SPRABJ8B September   2022  – November 2023 AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4 , AM263P4-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Acronyms
  5. 2 Power
    1. 2.1 Discrete DC-DC Power Solution
    2. 2.2 Integrated PMIC Power Solution
    3. 2.3 Power Decoupling and Filtering
    4. 2.4 Power Consumption
    5. 2.5 Power Distribution Network
      1. 2.5.1 Simulations
        1. 2.5.1.1 Core Digital Power 1.2 V
        2. 2.5.1.2 Digital/Analog I/O Power 3.3 V
    6. 2.6 e-Fuse Power
  6. 3 Clocking
    1. 3.1 Crystal and Oscillator Input Options
    2. 3.2 Output Clock Generation
    3. 3.3 Crystal Selection and Shunt Capacitance
    4. 3.4 Crystal Placement and Routing
  7. 4 Resets
  8. 5 Bootstrapping
    1. 5.1 SOP Signal Implementation
    2. 5.2 OSPI/QSPI Memory Implementation
    3. 5.3 ROM OSPI/QSPI Boot Requirements
  9. 6 JTAG Emulators and Trace
  10. 7 Multiplexed Peripherals
  11. 8 Digital Peripherals
    1. 8.1 General Digital Peripheral Routing Guidelines
  12. 9 Analog Peripherals
    1. 9.1 General Analog Peripheral Routing Guidelines
      1. 9.1.1 Resolver ADC Routing Guidelines
  13. 10Layer Stackup
    1. 10.1 Key Stackup Features
  14. 11Vias
  15. 12BGA Power Fan-Out and Decoupling Placement
    1. 12.1 Ground Return
    2. 12.2 1.2 V Core Digital Power
      1. 12.2.1 Key Layout Considerations
    3. 12.3 3.3 V Digital and Analog Power
      1. 12.3.1 Key Layout Considerations
    4. 12.4 1.8 V Digital and Analog Power
      1. 12.4.1 Key Layout Considerations
  16. 13References
  17.   Revision History

10 Layer Stackup

The AM263x and AM263Px MCUs are packaged in a ZCZ0324A 324 ball, 0.8mm pitch, 18 x 18 full NFBGA array [1][4]. The larger pitch on this package allows for a low layer count power and full signal fan-out. In the case of the LP-AM263 EVM, a 6-layer stackup design was able to fully route all power and signal pins across the device for the LaunchPad form-factor of boards.

Lower layer count stackup are likely possible, especially when considering partial signal fan-out designs. However, these have not yet been explored by TI at this time. The LP-AM263 LaunchPad EVM represents the most optimized stackup example at this time, so the LaunchPad is referenced in this section.

GUID-20220808-SS0I-BBLJ-QFQN-LWCTNX10TR45-low.png Figure 10-1 LP-AM263 Stackup