JAJSGK9F December   2015  – May 2019 TDA2HF , TDA2HG , TDA2HV , TDA2LF , TDA2SA , TDA2SG , TDA2SX

PRODUCTION DATA.  

  1. デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 改訂履歴
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Port (VIP)
      2. 4.4.2  Display Subsystem – Video Output Ports
      3. 4.4.3  Display Subsystem – High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  External Memory Interface (EMIF)
      5. 4.4.5  General-Purpose Memory Controller (GPMC)
      6. 4.4.6  Timers
      7. 4.4.7  Inter-Integrated Circuit Interface (I2C)
      8. 4.4.8  Universal Asynchronous Receiver Transmitter (UART)
      9. 4.4.9  Multichannel Serial Peripheral Interface (McSPI)
      10. 4.4.10 Quad Serial Peripheral Interface (QSPI)
      11. 4.4.11 Multichannel Audio Serial Port (McASP)
      12. 4.4.12 Universal Serial Bus (USB)
      13. 4.4.13 SATA
      14. 4.4.14 Peripheral Component Interconnect Express (PCIe)
      15. 4.4.15 Controller Area Network Interface (DCAN)
      16. 4.4.16 Ethernet Interface (GMAC_SW)
      17. 4.4.17 eMMC/SD/SDIO
      18. 4.4.18 General-Purpose Interface (GPIO)
      19. 4.4.19 Pulse Width Modulation (PWM) Interface
      20. 4.4.20 System and Miscellaneous
        1. 4.4.20.1 Sysboot Interface
        2. 4.4.20.2 Power, Reset, and Clock Management (PRCM)
        3. 4.4.20.3 Real Time Clock (RTC) Interface
        4. 4.4.20.4 System Direct Memory Access (SDMA)
        5. 4.4.20.5 Interrupt Controllers (INTC)
        6. 4.4.20.6 Observability
        7. 4.4.20.7 Power Supplies
      21. 4.4.21 Test Interfaces
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power on Hour (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  BC1833IHHV Buffers DC Electrical Characteristics
      8. 5.7.8  USBPHY DC Electrical Characteristics
      9. 5.7.9  Dual Voltage SDIO1833 DC Electrical Characteristics
      10. 5.7.10 Dual Voltage LVCMOS DC Electrical Characteristics
      11. 5.7.11 SATAPHY DC Electrical Characteristics
      12. 5.7.12 PCIEPHY DC Electrical Characteristics
    8. 5.8 Thermal Resistance Characteristics
      1. 5.8.1 Package Thermal Characteristics
    9. 5.9 Power Supply Sequences
  6. Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
    2. 6.2 RC On-die Oscillator Clock
    3. 6.3 DPLLs, DLLs Specifications
      1. 6.3.1 DPLL Characteristics
      2. 6.3.2 DLL Characteristics
      3. 6.3.3 DPLL and DLL Noise Isolation
  7. Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem – Video Output Ports
    8. 7.8  Display Subsystem – High-Definition Multimedia Interface (HDMI)
    9. 7.9  External Memory Interface (EMIF)
    10. 7.10 General-Purpose Memory Controller (GPMC)
      1. 7.10.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.10.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.10.3 GPMC/NAND Flash Interface Asynchronous Timing
    11. 7.11 Timers
    12. 7.12 Inter-Integrated Circuit Interface (I2C)
      1. Table 7-34 Timing Requirements for I2C Input Timings
      2. Table 7-35 Timing Requirements for I2C HS-Mode (I2C3/4/5 Only)
      3. Table 7-36 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
    13. 7.13 Universal Asynchronous Receiver Transmitter (UART)
      1. Table 7-37 Timing Requirements for UART
      2. Table 7-38 Switching Characteristics Over Recommended Operating Conditions for UART
    14. 7.14 Multichannel Serial Peripheral Interface (McSPI)
    15. 7.15 Quad Serial Peripheral Interface (QSPI)
    16. 7.16 Multichannel Audio Serial Port (McASP)
