SLUUCW9 December   2023 BQ76972

 

  1.   1
  2.   Read This First
    1.     Battery Notational Conventions
    2.     Trademarks
    3.     Glossary
  3. Introduction
  4. Device Description
    1. 2.1 Overview
    2. 2.2 Functional Block Diagram
  5. Device Configuration
    1. 3.1 Direct Commands and Subcommands
    2. 3.2 Configuration Using OTP or Registers
    3. 3.3 Data Formats
      1. 3.3.1 Unsigned Integer
      2. 3.3.2 Integer
      3. 3.3.3 Floating Point
      4. 3.3.4 Hex
  6. Measurement Subsystem
    1. 4.1  Voltage Measurement
      1. 4.1.1 Voltage Measurement Schedule
      2. 4.1.2 Usage of VC Pins for Cells Versus Interconnect
      3. 4.1.3 Cell Interconnect Resistance
    2. 4.2  General Purpose ADCIN Functionality
    3. 4.3  Coulomb Counter and Digital Filters
    4. 4.4  Synchronized Voltage and Current Measurement
    5. 4.5  Subcommands 0x0071–0x0074 DASTATUS1-4(), Cell Voltage and Synchronized Current Counts
    6. 4.6  Subcommands 0x0075–0x0077 DASTATUS5–7(), Additional Measurements
    7. 4.7  Internal Temperature Measurement
    8. 4.8  Thermistor Temperature Measurement
    9. 4.9  Factory Trim of Voltage ADC
    10. 4.10 Cell Voltage Measurement Accuracy
      1. 4.10.1 Fixed Offset Adjustment
      2. 4.10.2 Cell Offset Calibration
    11. 4.11 Voltage Calibration (ADC Measurements)
    12. 4.12 Voltage Calibration (COV and CUV Protections)
    13. 4.13 Current Calibration
    14. 4.14 Temperature Calibration
  7. Primary and Secondary Protection Subsystems
    1. 5.1 Protections Overview
    2. 5.2 Primary Protections
      1. 5.2.1  Primary Protections Overview
      2. 5.2.2  High-Side NFET Drivers
      3. 5.2.3  Protection FETs Configuration and Control
        1. 5.2.3.1 FET Configuration
        2. 5.2.3.2 FET Control
          1. 5.2.3.2.1 PRECHARGE Mode
          2. 5.2.3.2.2 PREDISCHARGE Mode
      4. 5.2.4  Cell Overvoltage Protection
      5. 5.2.5  Cell Undervoltage Protection
      6. 5.2.6  Short Circuit in Discharge Protection
      7. 5.2.7  Overcurrent in Charge Protection
      8. 5.2.8  Overcurrent in Discharge 1, 2, and 3 Protections
      9. 5.2.9  Overtemperature in Charge Protection
      10. 5.2.10 Overtemperature in Discharge Protection
      11. 5.2.11 Overtemperature FET Protection
      12. 5.2.12 Internal Overtemperature Protection
      13. 5.2.13 Undertemperature in Charge Protection
      14. 5.2.14 Undertemperature in Discharge Protection
      15. 5.2.15 Internal Undertemperature Protection
      16. 5.2.16 Host Watchdog Protection
      17. 5.2.17 Precharge Timeout Protection
      18. 5.2.18 Load Detect Functionality
    3. 5.3 Secondary Protections
      1. 5.3.1  Secondary Protections Overview
      2. 5.3.2  Copper Deposition (CUDEP) Permanent Fail
      3. 5.3.3  Safety Undervoltage (SUV) Permanent Fail
      4. 5.3.4  Safety Overvoltage (SOV) Permanent Fail
      5. 5.3.5  Safety Overcurrent in Charge (SOCC) Permanent Fail
      6. 5.3.6  Safety Overcurrent in Discharge (SOCD) Permanent Fail
      7. 5.3.7  Safety Cell Overtemperature (SOT) Permanent Fail
      8. 5.3.8  Safety FET Overtemperature (SOTF) Permanent Fail
      9. 5.3.9  Charge FET (CFETF) Permanent Fail
      10. 5.3.10 Discharge FET (DFETF) Permanent Fail
      11. 5.3.11 Secondary Protector (2LVL) Permanent Fail
      12. 5.3.12 Voltage Imbalance in Relax (VIMR) Permanent Fail
      13. 5.3.13 Voltage Imbalance in Active (VIMA) Permanent Fail
      14. 5.3.14 Short Circuit in Discharge Latched Permanent Fail
      15. 5.3.15 OTP Memory Signature Permanent Fail
      16. 5.3.16 Data ROM Memory Signature Permanent Fail
      17. 5.3.17 Instruction ROM Memory Signature Permanent Fail
      18. 5.3.18 LFO Oscillator Permanent Fail
      19. 5.3.19 Voltage Reference Permanent Fail
      20. 5.3.20 VSS Permanent Fail
      21. 5.3.21 Protection Comparator MUX Permanent Fail
      22. 5.3.22 Commanded Permanent Fail
      23. 5.3.23 Top of Stack Measurement Check
      24. 5.3.24 Cell Open Wire
  8. Device Status and Controls
    1. 6.1 0x00 Control Status() and 0x12 Battery Status() Commands
    2. 6.2 0x0070 MANU_DATA() Subcommand
    3. 6.3 LDOs
      1. 6.3.1 Preregulator Control
      2. 6.3.2 REG1 and REG2 LDO Controls
    4. 6.4 Multifunction Pin Controls
    5. 6.5 CFETOFF, DFETOFF, and BOTHOFF Pin Functionality
    6. 6.6 ALERT Pin Operation
    7. 6.7 DDSG and DCHG Pin Operation
    8. 6.8 Fuse Drive
    9. 6.9 Device Event Timing
  9. Operational Modes
    1. 7.1 Overview
    2. 7.2 NORMAL Mode
    3. 7.3 SLEEP Mode
    4. 7.4 DEEPSLEEP Mode
    5. 7.5 SHUTDOWN Mode
    6. 7.6 CONFIG_UPDATE Mode
  10. Device Security
    1. 8.1 Overview
  11. Serial Communications Interfaces
    1. 9.1 Serial Communications Overview
    2. 9.2 I2C Communications Subsystem
    3. 9.3 SPI Communications Interface
      1. 9.3.1 SPI Protocol
    4. 9.4 HDQ Communications Interface
  12. 10Cell Balancing
    1. 10.1 Cell Balancing Operation
    2. 10.2 Cell Balancing Timing
  13. 11Diagnostics
    1. 11.1 Diagnostics Overview
    2. 11.2 VREF2 Versus VREF1 Check
    3. 11.3 VSS Measurement
    4. 11.4 Top of Stack Measurement Check
    5. 11.5 LFO Oscillator Monitor
    6. 11.6 Protection Comparator Mux Check
    7. 11.7 Internal Watchdog Reset
    8. 11.8 Internal Memory Checks
  14. 12Commands and Subcommands
    1. 12.1 Direct Commands
    2. 12.2 Bitfield Definitions for Direct Commands
      1. 12.2.1  Control Status Register
      2. 12.2.2  Safety Alert A Register
      3. 12.2.3  Safety Status A Register
      4. 12.2.4  Safety Alert B Register
      5. 12.2.5  Safety Status B Register
      6. 12.2.6  Safety Alert C Register
      7. 12.2.7  Safety Status C Register
      8. 12.2.8  PF Alert A Register
      9. 12.2.9  PF Status A Register
      10. 12.2.10 PF Alert B Register
      11. 12.2.11 PF Status B Register
      12. 12.2.12 PF Alert C Register
      13. 12.2.13 PF Status C Register
      14. 12.2.14 PF Alert D Register
      15. 12.2.15 PF Status D Register
      16. 12.2.16 Battery Status Register
      17. 12.2.17 Alarm Status Register
      18. 12.2.18 Alarm Raw Status Register
      19. 12.2.19 Alarm Enable Register
      20. 12.2.20 FET Status Register
    3. 12.3 Command-Only Subcommands
    4. 12.4 Subcommands with Data
    5. 12.5 Bitfield Definitions for Subcommands
      1. 12.5.1 PF Status A Register
      2. 12.5.2 PF Status B Register
      3. 12.5.3 PF Status C Register
      4. 12.5.4 PF Status D Register
      5. 12.5.5 Manufacturing Status Register
      6. 12.5.6 FET Control Register
      7. 12.5.7 REG12 Control Register
      8. 12.5.8 OTP Write Check Result Register
      9. 12.5.9 OTP Write Result Register
  15. 13Data Memory Settings
    1. 13.1 Data Memory Access
    2. 13.2 Calibration
      1. 13.2.1  Calibration:Voltage
        1. 13.2.1.1  Calibration:Voltage:Cell 1 Gain
        2. 13.2.1.2  Calibration:Voltage:Cell 2 Gain
        3. 13.2.1.3  Calibration:Voltage:Cell 3 Gain
        4. 13.2.1.4  Calibration:Voltage:Cell 4 Gain
        5. 13.2.1.5  Calibration:Voltage:Cell 5 Gain
        6. 13.2.1.6  Calibration:Voltage:Cell 6 Gain
        7. 13.2.1.7  Calibration:Voltage:Cell 7 Gain
        8. 13.2.1.8  Calibration:Voltage:Cell 8 Gain
        9. 13.2.1.9  Calibration:Voltage:Cell 9 Gain
        10. 13.2.1.10 Calibration:Voltage:Cell 10 Gain
        11. 13.2.1.11 Calibration:Voltage:Cell 11 Gain
        12. 13.2.1.12 Calibration:Voltage:Cell 12 Gain
        13. 13.2.1.13 Calibration:Voltage:Cell 13 Gain
        14. 13.2.1.14 Calibration:Voltage:Cell 14 Gain
        15. 13.2.1.15 Calibration:Voltage:Cell 15 Gain
        16. 13.2.1.16 Calibration:Voltage:Cell 16 Gain
        17. 13.2.1.17 Calibration:Voltage:Pack Gain
        18. 13.2.1.18 Calibration:Voltage:TOS Gain
        19. 13.2.1.19 Calibration:Voltage:LD Gain
        20. 13.2.1.20 Calibration:Voltage:ADC Gain
      2. 13.2.2  Calibration:Current
        1. 13.2.2.1 Calibration:Current:CC Gain
        2. 13.2.2.2 Calibration:Current:Capacity Gain
      3. 13.2.3  Calibration:Vcell Offset
