SLVAF95 april   2023 TPS7H5001-SP

 

  1.   Abstract
  2.   Trademarks
  3.   Description
  4.   Features
  5.   Applications
  6. 1System Overview
    1. 1.1 Block Diagram
    2. 1.2 Design Considerations
    3. 1.3 System Design Theory
      1. 1.3.1 Switching Frequency
      2. 1.3.2 Transformer
      3. 1.3.3 RCD and Diode Clamp
      4. 1.3.4 Output Diode and MOSFET
      5. 1.3.5 Output Filter and Capacitance
      6. 1.3.6 Compensation
      7. 1.3.7 Controller Passives
  7. 2Test Results
    1. 2.1 Testing and Results
      1. 2.1.1 Test Setup
      2. 2.1.2 Test Results
        1. 2.1.2.1 Efficiency
        2. 2.1.2.2 Frequency Response
        3. 2.1.2.3 Thermal Characteristics
        4. 2.1.2.4 Output Voltage Ripple
        5. 2.1.2.5 Load Step
        6. 2.1.2.6 Start-Up
        7. 2.1.2.7 Shutdown
        8. 2.1.2.8 Component Stresses
  8. 3Design Files
    1. 3.1 Schematics
    2. 3.2 Bill of Materials
    3. 3.3 Assembly Drawings
  9. 4Related Documentation

Assembly Drawings

GUID-20230406-SS0I-GBFV-1TGH-38TKJJNFF12R-low.svg Figure 3-2 Top Overlay
GUID-20230406-SS0I-KRGF-SGGF-LHG91WXZFWLZ-low.svg Figure 3-3 Top Solder
GUID-20230406-SS0I-JXKH-VLS7-G2L5PBPBFRXC-low.svg Figure 3-4 Top Layer
GUID-20230406-SS0I-JC3K-DQLL-MBSGR2VTSQG9-low.svg Figure 3-5 Signal Layer One
GUID-20230406-SS0I-QM2Q-PDRM-GGRXJB6DVS3C-low.svg Figure 3-6 Signal Layer Two
GUID-20230406-SS0I-M2BT-VD3S-QG1TTKN5BHTL-low.svg Figure 3-7 Signal Layer Three
GUID-20230406-SS0I-VVS3-8ZQX-XS61MQT8CMJD-low.svg Figure 3-8 Signal Layer Four
GUID-20230406-SS0I-1KT6-HTLB-RRHQBTZVWFCL-low.svg Figure 3-9 Signal Layer Five
GUID-20230406-SS0I-80BG-SK7Q-MRH58QKG2XH5-low.svg Figure 3-10 Signal Layer Six
GUID-20230406-SS0I-BPXX-PLDX-2BNWHSGFRMGQ-low.svg Figure 3-11 Bottom Layer
GUID-20230406-SS0I-TWMF-LLPH-T1TNM5DWMRBT-low.svg Figure 3-12 Bottom Solder
GUID-20230406-SS0I-QMLD-HCFB-QXHNDJFQG6VW-low.svg Figure 3-13 Bottom Solder