JAJSOV8 October   2023 ISOTMP35

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specification
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Integrated Isolation Barrier and Thermal Response
      2. 7.3.2 Analog Output
        1. 7.3.2.1 Output Accuracy
        2. 7.3.2.2 Output Voltage Linearity
        3. 7.3.2.3 Drive Capability
      3. 7.3.3 Thermal Response
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Linearity
      2. 8.1.2 Load Regulation
      3. 8.1.3 Start-Up Settling Time
      4. 8.1.4 Thermal Response
      5. 8.1.5 External Buffer
      6. 8.1.6 ADC Selection and Impact on Accuracy
      7. 8.1.7 Implementation Guidelines
      8. 8.1.8 PSRR
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • DFQ|7
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) ISOTMP35 UNIT
DFQ (SOIC)
7 PINS
RθJA Junction-to-ambient thermal resistance 116.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 38.8 °C/W
RθJB Junction-to-board thermal resistance 41.9 °C/W
ψJT Junction-to-top characterization parameter 38.3 °C/W
ψJB Junction-to-board characterization parameter N/A °C/W
MT Thermal Mass 51.0 mJ/°C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.