SPRAD05B May   2023  – December 2023 AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Before Getting Started With the Board Design
    2. 1.2 Processor Selection
      1. 1.2.1 Note on AM625SIP Data Sheet
      2. 1.2.2 AM625 and AM625SIP Board Design Compatibility
    3. 1.3 Technical Documentation
    4. 1.4 Design Documentation
  5. 2 Block Diagram
    1. 2.1 Constructing the Block Diagram
    2. 2.2 Selecting the Boot Mode
    3. 2.3 Confirming Pinmux (Multiplexing Compatibility)
  6. 3 Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power
      2. 3.1.2 Discrete Power
    2. 3.2 Power (Supply) Rails
      1. 3.2.1 Core Supply
      2. 3.2.2 Peripheral Power Supply
      3. 3.2.3 DDR PHY and SDRAM Power Supply
        1. 3.2.3.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
        2. 3.2.3.2 AM625SIP
      4. 3.2.4 Internal LDOs for IO Groups (Processor IO Groups)
      5. 3.2.5 Dual-Voltage IOs (Processor IOs)
      6. 3.2.6 Dual-Voltage Dynamic Switching IOs
      7. 3.2.7 VPP (eFuse ROM programming supply)
    3. 3.3 Determining Board Power Requirements
    4. 3.4 Power Supply Filters
    5. 3.5 Power Supply Decoupling and Bulk Capacitors
      1. 3.5.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
      2. 3.5.2 AM625SIP
      3. 3.5.3 Note on PDN target impedance
    6. 3.6 Power Supply Sequencing
    7. 3.7 Supply Diagnostics
    8. 3.8 Power Supply Monitoring
  7. 4 Clocking
    1. 4.1 Processor Clock Inputs
      1. 4.1.1 Unused WKUP_LFOSC0
      2. 4.1.2 LVCMOS Digital Clock Source
      3. 4.1.3 Crystal Selection
    2. 4.2 Clock Outputs
  8. 5 JTAG (Joint Test Action Group)
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
        1. 5.1.1.1 AM625 / AM623
        2. 5.1.1.2 AM625-Q1 / AM620-Q1
        3. 5.1.1.3 AM625SIP
      2. 5.1.2 Implementation of JTAG / Emulation
      3. 5.1.3 Connection of JTAG Interface Signals
  9. 6 Configuration (Processor) and Initialization (Processor and Device)
    1. 6.1 Processor Reset
    2. 6.2 Latching of Boot Mode Configuration
    3. 6.3 Resetting the Attached Devices
    4. 6.4 Watchdog Timer
  10. 7 Processor Peripherals
    1. 7.1  Selecting Peripherals Across Domains
    2. 7.2  Memory (DDRSS)
      1. 7.2.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
        1. 7.2.1.1 Processor DDR Subsystem and Device Register Configuration
        2. 7.2.1.2 Calibration Resistor Connection
      2. 7.2.2 AM625SIP
        1. 7.2.2.1 Reassigned DDRSS0 Pins on the AMK Package
        2. 7.2.2.2 Calibration Resistors Connection
    3. 7.3  Media and Data Storage Interfaces
    4. 7.4  Ethernet Interface Using Common Platform Ethernet Switch 3-port Gigabit (CPSW3G)
    5. 7.5  Programmable Real-Time Unit Subsystem (PRUSS)
    6. 7.6  Universal Serial Bus (USB) Subsystem
    7. 7.7  General Connectivity Peripherals
    8. 7.8  Display Subsystem (DSS)
      1. 7.8.1 AM625 / AM623 / AM625SIP / AM625-Q1
      2. 7.8.2 AM620-Q1
    9. 7.9  Camera Subsystem (CSI)
    10. 7.10 Connection of Processor Power Pins, Unused Peripherals and IOs
      1. 7.10.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
      2. 7.10.2 AM625SIP
      3. 7.10.3 External Interrupt (EXTINTn)
      4. 7.10.4 Reserved Pins (Signals)
  11. 8 Interfacing of Processor IOs ( LVCMOS or Open-Drain or Fail-Safe Type IO Buffers) and Simulations
    1. 8.1 AM625 / AM623
    2. 8.2 AM625-Q1 / AM620-Q1
    3. 8.3 AM625SIP
  12. 9 Power Consumption and Thermal Analysis
    1. 9.1 Power Consumption
    2. 9.2 Maximum Current for Different Supply Rails
    3. 9.3 Power Modes
    4. 9.4 Thermal Design Guidelines
      1. 9.4.1 AM625 / AM623
      2. 9.4.2 AM625-Q1 / AM620-Q1
      3. 9.4.3 AM625SIP
  13. 10Schematic Design, Capture and Review
    1. 10.1 Selection of Components and Values
    2. 10.2 Schematic Design and Capture
    3. 10.3 Schematics Review
  14. 11Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
    1. 11.1 Escape Routing for PCB Design
    2. 11.2 DDR Design and Layout Guidelines
      1. 11.2.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
      2. 11.2.2 AM625SIP
    3. 11.3 High-Speed Differential Signal Routing Guidelines
    4. 11.4 Board Layer Count and Stack-up
      1. 11.4.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
      2. 11.4.2 AM625SIP
      3. 11.4.3 Simulation Recommendations
    5. 11.5 Reference for the Steps to be Followed for Running Simulation
  15. 12Device Handling and Assembly
    1. 12.1 Soldering Recommendations
      1. 12.1.1 Additional References
  16. 13References
    1. 13.1 AM625SIP
    2. 13.2 AM625 / AM623
    3. 13.3 AM625-Q1 / AM620-Q1
    4. 13.4 AM625 / AM623 / AM625-Q1 / AM620-Q1
    5. 13.5 Common for all AM62x family of processors
  17. 14Terminology
  18. 15Revision History

3.2.5 Dual-Voltage IOs (Processor IOs)

The processor includes nine Dual-voltage IO domains (VDDSHVx [x=0-6], VDDSHV_MCU and VDDSHV_CANUART), where each domain provides power to a fixed set of IOs. Each IO domain can be configured for 3.3 V or 1.8 V, which determines a common operating voltage for the entire set of IOs powered by the respective IO domain. All signals (attached devices) connected to these IO domains must be powered from the same power source that is being used to power the respective processor Dual-voltage IO domains (VDDSHVx supply rail). Most of the processor IOs are not fail-safe. For information on fail-safe IOs, see the device-specific data sheet. A valid supply voltage for the VDDSHVx supplies must be present before any input is applied to the associated peripherals or IOs.

IO grouping information is summarized below:

VDDSHV0 – Voltage for the General IO group

VDDSHV1 – Voltage for the Flash IO group

VDDSHV2 – Voltage for the GEMAC IO group

VDDSHV3 – Voltage for the GPMC IO group

VDDSHV4 – Voltage for the MMC0 IO group

VDDSHV5 – Voltage for the MMC1 IO group

VDDSHV6 – Voltage for the MMC2 IO group

VDDSHV_MCU – Voltage for the WKUP_MCU IO group

VDDSHV_CANUART – Voltage for the CANUART IO group