JAJSOV8 October   2023 ISOTMP35

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specification
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Integrated Isolation Barrier and Thermal Response
      2. 7.3.2 Analog Output
        1. 7.3.2.1 Output Accuracy
        2. 7.3.2.2 Output Voltage Linearity
        3. 7.3.2.3 Drive Capability
      3. 7.3.3 Thermal Response
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Linearity
      2. 8.1.2 Load Regulation
      3. 8.1.3 Start-Up Settling Time
      4. 8.1.4 Thermal Response
      5. 8.1.5 External Buffer
      6. 8.1.6 ADC Selection and Impact on Accuracy
      7. 8.1.7 Implementation Guidelines
      8. 8.1.8 PSRR
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • DFQ|7
サーマルパッド・メカニカル・データ
発注情報

6.6 Electrical Characteristics

Over free-air temperature range and VDD = 2.3 V to 5.5 V (unless otherwise noted); Typical specifications are at TA = 25°C and VDD = 3.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE SENSOR
TERR Temperature accuracy 0°C to 70°C –1.2 ±0.5 1.2 °C
TERR Temperature accuracy -40°C to 150°C –2.0 ±0.5 2.0 °C
PSR DC power supply rejection  –0.05 0.05 °C/V
TSENS Temperature sensitivity TA = –40°C to 150°C 10.00 mV/°C
TLTD Long-term drift(1) 1000 hours at 150°C, 3.3 V TBD °C
VOUT Output voltage TA = 0°C 500 mV
TA = 25°C 750 mV
NL Nonlinearity TA = –40°C to 150°C 0.5 °C
tRESP_D Directional Response time 2-layer 62-mil Rigid PCB
2 oz. Copper		 τ = 63 %
TSENSE = 25°C to 75°C
Pins 4 to 7 = 25°C		 TBD ms
tRESP_L Response time (Stirred Liquid) Unmounted
(Single layer Flex PCB)		 τ = 63 %
25°C to 125°C		 TBD ms
Mounted
(2-layer 62-mil PCB)		 TBD ms
ANALOG OUTPUT
ZOUT Output impedance ILOAD = 100 μA, f = 100 Hz 20 Ω
ILOAD = 100 μA, f = 500 Hz 50 Ω
IOUT Output current 500 μA
LR Load regulation ILOAD = –600 μA to 600 μA 6 mV
CL Maximum capacitive load 1 nF
POWER SUPPLY
IDD Operating current VDD = 3.3 V
TA = 25°C		 10 12 μA
TA = –40°C to 150°C 17 μA
(1) Long term stability is determined using accelerated operational life testing at a junction temperature of 150°C.