        1. 13.2.3.1 Calibration:Vcell Offset:Vcell Offset
      4. 13.2.4  Calibration:V Divider Offset
        1. 13.2.4.1 Calibration:V Divider Offset:Vdiv Offset
      5. 13.2.5  Calibration:Current Offset
        1. 13.2.5.1 Calibration:Current Offset:Coulomb Counter Offset Samples
        2. 13.2.5.2 Calibration:Current Offset:Board Offset
      6. 13.2.6  Calibration:Temperature
        1. 13.2.6.1  Calibration:Temperature:Internal Temp Offset
        2. 13.2.6.2  Calibration:Temperature:CFETOFF Temp Offset
        3. 13.2.6.3  Calibration:Temperature:DFETOFF Temp Offset
        4. 13.2.6.4  Calibration:Temperature:ALERT Temp Offset
        5. 13.2.6.5  Calibration:Temperature:TS1 Temp Offset
        6. 13.2.6.6  Calibration:Temperature:TS2 Temp Offset
        7. 13.2.6.7  Calibration:Temperature:TS3 Temp Offset
        8. 13.2.6.8  Calibration:Temperature:HDQ Temp Offset
        9. 13.2.6.9  Calibration:Temperature:DCHG Temp Offset
        10. 13.2.6.10 Calibration:Temperature:DDSG Temp Offset
      7. 13.2.7  Calibration:Internal Temp Model
        1. 13.2.7.1 Calibration:Internal Temp Model:Int Gain
        2. 13.2.7.2 Calibration:Internal Temp Model:Int base offset
        3. 13.2.7.3 Calibration:Internal Temp Model:Int Maximum AD
        4. 13.2.7.4 Calibration:Internal Temp Model:Int Maximum Temp
      8. 13.2.8  Calibration:18K Temperature Model
        1. 13.2.8.1  Calibration:18K Temperature Model:Coeff a1
        2. 13.2.8.2  Calibration:18K Temperature Model:Coeff a2
        3. 13.2.8.3  Calibration:18K Temperature Model:Coeff a3
        4. 13.2.8.4  Calibration:18K Temperature Model:Coeff a4
        5. 13.2.8.5  Calibration:18K Temperature Model:Coeff a5
        6. 13.2.8.6  Calibration:18K Temperature Model:Coeff b1
        7. 13.2.8.7  Calibration:18K Temperature Model:Coeff b2
        8. 13.2.8.8  Calibration:18K Temperature Model:Coeff b3
        9. 13.2.8.9  Calibration:18K Temperature Model:Coeff b4
        10. 13.2.8.10 Calibration:18K Temperature Model:Adc0
      9. 13.2.9  Calibration:180K Temperature Model
        1. 13.2.9.1  Calibration:180K Temperature Model:Coeff a1
        2. 13.2.9.2  Calibration:180K Temperature Model:Coeff a2
        3. 13.2.9.3  Calibration:180K Temperature Model:Coeff a3
        4. 13.2.9.4  Calibration:180K Temperature Model:Coeff a4
        5. 13.2.9.5  Calibration:180K Temperature Model:Coeff a5
        6. 13.2.9.6  Calibration:180K Temperature Model:Coeff b1
        7. 13.2.9.7  Calibration:180K Temperature Model:Coeff b2
        8. 13.2.9.8  Calibration:180K Temperature Model:Coeff b3
        9. 13.2.9.9  Calibration:180K Temperature Model:Coeff b4
        10. 13.2.9.10 Calibration:180K Temperature Model:Adc0
      10. 13.2.10 Calibration:Custom Temperature Model
        1. 13.2.10.1  Calibration:Custom Temperature Model:Coeff a1
        2. 13.2.10.2  Calibration:Custom Temperature Model:Coeff a2
        3. 13.2.10.3  Calibration:Custom Temperature Model:Coeff a3
        4. 13.2.10.4  Calibration:Custom Temperature Model:Coeff a4
        5. 13.2.10.5  Calibration:Custom Temperature Model:Coeff a5
        6. 13.2.10.6  Calibration:Custom Temperature Model:Coeff b1
        7. 13.2.10.7  Calibration:Custom Temperature Model:Coeff b2
        8. 13.2.10.8  Calibration:Custom Temperature Model:Coeff b3
        9. 13.2.10.9  Calibration:Custom Temperature Model:Coeff b4
        10. 13.2.10.10 Calibration:Custom Temperature Model:Rc0
        11. 13.2.10.11 Calibration:Custom Temperature Model:Adc0
      11. 13.2.11 Calibration:Current Deadband
        1. 13.2.11.1 Calibration:Current Deadband:Coulomb Counter Deadband
      12. 13.2.12 Calibration:CUV
        1. 13.2.12.1 Calibration:CUV:CUV Threshold Override
      13. 13.2.13 Calibration:COV
        1. 13.2.13.1 Calibration:COV:COV Threshold Override
    3. 13.3 Settings
      1. 13.3.1  Settings:Fuse
        1. 13.3.1.1 Settings:Fuse:Min Blow Fuse Voltage
        2. 13.3.1.2 Settings:Fuse:Fuse Blow Timeout
      2. 13.3.2  Settings:Configuration
