JAJSRJ1A June   2011  – February 2024 OPA564-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
        1. 7.3.1.1 Setting the Current Limit
      2. 7.3.2 Enable and Shutdown (E/S) Pin
      3. 7.3.3 Input Protection
      4. 7.3.4 Output Shutdown
      5. 7.3.5 Microcontroller Compatibility
      6. 7.3.6 Current Limit Flag
      7. 7.3.7 Thermal Protection
      8. 7.3.8 Junction Temperature Measurement Using TSENSE
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Configuration
      2. 8.1.2 Output-Stage Compensation
      3. 8.1.3 Output Protection
      4. 8.1.4 Power Dissipation and Safe Operating Area
    2. 8.2 Typical Applications
      1. 8.2.1 Improved Howland Current Pump
      2. 8.2.2 Programmable Power Supply
      3. 8.2.3 Powerline Communication
      4. 8.2.4 Motor-Drive Circuit
      5. 8.2.5 DC Motor-Speed Controller (Without Tachometer)
      6. 8.2.6 Generating VDIG
      7. 8.2.7 Temperature Measurement
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermally Enhanced PowerPAD™ Integrated Circuit Package
          1. 8.4.1.1.1 Bottom-Side Thermal Pad Assembly Process
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Revision History

Changes from Revision * (June 2011) to Revision A (February 2024)

  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • 「パッケージ情報」表、「ピン構成および機能」、「仕様」、「ESD 定格」、「推奨動作条件」、「熱に関する情報」、「詳細説明」、「概要」、「機能ブロック図」、「機能説明」、「デバイスの機能モード」、「アプリケーションと実装」、「代表的なアプリケーション」、「電源に関する推奨事項」、「レイアウト」、「デバイスおよびドキュメントのサポート」、「メカニカル、パッケージ、および注文情報」セクションを追加 Go
  • プレビューの DWD パッケージとそれに関連する項目を削除Go
  • HSOP のインスタンスを HSOIC に変更 (誤字)Go
  • 表紙の図で 20kΩ 抵抗のラベルを R4 から R3 に変更 （誤字）Go
  • Updated Related Products table and renamed to Device Comparison Table Go
  • Changed Operating Junction Temperature to Operating Ambient Temperature and moved to new Recommended Operating Conditions Go
  • Updated format of Electrical Characteristics Go
  • Changed Output current limit range typical value from "±0.4 to ±2.0" to "±0.4 to ±1.9"Go
  • Changed current limit flag output typical value for normal operation from 0 to V–Go
  • Changed Thermal Shutdown typical value for normal operation from 0 to V–Go
  • Changed current limit value range from "0.4A to 1.5A" to "0.4A to 1.6A" in Adjustable Current Limit Go
  • Added text regarding adjustable current limit used to protect the device in Adjustable Current Limit Go
  • Updated equation terms for consistencyGo
  • Changed RCL to RSET in Figure 7-1, Adjustable Current Limit Go
  • Added text regarding IFLAG pin to last sentence of Current Limit Flag Go
  • Added text regarding TFLAG pin to first paragraph of Thermal Protection Go
  • Added R1 and R2 resistor labels to Figure 8-1, Basic Noninverting Amplifier Go
  • Changed copper plane size from 9in2 to 3in2 to match Figure 8-2 in Power Dissipation and Safe Operating Area Go
  • Changed Figure 8-4, Thermal Resistance vs Circuit Board Copper Area, to align with Thermal Information Go
  • Changed Figure 8-6, Improved Howland Current Pump, 20kΩ resistor from R4 to R3 (typo), and deleted footnoteGo
  • Added text to clarify application operation in Programmable Power Supply Go
  • Moved misplaced junction dot to correct location in Figure 8-10, Motor-Drive Circuit Go