Product details

Technology family F Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 64 Supply current (max) (µA) 90000 IOH (max) (mA) -15 Input type Bipolar Output type 3-State Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) 0 to 70
Technology family F Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 64 Supply current (max) (µA) 90000 IOH (max) (mA) -15 Input type Bipolar Output type 3-State Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) 0 to 70
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3 SOP (NS) 20 98.28 mm² 12.6 x 7.8 SSOP (DB) 20 56.16 mm² 7.2 x 7.8
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´F240 and ´F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.

The ´F244 is organized as two 4-bit buffers/line drivers with separate output enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C.

 

 

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´F240 and ´F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.

The ´F244 is organized as two 4-bit buffers/line drivers with separate output enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C.

 

 

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
SN74HC244 ACTIVE 8-ch, 2-V to 6-V buffers with 3-state outputs Voltage range (2V to 6V), average drive strength (8mA), average propagation delay (20ns)

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 9
Type Title Date
* Data sheet Octal Buffers/Drivers With 3-State Outputs datasheet (Rev. A) 01 Oct 1993
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Simulation model

SN74F244 Behavioral SPICE Model

SDFM024.ZIP (7 KB) - PSpice Model
Simulation model

SN74F244 IBIS Model (Rev. A)

SDFM008A.ZIP (6 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
PDIP (N) 20 Ultra Librarian
SOIC (DW) 20 Ultra Librarian
SOP (NS) 20 Ultra Librarian
SSOP (DB) 20 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos