AM263x or AM263Px should be co-located with the 1.2 V core digital regulator to allow for minimal IR drop from the regulator to the BGA power pins.
Wide 15 mil traces should be used for all power and ground return via fan-out.
A dedicated power layer, with tightly coupled ground return reference plane should be used for best transient performance and EMI coupling
A wide power plane entry into the center of the BGA 1.2 V power pin areas should be used for minimal IR drop and best transient performance
Larger packaged, lower-frequency, bulk capacitance should be placed adjacent to the BGA with vias directly to power plane paths
Smaller packaged, higher-frequency decoupling capacitance should be placed directly on BGA fan-out vias with as small of a dog-bone to power and ground return vias as possible
Figure 12-3 AM263x controlCARD Excerpt – 1.2 V Core Power Output, Power Plane Vias and BGA Vias
Figure 12-4 AM263x controlCARD Excerpt – 1.2 V Core Power Plane, Layer 5
Figure 12-5 AM263x controlCARD Excerpt – 1.2 V Core Power Decoupling Mounting, Layer 10
Figure 12-6 AM263x controlCARD Excerpt – 1.2 V Core Power Decoupling Mounting, Layer 10