SLUUCS1 October   2023 BQ25185

 

  1.   1
  2.   Description
  3.   Features
  4. 1Evaluation Model Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
    4. 1.4 Device Information
  5. 2Hardware
    1. 2.1 EVM Setup
    2. 2.2 EVM Connectors and Test Points
  6. 3Testing Procedures
    1. 3.1 Equipment
    2. 3.2 Charge Mode
    3. 3.3 Factory Mode Entry and Exit
  7. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 Layout
    3. 4.3 Bill of Materials
  8. 5Additional Information
    1. 5.1 Trademarks
  9. 6Revision History

Layout

Figure 4-2 through Figure 4-7 show the EVM PCB layout images.

GUID-20230720-SS0I-0FQW-HFXB-Q0NQHZW7NWWW-low.pngFigure 4-2 Top Overlay
GUID-20230720-SS0I-4BNC-TL6L-M5M6HDTMC9BW-low.pngFigure 4-4 Top Layer
GUID-20230720-SS0I-SWJB-7T6S-PW1ZXLBCHMVP-low.pngFigure 4-6 Bottom Solder
GUID-20230720-SS0I-XT3W-P2HS-XKL73CMG4LXP-low.pngFigure 4-8 Board Dimensions
GUID-20230720-SS0I-4Q5R-SWZJ-889LVSZHCNSP-low.pngFigure 4-3 Top Solder
GUID-20230720-SS0I-TMTM-535T-SGF9D4XRSZTC-low.pngFigure 4-5 Bottom Layer
GUID-20230720-SS0I-TNG2-VSRN-ZFJ1Q545GB2K-low.pngFigure 4-7 Bottom Overlay