      1. Table 7-45 Timing Requirements for McASP1
      2. Table 7-46 Timing Requirements for McASP2
      3. Table 7-47 Timing Requirements for McASP3/4/5/6/7/8
      4. Table 7-48 Switching Characteristics Over Recommended Operating Conditions for McASP1
      5. Table 7-49 Switching Characteristics Over Recommended Operating Conditions for McASP2
      6. Table 7-50 Switching Characteristics Over Recommended Operating Conditions for McASP3/4/5/6/7/8
    17. 7.17 Universal Serial Bus (USB)
      1. 7.17.1 USB1 DRD PHY
      2. 7.17.2 USB2 PHY
      3. 7.17.3 USB3 and USB4 DRD ULPI—SDR—Slave Mode—12-pin Mode
    18. 7.18 Serial Advanced Technology Attachment (SATA)
    19. 7.19 Peripheral Component Interconnect Express (PCIe)
    20. 7.20 Controller Area Network Interface (DCAN)
      1. Table 7-65 Timing Requirements for DCANx Receive
      2. Table 7-66 Switching Characteristics Over Recommended Operating Conditions for DCANx Transmit
    21. 7.21 Ethernet Interface (GMAC_SW)
      1. 7.21.1 GMAC MII Timings
        1. Table 7-67 Timing Requirements for miin_rxclk - MII Operation
        2. Table 7-68 Timing Requirements for miin_txclk - MII Operation
        3. Table 7-69 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
        4. Table 7-70 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
      2. 7.21.2 GMAC MDIO Interface Timings
      3. 7.21.3 GMAC RMII Timings
        1. Table 7-75 Timing Requirements for GMAC REF_CLK - RMII Operation
        2. Table 7-76 Timing Requirements for GMAC RMIIn Receive
        3. Table 7-77 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
        4. Table 7-78 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
      4. 7.21.4 GMAC RGMII Timings
        1. Table 7-82 Timing Requirements for rgmiin_rxc - RGMIIn Operation
        2. Table 7-83 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
        3. Table 7-84 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
        4. Table 7-85 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
    22. 7.22 eMMC/SD/SDIO
      1. 7.22.1 MMC1—SD Card Interface
        1. 7.22.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.22.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.22.1.3 SDR12, 4-bit data, half-cycle
        4. 7.22.1.4 SDR25, 4-bit data, half-cycle
        5. 7.22.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.22.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.22.1.7 UHS-I DDR50, 4-bit data
      2. 7.22.2 MMC2 — eMMC
        1. 7.22.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.22.2.2 High-speed JC64 SDR, 8-bit data, half cycle
        3. 7.22.2.3 High-speed HS200 JC64 SDR, 8-bit data, half cycle
        4. 7.22.2.4 High-speed JC64 DDR, 8-bit data
      3. 7.22.3 MMC3 and MMC4—SDIO/SD
        1. 7.22.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.22.3.2 MMC3 and MMC4, SD High Speed
        3. 7.22.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.22.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.22.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
    23. 7.23 General-Purpose Interface (GPIO)
    24. 7.24 System and Miscellaneous interfaces
    25. 7.25 Test Interfaces
      1. 7.25.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.25.1.1 JTAG Electrical Data/Timing
          1. Table 7-134 Timing Requirements for IEEE 1149.1 JTAG
          2. Table 7-135 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
          3. Table 7-136 Timing Requirements for IEEE 1149.1 JTAG With RTCK
