SLAA530B March   2012  – July 2021 MSP430F5131 , MSP430F5132 , MSP430F5151 , MSP430F5152 , MSP430F5171 , MSP430F5172 , MSP430F5212 , MSP430F5214 , MSP430F5217 , MSP430F5219 , MSP430F5222 , MSP430F5224 , MSP430F5229 , MSP430F5232 , MSP430F5234 , MSP430F5237 , MSP430F5239 , MSP430F5242 , MSP430F5244 , MSP430F5247 , MSP430F5249 , MSP430F5252 , MSP430F5253 , MSP430F5254 , MSP430F5255 , MSP430F5256 , MSP430F5257 , MSP430F5258 , MSP430F5259 , MSP430F5304 , MSP430F5308 , MSP430F5309 , MSP430F5310 , MSP430F5324 , MSP430F5325 , MSP430F5326 , MSP430F5327 , MSP430F5328 , MSP430F5328-EP , MSP430F5329 , MSP430F5333 , MSP430F5335 , MSP430F5336 , MSP430F5338 , MSP430F5340 , MSP430F5341 , MSP430F5342 , MSP430F5358 , MSP430F5359 , MSP430F5418 , MSP430F5418A , MSP430F5419 , MSP430F5419A , MSP430F5435 , MSP430F5435A , MSP430F5436 , MSP430F5436A , MSP430F5437 , MSP430F5437A , MSP430F5438 , MSP430F5438A , MSP430F5438A-EP , MSP430F5500 , MSP430F5501 , MSP430F5502 , MSP430F5503 , MSP430F5504 , MSP430F5505 , MSP430F5506 , MSP430F5507 , MSP430F5508 , MSP430F5509 , MSP430F5510 , MSP430F5513 , MSP430F5514 , MSP430F5515 , MSP430F5517 , MSP430F5519 , MSP430F5521 , MSP430F5522 , MSP430F5524 , MSP430F5525 , MSP430F5526 , MSP430F5527 , MSP430F5528 , MSP430F5529 , MSP430F5630 , MSP430F5631 , MSP430F5632 , MSP430F5633 , MSP430F5634 , MSP430F5635 , MSP430F5636 , MSP430F5637 , MSP430F5638 , MSP430F5658 , MSP430F5659 , MSP430F6433 , MSP430F6435 , MSP430F6436 , MSP430F6438 , MSP430F6458 , MSP430F6459 , MSP430F6459-HIREL , MSP430F6630 , MSP430F6631 , MSP430F6632 , MSP430F6633 , MSP430F6634 , MSP430F6635 , MSP430F6636 , MSP430F6637 , MSP430F6638 , MSP430F6658 , MSP430F6659 , MSP430F6720 , MSP430F6720A , MSP430F6721 , MSP430F6721A , MSP430F6723 , MSP430F6723A , MSP430F6724 , MSP430F6724A , MSP430F6725 , MSP430F6725A , MSP430F6726 , MSP430F6726A , MSP430F6730 , MSP430F6730A , MSP430F6731 , MSP430F6731A , MSP430F6733 , MSP430F6733A , MSP430F6734 , MSP430F6734A , MSP430F6735 , MSP430F6735A , MSP430F6736 , MSP430F6736A , MSP430F6745 , MSP430F67451 , MSP430F67451A , MSP430F6745A , MSP430F6746 , MSP430F67461 , MSP430F67461A , MSP430F6746A , MSP430F6747 , MSP430F67471 , MSP430F67471A , MSP430F6747A , MSP430F6748 , MSP430F67481 , MSP430F67481A , MSP430F6748A , MSP430F6749 , MSP430F67491 , MSP430F67491A , MSP430F6749A , MSP430F67621 , MSP430F67621A , MSP430F67641 , MSP430F67641A , MSP430F6765 , MSP430F67651 , MSP430F67651A , MSP430F6765A , MSP430F6766 , MSP430F67661 , MSP430F67661A , MSP430F6766A , MSP430F6767 , MSP430F67671 , MSP430F67671A , MSP430F6767A , MSP430F6768 , MSP430F67681 , MSP430F67681A , MSP430F6768A , MSP430F6769 , MSP430F67691 , MSP430F67691A , MSP430F6769A , MSP430F6775 , MSP430F67751 , MSP430F67751A , MSP430F6775A , MSP430F6776 , MSP430F67761 , MSP430F67761A , MSP430F6776A , MSP430F6777 , MSP430F67771 , MSP430F67771A , MSP430F6777A , MSP430F6778 , MSP430F67781 , MSP430F67781A , MSP430F6778A , MSP430F6779 , MSP430F67791 , MSP430F67791A , MSP430F6779A , MSP430FR2000 , MSP430FR2032 , MSP430FR2033 , MSP430FR2100 , MSP430FR2110 , MSP430FR2111 , MSP430FR2153 , MSP430FR2155 , MSP430FR2310 , MSP430FR2311 , MSP430FR2353 , MSP430FR2355 , MSP430FR2422 , MSP430FR2433 , MSP430FR2475 , MSP430FR2476 , MSP430FR2512 , MSP430FR2522 , MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633 , MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676 , MSP430FR4131 , MSP430FR4132 , MSP430FR4133 , MSP430FR5041 , MSP430FR5043 , MSP430FR50431 , MSP430FR5720 , MSP430FR5721 , MSP430FR5722 , MSP430FR5723 , MSP430FR5724 , MSP430FR5725 , MSP430FR5726 , MSP430FR5727 , MSP430FR5728 , MSP430FR5729 , MSP430FR5730 , MSP430FR5731 , MSP430FR5732 , MSP430FR5733 , MSP430FR5734 , MSP430FR5735 , MSP430FR5736 , MSP430FR5737 , MSP430FR5738 , MSP430FR5739 , MSP430FR5739-EP , MSP430FR5847 , MSP430FR58471 , MSP430FR5848 , MSP430FR5849 , MSP430FR5857 , MSP430FR5858 , MSP430FR5859 , MSP430FR5867 , MSP430FR58671 , MSP430FR5868 , MSP430FR5869 , MSP430FR5870 , MSP430FR5872 , MSP430FR58721 , MSP430FR5887 , MSP430FR5888 , MSP430FR5889 , MSP430FR58891 , MSP430FR5922 , MSP430FR59221 , MSP430FR5947 , MSP430FR59471 , MSP430FR5948 , MSP430FR5949 , MSP430FR5957 , MSP430FR5958 , MSP430FR5959 , MSP430FR5962 , MSP430FR5964 , MSP430FR5967 , MSP430FR5968 , MSP430FR5969 , MSP430FR5969-SP , MSP430FR59691 , MSP430FR5970 , MSP430FR5972 , MSP430FR59721 , MSP430FR5986 , MSP430FR5987 , MSP430FR5988 , MSP430FR5989 , MSP430FR5989-EP , MSP430FR59891 , MSP430FR5992 , MSP430FR5994 , MSP430FR59941 , MSP430FR6005 , MSP430FR6007 , MSP430FR6035 , MSP430FR6037 , MSP430FR60371 , MSP430FR6041 , MSP430FR6043 , MSP430FR60431 , MSP430FR6045 , MSP430FR6047 , MSP430FR60471 , MSP430FR6820 , MSP430FR6822 , MSP430FR68221 , MSP430FR6870 , MSP430FR6872 , MSP430FR68721 , MSP430FR6877 , MSP430FR6879 , MSP430FR68791 , MSP430FR6887 , MSP430FR6888 , MSP430FR6889 , MSP430FR68891 , MSP430FR6920 , MSP430FR6922 , MSP430FR69221 , MSP430FR6927 , MSP430FR69271 , MSP430FR6928 , MSP430FR6970 , MSP430FR6972 , MSP430FR69721 , MSP430FR6977 , MSP430FR6979 , MSP430FR69791 , MSP430FR6987 , MSP430FR6988 , MSP430FR6989 , MSP430FR69891