        1. 13.3.2.1  Settings:Configuration:Power Config
        2. 13.3.2.2  Settings:Configuration:REG12 Config
        3. 13.3.2.3  Settings:Configuration:REG0 Config
        4. 13.3.2.4  Settings:Configuration:HWD Regulator Options
        5. 13.3.2.5  Settings:Configuration:Comm Type
        6. 13.3.2.6  Settings:Configuration:I2C Address
        7. 13.3.2.7  Settings:Configuration:SPI Configuration
        8. 13.3.2.8  Settings:Configuration:Comm Idle Time
        9. 13.3.2.9  Settings:Configuration:CFETOFF Pin Config
        10. 13.3.2.10 Settings:Configuration:DFETOFF Pin Config
        11. 13.3.2.11 Settings:Configuration:ALERT Pin Config
        12. 13.3.2.12 Settings:Configuration:TS1 Config
        13. 13.3.2.13 Settings:Configuration:TS2 Config
        14. 13.3.2.14 Settings:Configuration:TS3 Config
        15. 13.3.2.15 Settings:Configuration:HDQ Pin Config
        16. 13.3.2.16 Settings:Configuration:DCHG Pin Config
        17. 13.3.2.17 Settings:Configuration:DDSG Pin Config
        18. 13.3.2.18 Settings:Configuration:DA Configuration
        19. 13.3.2.19 Settings:Configuration:Vcell Mode
        20. 13.3.2.20 Settings:Configuration:CC3 Samples
      3. 13.3.3  Settings:Protection
        1. 13.3.3.1  Settings:Protection:Protection Configuration
        2. 13.3.3.2  Settings:Protection:Enabled Protections A
        3. 13.3.3.3  Settings:Protection:Enabled Protections B
        4. 13.3.3.4  Settings:Protection:Enabled Protections C
        5. 13.3.3.5  Settings:Protection:CHG FET Protections A
        6. 13.3.3.6  Settings:Protection:CHG FET Protections B
        7. 13.3.3.7  Settings:Protection:CHG FET Protections C
        8. 13.3.3.8  Settings:Protection:DSG FET Protections A
        9. 13.3.3.9  Settings:Protection:DSG FET Protections B
        10. 13.3.3.10 Settings:Protection:DSG FET Protections C
        11. 13.3.3.11 Settings:Protection:Body Diode Threshold
      4. 13.3.4  Settings:Alarm
        1. 13.3.4.1 Settings:Alarm:Default Alarm Mask
        2. 13.3.4.2 Settings:Alarm:SF Alert Mask A
        3. 13.3.4.3 Settings:Alarm:SF Alert Mask B
        4. 13.3.4.4 Settings:Alarm:SF Alert Mask C
        5. 13.3.4.5 Settings:Alarm:PF Alert Mask A
        6. 13.3.4.6 Settings:Alarm:PF Alert Mask B
        7. 13.3.4.7 Settings:Alarm:PF Alert Mask C
        8. 13.3.4.8 Settings:Alarm:PF Alert Mask D
      5. 13.3.5  Settings:Permanent Failure
        1. 13.3.5.1 Settings:Permanent Failure:Enabled PF A
        2. 13.3.5.2 Settings:Permanent Failure:Enabled PF B
        3. 13.3.5.3 Settings:Permanent Failure:Enabled PF C
        4. 13.3.5.4 Settings:Permanent Failure:Enabled PF D
      6. 13.3.6  Settings:FET
        1. 13.3.6.1 Settings:FET:FET Options
        2. 13.3.6.2 Settings:FET:Chg Pump Control
        3. 13.3.6.3 Settings:FET:Precharge Start Voltage
        4. 13.3.6.4 Settings:FET:Precharge Stop Voltage
        5. 13.3.6.5 Settings:FET:Predischarge Timeout
        6. 13.3.6.6 Settings:FET:Predischarge Stop Delta
      7. 13.3.7  Settings:Current Thresholds
        1. 13.3.7.1 Settings:Current Thresholds:Dsg Current Threshold
        2. 13.3.7.2 Settings:Current Thresholds:Chg Current Threshold
      8. 13.3.8  Settings:Cell Open-Wire
        1. 13.3.8.1 Settings:Cell Open-Wire:Check Time
      9. 13.3.9  Settings:Interconnect Resistances
        1. 13.3.9.1  Settings:Interconnect Resistances:Cell 1 Interconnect
        2. 13.3.9.2  Settings:Interconnect Resistances:Cell 2 Interconnect
        3. 13.3.9.3  Settings:Interconnect Resistances:Cell 3 Interconnect
        4. 13.3.9.4  Settings:Interconnect Resistances:Cell 4 Interconnect
        5. 13.3.9.5  Settings:Interconnect Resistances:Cell 5 Interconnect
        6. 13.3.9.6  Settings:Interconnect Resistances:Cell 6 Interconnect
        7. 13.3.9.7  Settings:Interconnect Resistances:Cell 7 Interconnect
        8. 13.3.9.8  Settings:Interconnect Resistances:Cell 8 Interconnect
        9. 13.3.9.9  Settings:Interconnect Resistances:Cell 9 Interconnect
        10. 13.3.9.10 Settings:Interconnect Resistances:Cell 10 Interconnect
