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Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
COG (NBP) 56 42.88726 mm² 5.321 x 8.06
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

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Typ Titel Datum
* Data sheet OPT8320 3D Time-of-Flight Sensor (Short) datasheet 24 Apr 2018
E-book Ein Techniker-Leitfaden für Industrieroboter-Designs 25 Mär 2020
EVM User's guide OPT8320-CDK-EVM User's Guide (Rev. A) 02 Feb 2017
Application note Sensor Optics Selection Guide for 3D ToF Camera Systems PDF | HTML 22 Jul 2016
White paper Filtering for 3D Time-of-Flight Sensors 21 Jan 2016
Design guide Introduction to Time-of-Flight (ToF) System Design (Rev. D) 13 Mai 2014
White paper Introduction to Time-of-Flight Camera (Rev. B) 07 Mai 2014

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

OPT8320 IBIS Model

SBAM256.ZIP (88 KB) - IBIS Model
Berechnungstool

SBAC124 3D ToF System Estimator Tool

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COG (NBP) 56 Optionen anzeigen

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