JAJSOV8 October   2023 ISOTMP35

ADVANCE INFORMATION  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specification
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Integrated Isolation Barrier and Thermal Response
      2. 7.3.2 Analog Output
        1. 7.3.2.1 Output Accuracy
        2. 7.3.2.2 Output Voltage Linearity
        3. 7.3.2.3 Drive Capability
      3. 7.3.3 Thermal Response
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Linearity
      2. 8.1.2 Load Regulation
      3. 8.1.3 Start-Up Settling Time
      4. 8.1.4 Thermal Response
      5. 8.1.5 External Buffer
      6. 8.1.6 ADC Selection and Impact on Accuracy
      7. 8.1.7 Implementation Guidelines
      8. 8.1.8 PSRR
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
  • DFQ|7
サーマルパッド・メカニカル・データ
発注情報

External Buffer

In case of higher capacitance on the output or a long trace between the sensor and the ADC, a external buffer can be added. This implementation is shown in Figure 8-1 for the signal to be temperature voltage to be sent through a differential pair.
GUID-20230816-SS0I-FMGD-Q1HC-NBTNFC0KNN1Z-low.svg Figure 8-1 Buffering Prior to Sending Data Through a Differential Pair