        11. 13.3.9.11 Settings:Interconnect Resistances:Cell 11 Interconnect
        12. 13.3.9.12 Settings:Interconnect Resistances:Cell 12 Interconnect
        13. 13.3.9.13 Settings:Interconnect Resistances:Cell 13 Interconnect
        14. 13.3.9.14 Settings:Interconnect Resistances:Cell 14 Interconnect
        15. 13.3.9.15 Settings:Interconnect Resistances:Cell 15 Interconnect
        16. 13.3.9.16 Settings:Interconnect Resistances:Cell 16 Interconnect
      10. 13.3.10 Settings:Manufacturing
        1. 13.3.10.1 Settings:Manufacturing:Mfg Status Init
      11. 13.3.11 Settings:Cell Balancing Config
        1. 13.3.11.1  Settings:Cell Balancing Config:Balancing Configuration
        2. 13.3.11.2  Settings:Cell Balancing Config:Min Cell Temp
        3. 13.3.11.3  Settings:Cell Balancing Config:Max Cell Temp
        4. 13.3.11.4  Settings:Cell Balancing Config:Max Internal Temp
        5. 13.3.11.5  Settings:Cell Balancing Config:Cell Balance Interval
        6. 13.3.11.6  Settings:Cell Balancing Config:Cell Balance Max Cells
        7. 13.3.11.7  Settings:Cell Balancing Config:Cell Balance Min Cell V (Charge)
        8. 13.3.11.8  Settings:Cell Balancing Config:Cell Balance Min Delta (Charge)
        9. 13.3.11.9  Settings:Cell Balancing Config:Cell Balance Stop Delta (Charge)
        10. 13.3.11.10 Settings:Cell Balancing Config:Cell Balance Min Cell V (Relax)
        11. 13.3.11.11 Settings:Cell Balancing Config:Cell Balance Min Delta (Relax)
        12. 13.3.11.12 Settings:Cell Balancing Config:Cell Balance Stop Delta (Relax)
    4. 13.4 Power
      1. 13.4.1 Power:Shutdown
        1. 13.4.1.1 Power:Shutdown:Shutdown Cell Voltage
        2. 13.4.1.2 Power:Shutdown:Shutdown Stack Voltage
        3. 13.4.1.3 Power:Shutdown:Low V Shutdown Delay
        4. 13.4.1.4 Power:Shutdown:Shutdown Temperature
        5. 13.4.1.5 Power:Shutdown:Shutdown Temperature Delay
        6. 13.4.1.6 Power:Shutdown:FET Off Delay
        7. 13.4.1.7 Power:Shutdown:Shutdown Command Delay
        8. 13.4.1.8 Power:Shutdown:Auto Shutdown Time
        9. 13.4.1.9 Power:Shutdown:RAM Fail Shutdown Time
      2. 13.4.2 Power:Sleep
        1. 13.4.2.1 Power:Sleep:Sleep Current
        2. 13.4.2.2 Power:Sleep:Voltage Time
        3. 13.4.2.3 Power:Sleep:Wake Comparator Current
        4. 13.4.2.4 Power:Sleep:Sleep Hysteresis Time
        5. 13.4.2.5 Power:Sleep:Sleep Charger Voltage Threshold
        6. 13.4.2.6 Power:Sleep:Sleep Charger PACK-TOS Delta
    5. 13.5 System Data
      1. 13.5.1 System Data:Integrity
        1. 13.5.1.1 System Data:Integrity:Config RAM Signature
    6. 13.6 Protections
      1. 13.6.1  Protections:CUV
        1. 13.6.1.1 Protections:CUV:Threshold
        2. 13.6.1.2 Protections:CUV:Delay
        3. 13.6.1.3 Protections:CUV:Recovery Hysteresis
      2. 13.6.2  Protections:COV
        1. 13.6.2.1 Protections:COV:Threshold
        2. 13.6.2.2 Protections:COV:Delay
        3. 13.6.2.3 Protections:COV:Recovery Hysteresis
      3. 13.6.3  Protections:COVL
        1. 13.6.3.1 Protections:COVL:Latch Limit
        2. 13.6.3.2 Protections:COVL:Counter Dec Delay
        3. 13.6.3.3 Protections:COVL:Recovery Time
      4. 13.6.4  Protections:OCC
        1. 13.6.4.1 Protections:OCC:Threshold
        2. 13.6.4.2 Protections:OCC:Delay
        3. 13.6.4.3 Protections:OCC:Recovery Threshold
        4. 13.6.4.4 Protections:OCC:PACK-TOS Delta
      5. 13.6.5  Protections:OCD1
        1. 13.6.5.1 Protections:OCD1:Threshold
        2. 13.6.5.2 Protections:OCD1:Delay
      6. 13.6.6  Protections:OCD2
        1. 13.6.6.1 Protections:OCD2:Threshold
        2. 13.6.6.2 Protections:OCD2:Delay
      7. 13.6.7  Protections:SCD
        1. 13.6.7.1 Protections:SCD:Threshold
        2. 13.6.7.2 Protections:SCD:Delay
        3. 13.6.7.3 Protections:SCD:Recovery Time
      8. 13.6.8  Protections:OCD3
        1. 13.6.8.1 Protections:OCD3:Threshold
        2. 13.6.8.2 Protections:OCD3:Delay
      9. 13.6.9  Protections:OCD
        1. 13.6.9.1 Protections:OCD:Recovery Threshold