 

  1.   Trademarks
  2. 1Introduction to ESD
    1. 1.1 Component-Level ESD Rating
      1. 1.1.1 Human Body Model (HBM)
      2. 1.1.2 Charged Device Model (CDM)
    2. 1.2 System-Level ESD Rating
    3. 1.3 ESD Waveforms
  3. 2General System-Level ESD Design Guidelines
    1. 2.1 Enclosures
      1. 2.1.1 Enclosure Openings
      2. 2.1.2 Enclosure Cables
    2. 2.2 PCB Design and Layout
      1. 2.2.1 Example Layout – Current Loop
    3. 2.3 On-Board ESD Protection Devices
      1. 2.3.1 Simple Passive Components
      2. 2.3.2 ESD Suppression Devices
      3. 2.3.3 ESD Protection Using Series Resistor
    4. 2.4 Circuit Design and Software Considerations
      1. 2.4.1 Circuit Design
      2. 2.4.2 Software Considerations
    5. 2.5 ESD Testing
  4. 3System Efficient ESD Design (SEED)
    1. 3.1 System-Level ESD Protection Methodology
      1. 3.1.1 On-Board Protection – Primary Clamp
      2. 3.1.2 On-Chip Protection – Secondary Clamp
      3. 3.1.3 Two-Stage Protection – Fundamental SEED Concept
    2. 3.2 SPICE Simulation Methodology for System-Level ESD Design
  5. 4SEED-Based IEC Protection Design and Verification – Real World Example 1
    1. 4.1 Modeling IEC Stress Waveform
    2. 4.2 Modeling TVS Device
    3. 4.3 Modeling MSP430 I/O Pin
    4. 4.4 Isolated Impedance Calculation
    5. 4.5 SPICE Simulation – SEED Method
    6. 4.6 Board-Level Verification
  6. 5System-Level ESD Protection – Real World Example 2
  7. 6Summary
  8. 7Modeling Using TLP Parameters
    1. 7.1 Modeling TVS Device Using TLP Parameters [8]
    2. 7.2 Modeling IC Interface Pin to be Protected Using TLP Parameters [8]
  9. 8References
  10.   Revision History

1.3 ESD Waveforms

When an electrostatically charged object is discharged, the resultant discharge current consists of a very fast edge followed by a comparatively slow bulk discharge curve. The current discharge curves associated with the different component-level ESD models (HBM, CDM) and the system level models (IEC 64000-4-2) differ significantly.

The standard HBM current waveform has a specified rise time between 2 and 10 ns, while the CDM rise time is typically in the range of 50 to 500 ps, depending on the effective device size and capacitance, and the IEC initial pulse has a rise time between 0.6 to 1 ns, while the secondary larger total energy pulse has a rise time between 10 and 20 ns. These current discharge differences are critical to the effectiveness of on-chip protection structures in terms of hardware failure or physical device damage. Most on-chip ESD protection elements are dependent on the rise time of the initial pulse for turn-on response, in addition to the total power and peak current handling capability. Thus, they can be expected to perform differently for different model stresses [2]. This implies that the on-chip ESD protection that is designed to cater to IC-level ESD standards (like HBM, CDM) cannot accommodate for ESD stress at the system level to ensure prevention of physical device damage and other system upsets; and this should be handled at the system level by the board designer or OEMs.

Also, the amount of energy in an IEC pulse is much higher than in an IC level HBM or CDM pulse, as is the peak current. In addition, the frequency spectrum is different. IEC includes high frequency components comparable to CDM, lower frequencies comparable to HBM and everything in between. Even if the exact applied IEC waveform is well defined, the waveform reaching the IC in a particular system is unknown [2] and, therefore, the functional or application ESD failure is system specific.

If the on-chip ESD protection circuitry has to accommodate for the complete system-level ESD stress, then it must be able to sink much higher energy levels at much faster transients and much higher peak currents. The resulting impact on chip size and the overall cost of the device would be less economic compared to including protection at the component or system level by the board designers and OEMs.

Figure 1-4 shows the model-specific current waveforms.

GUID-6B53A10A-E919-4F1A-8A55-BD8F758AB20A-low.png Figure 1-4 Comparison of Standard HBM, CDM, and IEC Discharge Pulses
Note:

With the rapidly advancing silicon technology, increasing data rates, and improvements in manufacturing ESD controls and awareness, the Industry Council on ESD Target Levels [15] has concluded that HBM levels of 1 kV and CDM levels of 250 V are sufficient for component-level ESD rating while still keeping ICs safe during production and assembly [9, 10]. Texas Instruments, as a member of the Industry Council on ESD Target Levels is moving towards incorporating these HBM and CDM levels.