          4. Table 7-137 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
      2. 7.25.2 Trace Port Interface Unit (TPIU)
        1. 7.25.2.1 TPIU PLL DDR Mode
  8. Applications, Implementation, and Layout
    1. 8.1 Introduction
      1. 8.1.1 Initial Requirements and Guidelines
    2. 8.2 Power Optimizations
      1. 8.2.1 Step 1: PCB Stack-up
      2. 8.2.2 Step 2: Physical Placement
      3. 8.2.3 Step 3: Static Analysis
        1. 8.2.3.1 PDN Resistance and IR Drop
      4. 8.2.4 Step 4: Frequency Analysis
      5. 8.2.5 System ESD Generic Guidelines
        1. 8.2.5.1 System ESD Generic PCB Guideline
        2. 8.2.5.2 Miscellaneous EMC Guidelines to Mitigate ESD Immunity
      6. 8.2.6 EMI / EMC Issues Prevention
        1. 8.2.6.1 Signal Bandwidth
        2. 8.2.6.2 Signal Routing
          1. 8.2.6.2.1 Signal Routing—Sensitive Signals and Shielding
          2. 8.2.6.2.2 Signal Routing—Outer Layer Routing
        3. 8.2.6.3 Ground Guidelines
          1. 8.2.6.3.1 PCB Outer Layers
          2. 8.2.6.3.2 Metallic Frames
          3. 8.2.6.3.3 Connectors
          4. 8.2.6.3.4 Guard Ring on PCB Edges
          5. 8.2.6.3.5 Analog and Digital Ground
    3. 8.3 Core Power Domains
      1. 8.3.1 General Constraints and Theory
      2. 8.3.2 Voltage Decoupling
      3. 8.3.3 Static PDN Analysis
      4. 8.3.4 Dynamic PDN Analysis
      5. 8.3.5 Power Supply Mapping
      6. 8.3.6 DPLL Voltage Requirement
      7. 8.3.7 Loss of Input Power Event
      8. 8.3.8 Example PCB Design
        1. 8.3.8.1 Example Stack-up
        2. 8.3.8.2 vdd_mpu Example Analysis
    4. 8.4 Single-Ended Interfaces
      1. 8.4.1 General Routing Guidelines
      2. 8.4.2 QSPI Board Design and Layout Guidelines
    5. 8.5 Differential Interfaces
      1. 8.5.1 General Routing Guidelines
      2. 8.5.2 USB 2.0 Board Design and Layout Guidelines
        1. 8.5.2.1 Background
        2. 8.5.2.2 USB PHY Layout Guide
          1. 8.5.2.2.1 General Routing and Placement
          2. 8.5.2.2.2 Specific Guidelines for USB PHY Layout
            1. 8.5.2.2.2.1  Analog, PLL, and Digital Power Supply Filtering
            2. 8.5.2.2.2.2  Analog, Digital, and PLL Partitioning
            3. 8.5.2.2.2.3  Board Stackup
            4. 8.5.2.2.2.4  Cable Connector Socket
            5. 8.5.2.2.2.5  Clock Routings
            6. 8.5.2.2.2.6  Crystals/Oscillator
            7. 8.5.2.2.2.7  DP/DM Trace
            8. 8.5.2.2.2.8  DP/DM Vias
            9. 8.5.2.2.2.9  Image Planes
            10. 8.5.2.2.2.10 JTAG Interface
            11. 8.5.2.2.2.11 Power Regulators
        3. 8.5.2.3 Electrostatic Discharge (ESD)
          1. 8.5.2.3.1 IEC ESD Stressing Test
            1. 8.5.2.3.1.1 Test Mode
            2. 8.5.2.3.1.2 Air Discharge Mode
            3. 8.5.2.3.1.3 Test Type
          2. 8.5.2.3.2 TI Component Level IEC ESD Test
          3. 8.5.2.3.3 Construction of a Custom USB Connector
          4. 8.5.2.3.4 ESD Protection System Design Consideration
        4. 8.5.2.4 References
      3. 8.5.3 USB 3.0 Board Design and Layout Guidelines
        1. 8.5.3.1 USB 3.0 interface introduction
        2. 8.5.3.2 USB 3.0 General routing rules
      4. 8.5.4 HDMI Board Design and Layout Guidelines
        1. 8.5.4.1 HDMI Interface Schematic
        2. 8.5.4.2 TMDS General Routing Guidelines
        3. 8.5.4.3 TPD5S115
        4. 8.5.4.4 HDMI ESD Protection Device (Required)
        5. 8.5.4.5 PCB Stackup Specifications
        6. 8.5.4.6 Grounding
      5. 8.5.5 SATA Board Design and Layout Guidelines