      10. 13.6.10 Protections:OCDL
        1. 13.6.10.1 Protections:OCDL:Latch Limit
        2. 13.6.10.2 Protections:OCDL:Counter Dec Delay
        3. 13.6.10.3 Protections:OCDL:Recovery Time
        4. 13.6.10.4 Protections:OCDL:Recovery Threshold
      11. 13.6.11 Protections:SCDL
        1. 13.6.11.1 Protections:SCDL:Latch Limit
        2. 13.6.11.2 Protections:SCDL:Counter Dec Delay
        3. 13.6.11.3 Protections:SCDL:Recovery Time
        4. 13.6.11.4 Protections:SCDL:Recovery Threshold
      12. 13.6.12 Protections:OTC
        1. 13.6.12.1 Protections:OTC:Threshold
        2. 13.6.12.2 Protections:OTC:Delay
        3. 13.6.12.3 Protections:OTC:Recovery
      13. 13.6.13 Protections:OTD
        1. 13.6.13.1 Protections:OTD:Threshold
        2. 13.6.13.2 Protections:OTD:Delay
        3. 13.6.13.3 Protections:OTD:Recovery
      14. 13.6.14 Protections:OTF
        1. 13.6.14.1 Protections:OTF:Threshold
        2. 13.6.14.2 Protections:OTF:Delay
        3. 13.6.14.3 Protections:OTF:Recovery
      15. 13.6.15 Protections:OTINT
        1. 13.6.15.1 Protections:OTINT:Threshold
        2. 13.6.15.2 Protections:OTINT:Delay
        3. 13.6.15.3 Protections:OTINT:Recovery
      16. 13.6.16 Protections:UTC
        1. 13.6.16.1 Protections:UTC:Threshold
        2. 13.6.16.2 Protections:UTC:Delay
        3. 13.6.16.3 Protections:UTC:Recovery
      17. 13.6.17 Protections:UTD
        1. 13.6.17.1 Protections:UTD:Threshold
        2. 13.6.17.2 Protections:UTD:Delay
        3. 13.6.17.3 Protections:UTD:Recovery
      18. 13.6.18 Protections:UTINT
        1. 13.6.18.1 Protections:UTINT:Threshold
        2. 13.6.18.2 Protections:UTINT:Delay
        3. 13.6.18.3 Protections:UTINT:Recovery
      19. 13.6.19 Protections:Recovery
        1. 13.6.19.1 Protections:Recovery:Time
      20. 13.6.20 Protections:HWD
        1. 13.6.20.1 Protections:HWD:Delay
      21. 13.6.21 Protections:Load Detect
        1. 13.6.21.1 Protections:Load Detect:Active Time
        2. 13.6.21.2 Protections:Load Detect:Retry Delay
        3. 13.6.21.3 Protections:Load Detect:Timeout
      22. 13.6.22 Protections:PTO
        1. 13.6.22.1 Protections:PTO:Charge Threshold
        2. 13.6.22.2 Protections:PTO:Delay
        3. 13.6.22.3 Protections:PTO:Reset
    7. 13.7 Permanent Fail
      1. 13.7.1  Permanent Fail:CUDEP
        1. 13.7.1.1 Permanent Fail:CUDEP:Threshold
        2. 13.7.1.2 Permanent Fail:CUDEP:Delay
      2. 13.7.2  Permanent Fail:SUV
        1. 13.7.2.1 Permanent Fail:SUV:Threshold
        2. 13.7.2.2 Permanent Fail:SUV:Delay
      3. 13.7.3  Permanent Fail:SOV
        1. 13.7.3.1 Permanent Fail:SOV:Threshold
        2. 13.7.3.2 Permanent Fail:SOV:Delay
      4. 13.7.4  Permanent Fail:TOS
        1. 13.7.4.1 Permanent Fail:TOS:Threshold
        2. 13.7.4.2 Permanent Fail:TOS:Delay
      5. 13.7.5  Permanent Fail:SOCC
        1. 13.7.5.1 Permanent Fail:SOCC:Threshold
        2. 13.7.5.2 Permanent Fail:SOCC:Delay
      6. 13.7.6  Permanent Fail:SOCD
        1. 13.7.6.1 Permanent Fail:SOCD:Threshold
        2. 13.7.6.2 Permanent Fail:SOCD:Delay
      7. 13.7.7  Permanent Fail:SOT
        1. 13.7.7.1 Permanent Fail:SOT:Threshold
        2. 13.7.7.2 Permanent Fail:SOT:Delay
      8. 13.7.8  Permanent Fail:SOTF
        1. 13.7.8.1 Permanent Fail:SOTF:Threshold
        2. 13.7.8.2 Permanent Fail:SOTF:Delay
      9. 13.7.9  Permanent Fail:VIMR
        1. 13.7.9.1 Permanent Fail:VIMR:Check Voltage
        2. 13.7.9.2 Permanent Fail:VIMR:Max Relax Current
        3. 13.7.9.3 Permanent Fail:VIMR:Threshold
        4. 13.7.9.4 Permanent Fail:VIMR:Delay
        5. 13.7.9.5 Permanent Fail:VIMR:Relax Min Duration
      10. 13.7.10 Permanent Fail:VIMA
        1. 13.7.10.1 Permanent Fail:VIMA:Check Voltage
        2. 13.7.10.2 Permanent Fail:VIMA:Min Active Current
        3. 13.7.10.3 Permanent Fail:VIMA:Threshold
        4. 13.7.10.4 Permanent Fail:VIMA:Delay
      11. 13.7.11 Permanent Fail:CFETF
        1. 13.7.11.1 Permanent Fail:CFETF:OFF Threshold
        2. 13.7.11.2 Permanent Fail:CFETF:OFF Delay
