SLYY193C january   2023  – april 2023 LMQ61460-Q1 , TPS54319 , TPS62088 , TPS82671 , UCC12040 , UCC12050

 

  1.   At a glance
  2.   Authors
  3.   3
  4.   What is power density?
  5.   What limits power density?
  6.   What limits power density: switching losses
  7.   Key limiting factor No. 1: charge-related losses
  8.   Key limiting factor No. 2: reverse-recovery losses
  9.   Key limiting factor No. 3: turn-on and turn-off losses
  10.   What limits power density: thermal performance
  11.   How to break through power density barriers
  12.   Switching loss innovations
  13.   Package thermal innovations
  14.   Advanced circuit design innovations
  15.   Integration innovations
  16.   Conclusion
  17.   Additional resources

Conclusion

The trend toward higher power density is clear. There are major limitations to achieving the more compact power solutions. Overcoming power losses and thermal performance challenges requires innovations in switching properties, IC packaging, circuit design and integration. Each of these puzzle pieces by itself provides significant improvement opportunities in power density, yet each technique is orthogonal from each other. As a result, you can obtain a distinct improvement in power density by combining technologies from each category.

Imagine a product with the best switching device FoMs and industry-leading package thermal capability, using multilevel topologies with the lowest loop inductance through passive integration. The technological advancements play off of each other and result in power density breakthroughs.

Achieving more power in smaller spaces, and enhancing system functionality at reduced system costs, are now possible using TI’s advanced process, packaging and circuit-design technologies. To learn more, see ti.com/powerdensity.