3, DDR4. The fast transient response of the TPS7H3301-SP VTT regulator allows for a very stable supply during read/write conditions. During transients, the fast tracking feature of the VTTREF supply minimizes any voltage offset between VTT/Vo and VTTREF. To enable simple power sequencing, both an enable input and a power-good output (PGOOD) have been integrated into the TPS7H3301-SP. The PGOOD output is open-drain so it can be tied to multiple open-drain outputs to monitor when all supplies have come into regulation. The enable signal can also be used to discharge VTT/Vo during suspend to RAM (S3) power down mode.

Device Information(1)

PART NUMBER GRADE PACKAGE
5962R1422801VXC Flight Grade RHA 100 krad(Si) 16-Pin CFP
9.60 mm × 11.00 mm
Weight: 1.55 g(5)
5962-1422801VXC Flight Grade QMLV
TPS7H3301HKR/EM Engineering Module(4)
TPS7H3301EVM-CVAL Ceramic Evaluation Board EVM
  1. For all available packages, see the orderable addendum at the end of the data sheet.
  2. See Radiation Report for details.
  3. Applicable to DDR2, DDR3, DDR3L and DDR4. For DDR, input voltage = 3.3-V nominal. VIN is 2.95 to 3.5 V for DDR1 and VLDOIN > VTT/VO for all DDRs.
    For DDR2 3-A load condition, VIN is 2.45 to 3.5 V.
    VIN headroom: VIN_MIN ≥ VTT/VO + 1.5 V.
  4. These units are intended for engineering evaluation only. They are processed to a noncompliant flow (that is, no burn-in, and so forth) and are tested to a temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance over the full MIL specified temperature range of –55°C to 125°C or operating life.
  5. Weight is accurate to ±10%.

Standard DDR Application

TPS7H3301-SP ddr_app2_slvscj5.gif