      12. 13.7.12 Permanent Fail:DFETF
        1. 13.7.12.1 Permanent Fail:DFETF:OFF Threshold
        2. 13.7.12.2 Permanent Fail:DFETF:OFF Delay
      13. 13.7.13 Permanent Fail:VSSF
        1. 13.7.13.1 Permanent Fail:VSSF:Fail Threshold
        2. 13.7.13.2 Permanent Fail:VSSF:Delay
      14. 13.7.14 Permanent Fail:2LVL
        1. 13.7.14.1 Permanent Fail:2LVL:Delay
      15. 13.7.15 Permanent Fail:LFOF
        1. 13.7.15.1 Permanent Fail:LFOF:Delay
      16. 13.7.16 Permanent Fail:HWMX
        1. 13.7.16.1 Permanent Fail:HWMX:Delay
    8. 13.8 Security
      1. 13.8.1 Security:Settings
        1. 13.8.1.1 Security:Settings:Security Settings
      2. 13.8.2 Security:Keys
        1. 13.8.2.1 Security:Keys:Unseal Key Step 1
        2. 13.8.2.2 Security:Keys:Unseal Key Step 2
        3. 13.8.2.3 Security:Keys:Full Access Key Step 1
        4. 13.8.2.4 Security:Keys:Full Access Key Step 2
    9. 13.9 Data Memory Summary
  16. 14Revision History

SPI Protocol

The first byte of a SPI transaction consists of an R/W bit (R=0, W=1), followed by a 7-bit address, MSBfirst. If the controller (host) is writing, then the second byte is the data to be written. If the controller is reading, then the second byte sent on SPI_MOSI is ignored (except for CRC calculation).

If CRC is enabled, then the controller must send as the third byte the 8-bit CRC code, which is calculated over the first two bytes. If the CRC is correct, then the values clocked in are put into the incoming buffer. If the CRC is not correct, then the outgoing buffer is set to 0xFFFF, and the outgoing CRC is set to 0xAA (these are clocked out on the next transaction).

During this transaction, the logic clocks out the contents of the outgoing buffer. If the outgoing buffer has not been updated since the last transaction, then the logic clocks out 0xFFFF, and if the CRC is clocked, it clocks out 0x00 for the CRC (if enabled). Thus, the 0xFFFF00 indicates to the controller that the outgoing buffer was not updated by the internal logic before the transaction occurred. This can occur when the device did not have sufficient time to update the buffer between consecutive transactions.

When the internal logic takes the write-data from the interface logic and processes it, it also causes the R/W bit, address, and data to be copied into the outgoing buffer. On the next transaction, this data is clocked back to the controller.

When the controller is initiating a read, the internal logic places the R/W bit and address into the outgoing buffer, along with the data requested. The interface computes the CRC on the two bytes in the outgoing buffer and clocks that back to the controller if CRC is enabled (with the exceptions associated with 0xFFFF as noted above). A diagram of three transaction sequences with and without CRC are shown below, using CPOL=0.

GUID-1CFAAAD2-9F20-413B-9F01-9215E3F56FFA-low.svgFigure 9-5 SPI Transaction #1 Using CRC
GUID-A363F294-F9F2-4C82-8623-EC7E2DB09C19-low.svgFigure 9-6 SPI Transaction #2 Using CRC
GUID-FEE5EBAD-CB3D-4C09-82D8-CD6ACF8EE917-low.svgFigure 9-7 SPI Transaction #3 Using CRC
GUID-0F02F018-E9DF-4C5B-B00B-99288707B8D1-low.svgFigure 9-8 SPI Transaction #1 Without CRC
GUID-702C6744-F7E4-43E8-91D1-8EB5D4EECCC0-low.svgFigure 9-9 SPI Transaction #2 Without CRC
GUID-C360A8EC-5CDE-45AE-887D-CE80D4585750-low.svgFigure 9-10 SPI Transaction #3 Without CRC

The time required for the device to process commands and subcommands differs based on the specifics of each. For example, when the 0x0071 DASTATUS1() subcommand is sent, the device requires approximately 200 μs to load the 32-byte data into the internal subcommand buffer. If the host provides sufficient time for this load to complete before beginning to read the buffer (readback from addresses 0x40 to 0x5F), the device responds with valid data, rather than 0xFFFF00. When data has already been loaded into the subcommand buffer, this data can be read back with approximately 50-μs interval between SPI transactions.