        1. 8.5.5.1 SATA Interface Schematic
        2. 8.5.5.2 Compatible SATA Components and Modes
        3. 8.5.5.3 PCB Stackup Specifications
        4. 8.5.5.4 Routing Specifications
      6. 8.5.6 PCIe Board Design and Layout Guidelines
        1. 8.5.6.1 PCIe Connections and Interface Compliance
          1. 8.5.6.1.1 Coupling Capacitors
          2. 8.5.6.1.2 Polarity Inversion
        2. 8.5.6.2 Non-standard PCIe connections
          1. 8.5.6.2.1 PCB Stackup Specifications
          2. 8.5.6.2.2 Routing Specifications
            1. 8.5.6.2.2.1 Impedance
            2. 8.5.6.2.2.2 Differential Coupling
            3. 8.5.6.2.2.3 Pair Length Matching
        3. 8.5.6.3 LJCB_REFN/P Connections
    6. 8.6 Clock Routing Guidelines
      1. 8.6.1 32-kHz Oscillator Routing
      2. 8.6.2 Oscillator Ground Connection
    7. 8.7 DDR2/DDR3 Board Design and Layout Guidelines
      1. 8.7.1 DDR2/DDR3 General Board Layout Guidelines
      2. 8.7.2 DDR2 Board Design and Layout Guidelines
        1. 8.7.2.1 Board Designs
        2. 8.7.2.2 DDR2 Interface
          1. 8.7.2.2.1  DDR2 Interface Schematic
          2. 8.7.2.2.2  Compatible JEDEC DDR2 Devices
          3. 8.7.2.2.3  PCB Stackup
          4. 8.7.2.2.4  Placement
          5. 8.7.2.2.5  DDR2 Keepout Region
          6. 8.7.2.2.6  Bulk Bypass Capacitors
          7. 8.7.2.2.7  High-Speed Bypass Capacitors
          8. 8.7.2.2.8  Net Classes
          9. 8.7.2.2.9  DDR2 Signal Termination
          10. 8.7.2.2.10 VREF Routing
        3. 8.7.2.3 DDR2 CK and ADDR_CTRL Routing
      3. 8.7.3 DDR3 Board Design and Layout Guidelines
        1. 8.7.3.1  Board Designs
          1. 8.7.3.1.1 DDR3 versus DDR2
        2. 8.7.3.2  DDR3 EMIFs
        3. 8.7.3.3  DDR3 Device Combinations
        4. 8.7.3.4  DDR3 Interface Schematic
          1. 8.7.3.4.1 32-Bit DDR3 Interface
          2. 8.7.3.4.2 16-Bit DDR3 Interface
        5. 8.7.3.5  Compatible JEDEC DDR3 Devices
        6. 8.7.3.6  PCB Stackup
        7. 8.7.3.7  Placement
        8. 8.7.3.8  DDR3 Keepout Region
        9. 8.7.3.9  Bulk Bypass Capacitors
        10. 8.7.3.10 High-Speed Bypass Capacitors
          1. 8.7.3.10.1 Return Current Bypass Capacitors
        11. 8.7.3.11 Net Classes
        12. 8.7.3.12 DDR3 Signal Termination
        13. 8.7.3.13 VREF_DDR Routing
        14. 8.7.3.14 VTT
        15. 8.7.3.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.7.3.15.1 Four DDR3 Devices
            1. 8.7.3.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.7.3.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.7.3.15.2 Two DDR3 Devices
            1. 8.7.3.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.7.3.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.7.3.15.3 One DDR3 Device
            1. 8.7.3.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.7.3.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.7.3.16 Data Topologies and Routing Definition
          1. 8.7.3.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.7.3.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.7.3.17 Routing Specification
          1. 8.7.3.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.7.3.17.2 DQS and DQ Routing Specification
  9. Device and Documentation Support
    1. 9.1 Device Nomenclature and Orderable Information
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Related Links
    5. 9.5 Community Resources
    6. 9.6 商標
    7. 9.7 静電気放電に関する注意事項
    8. 9.8 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

CK and ADDR_CTRL Routing Specification

Skew within the CK and ADDR_CTRL net classes directly reduces setup and hold margin and, thus, this skew must be controlled. The only way to practically match lengths on a PCB is to lengthen the shorter traces up to the length of the longest net in the net class and its associated clock. A metric to establish this maximum length is Manhattan distance. The Manhattan distance between two points on a PCB is the length between the points when connecting them only with horizontal or vertical segments. A reasonable trace route length is to within a percentage of its Manhattan distance. CACLM is defined as Clock Address Control Longest Manhattan distance.

Given the clock and address pin locations on the processor and the DDR3 memories, the maximum possible Manhattan distance can be determined given the placement. Figure 8-82 and Figure 8-83 show this distance for four loads and two loads, respectively. It is from this distance that the specifications on the lengths of the transmission lines for the address bus are determined. CACLM is determined similarly for other address bus configurations; that is, it is based on the longest net of the CK/ADDR_CTRL net class. For CK and ADDR_CTRL routing, these specifications are contained in Table 8-52.

TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF caclm_4_addr_sprs614.gif
It is very likely that the longest CK/ADDR_CTRL Manhattan distance will be for Address Input 8 (A8) on the DDR3 memories. CACLM is based on the longest Manhattan distance due to the device placement. Verify the net class that satisfies this criteria and use as the baseline for CK/ADDR_CTRL skew matching and length control.

The length of shorter CK/ADDR_CTRL stubs as well as the length of the terminator stub are not included in this length calculation. Non-included lengths are grayed out in the figure.

Assuming A8 is the longest, CALM = CACLMY + CACLMX + 300 mils.
The extra 300 mils allows for routing down lower than the DDR3 memories and returning up to reach A8.
Figure 8-82 CACLM for Four Address Loads on One Side of PCB
TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF caclm_2_addr_sprs614.gif
It is very likely that the longest CK/ADDR_CTRL Manhattan distance will be for Address Input 8 (A8) on the DDR3 memories. CACLM is based on the longest Manhattan distance due to the device placement. Verify the net class that satisfies this criteria and use as the baseline for CK/ADDR_CTRL skew matching and length control.

The length of shorter CK/ADDR_CTRL stubs as well as the length of the terminator stub are not included in this length calculation. Non-included lengths are grayed out in the figure.

Assuming A8 is the longest, CALM = CACLMY + CACLMX + 300 mils.
The extra 300 mils allows for routing down lower than the DDR3 memories and returning up to reach A8.
Figure 8-83 CACLM for Two Address Loads on One Side of PCB

Table 8-52 CK and ADDR_CTRL Routing Specification(2)(3)

NO. PARAMETER MIN TYP MAX UNIT
CARS31 A1+A2 length 500(1) ps
CARS32 A1+A2 skew 29 ps
CARS33 A3 length 125 ps
CARS34 A3 skew(4) 6 ps
CARS35 A3 skew(5) 6 ps
CARS36 A4 length 125 ps
CARS37 A4 skew 6 ps
CARS38 AS length 5(1) 17 ps
CARS39 AS skew 1.3(1) 14 ps
CARS310 AS+/AS- length 5 12 ps
CARS311 AS+/AS- skew 1 ps
CARS312 AT length(6) 75 ps
CARS313 AT skew(7) 14 ps
CARS314 AT skew(8) 1 ps
CARS315 CK/ADDR_CTRL trace length 1020 ps
CARS316 Vias per trace 3(1) vias
CARS317 Via count difference 1(15) vias
CARS318 Center-to-center CK to other DDR3 trace spacing(9) 4w
CARS319 Center-to-center ADDR_CTRL to other DDR3 trace spacing(9)(10) 4w
CARS320 Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing(9) 3w
CARS321 CK center-to-center spacing(11)(12)
CARS322 CK spacing to other net(9) 4w
CARS323 Rcp(13) Zo-1 Zo Zo+1 Ω
CARS324 Rtt(13)(14) Zo-5 Zo Zo+5 Ω
  1. Max value is based upon conservative signal integrity approach. This value could be extended only if detailed signal integrity analysis of rise time and fall time confirms desired operation.
  2. The use of vias should be minimized.
  3. Additional bypass capacitors are required when using the DDR_1V5 plane as the reference plane to allow the return current to jump between the DDR_1V5 plane and the ground plane when the net class switches layers at a via.
  4. Non-mirrored configuration (all DDR3 memories on same side of PCB).
  5. Mirrored configuration (one DDR3 device on top of the board and one DDR3 device on the bottom).
  6. While this length can be increased for convenience, its length should be minimized.
  7. ADDR_CTRL net class only (not CK net class). Minimizing this skew is recommended, but not required.
  8. CK net class only.
  9. Center-to-center spacing is allowed to fall to minimum 2w for up to 1250 mils of routed length.
  10. The ADDR_CTRL net class of the other DDR EMIF is considered other DDR3 trace spacing.
  11. CK spacing set to ensure proper differential impedance.
  12. The most important thing to do is control the impedance so inadvertent impedance mismatches are not created. Generally speaking, center-to-center spacing should be either 2w or slightly larger than 2w to achieve a differential impedance equal to twice the singleended impedance, Zo.
  13. Source termination (series resistor at driver) is specifically not allowed.
  14. Termination values should be uniform across the net class.
  15. Via count difference may increase by 1 only if accurate 3-D modeling of the signal flight times – including accurately modeled signal propagation through vias – has been applied to ensure all segment skew maximums are not exceeded.