Note: Some commands or subcommands can take longer than 200 μs to complete. One exception is the IROM_SIG() subcommand, which takes approximately 9 ms to complete.

The host software should incorporate a scheme to retry transactions that are not successful. For example, if the device returns 0xFFFFFF on SPI_MISO, then the internal clock was not powered, and the transaction needs to be retried. Similarly, if the device returns 0xFFFFAA on a transaction, this indicates the previous transaction encountered a CRC error, and so the previous transaction must be retried. And as described above, if the device returns 0xFFFF00, then the previous transaction had not completed when the present transaction was sent, which might mean the previous transaction should be retried, or at least needs more time to complete.

The approximate time required to complete an operation based on the particular command or subcommand is shown below. Note that these times are only approximate and can vary depending on system operation at the time. Therefore, it is important that the host processor incorporate a retry scheme from the host processor, to handle communications errors or delays that occur during operation.

Table 9-2 Command/Subcommand Operation Time
Command/Subcommand Address Command/Subcommand Name Time to Complete Operation (Approximate)
0x00 Control Status() 50 μs
0x02 - 0x07 Safety Alert() and Safety Status() 50 μs
0x0A-0x11 PF Alert() and PF Status() 50 μs
0x12 Battery Status() 50 μs
0x14-0x32 Cell Voltages() 50 μs
0x34 Stack Voltage() 50 μs
0x36 PACK Pin Voltage() 50 μs
0x38 LD Pin Voltage() 50 μs
0x3A CC2 Current() 50 μs
0x62 Alarm Status() 50 μs
0x64 Alarm Raw Status() 50 μs
0x66 Alarm Enable() 50 μs
0x68 Internal Temperature() 50 μs
0x6A-0x7A Thermistor Temperatures() 50 μs
0x0001 DEVICE_NUMBER() 400 μs
0x0002 FW_VERSION() 400 μs
0x0003 HW_VERSION() 400 μs
0x0004 IROM_SIG() 8500 μs
0x0005 STATIC_CFG_SIG() 450 μs
0x0009 DROM_SIG() 650 μs
0x000E EXIT_DEEPSLEEP() 500 μs
0x000F DEEPSLEEP() 500 μs
0x0010 SHUTDOWN() 500 μs
0x001C PDSGTEST() 550 μs
0x001D FUSE_TOGGLE() 500 μs
0x001E PCHGTEST() 900 μs
0x001F CHGTEST() 550 μs
0x0020 DSGTEST() 550 μs
0x0022 FET_ENABLE() 500 μs
0x0024 PF_ENABLE() 500 μs
0x0030 SEAL() 500 μs
0x0053 SAVED_PF_STATUS() 500 μs
0x0057 MANUFACTURING STATUS() 605 μs
0x0070 MANU_DATA() 660 μs
0x0071 - 0x0077 DASTATUS1-7() 660 μs
0x0080 CUV_SNAPSHOT() 660 μs
0x0081 COV_SNAPSHOT() 660 μs
0x0082 RESET_PASSQ() 600 μs
0x0083 CB_ACTIVE_CELLS() 560 μs
0x0084 CB_SET_LVL() 480 μs
0x0085 - 0x0087 CBSTATUS1-3() 575 μs
0x008A PTO_RECOVER() 500 μs
0x0090 SET_CFGUPDATE() 2000 μs
0x0092 EXIT_CFGUPDATE() 1000 μs
0x0093 DSG_PDSG_OFF() 550 μs
0x0094 CHG_PCHG_OFF() 550 μs
0x0095 ALL_FETS_OFF() 550 μs
0x0096 ALL_FETS_ON() 500 μs
0x0097 FET_CONTROL() 495 μs
0x0098 REG12_CONTROL() 450 μs
0x0099 SLEEP_ENABLE() 500 μs
0x009A SLEEP_DISABLE() 500 μs
0x009B OCDL_RECOVER() 500 μs
0x009C SCDL_RECOVER() 500 μs
0x009D LOAD_DETECT_RESTART() 500 μs
0x009E LOAD_DETECT_ON() 500 μs
0x009F LOAD_DETECT_OFF() 500 μs
0x00A0 OTP_WR_CHECK() 580 μs
0x2800 - 0x2818 GPO HI and LO Subcommands 500 μs
0x2857 PF_FORCE_A() 500 μs
0x29A3 PF_FORCE_B() 800 μs
0x29BC SWAP_COMM_MODE() 500 μs
0x29E7 SWAP_TO_I2C() 500 μs
0x7C35 SWAP_TO_SPI() 500 μs
0x7C40 SWAP_TO_HDQ() 500 μs
0xF081 READ_CAL1() 630 μs