SN74AVC2T45

AKTIV

Bus-Transceiver, zwei Bit, zwei Versorgungsspannungen, mit konfigurierbarer Spannungsumsetzung und T

Eine neuere Version dieses Produkts ist verfügbar

Drop-In-Ersatz mit verbesserter Funktionalität im Gegensatz zum verglichenen Baustein
SN74AXC2T45 AKTIV Doppel-Bit-Doppel-Supply-Bus-Transceiver mit konfigurierbarer Spannungsumsetzung Pin-to-pin upgrade with a wider voltage range and improved performance

Produktdetails

Technology family AVC Applications I2S Bits (#) 2 High input voltage (min) (V) 0.78 High input voltage (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 3.6 Data rate (max) (Mbps) 500 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 20 Features Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AVC Applications I2S Bits (#) 2 High input voltage (min) (V) 0.78 High input voltage (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 3.6 Data rate (max) (Mbps) 500 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 20 Features Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 SSOP (DCT) 8 11.8 mm² 2.95 x 4 VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • Available in the Texas Instruments NanoFree™ Package
  • VCC Isolation Feature: If Either VCC Input Is at GND, Both Ports Are in the High-Impedance State
  • Dual Supply Rail Design
  • I/Os Are 4.6-V Over Voltage Tolerant
  • Ioff Supports Partial-Power-Down Mode Operation
  • Max Data Rates
    • 500 Mbps (1.8 V to 3.3 V)
    • 320 Mbps (<1.8 V to 3.3 V )
    • 320 Mbps (Level-Shifting to 2.5 V or 1.8 V)
    • 280 Mbps (Level-Shifting to 1.5 V)
    • 240 Mbps (Level-Shifting to 1.2 V)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
  • Available in the Texas Instruments NanoFree™ Package
  • VCC Isolation Feature: If Either VCC Input Is at GND, Both Ports Are in the High-Impedance State
  • Dual Supply Rail Design
  • I/Os Are 4.6-V Over Voltage Tolerant
  • Ioff Supports Partial-Power-Down Mode Operation
  • Max Data Rates
    • 500 Mbps (1.8 V to 3.3 V)
    • 320 Mbps (<1.8 V to 3.3 V )
    • 320 Mbps (Level-Shifting to 2.5 V or 1.8 V)
    • 280 Mbps (Level-Shifting to 1.5 V)
    • 240 Mbps (Level-Shifting to 1.2 V)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22

This 2-bit non-inverting bus transceiver uses two separate configurable power-supply rails. The A ports are designed to track VCCA and accepts any supply voltage from 1.2 V to 3.6 V. The B ports are designed to track VCCB and accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation and level-shifting between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.

The SN74AVC2T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR pin) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess leakage current on the internal CMOS structure.

This 2-bit non-inverting bus transceiver uses two separate configurable power-supply rails. The A ports are designed to track VCCA and accepts any supply voltage from 1.2 V to 3.6 V. The B ports are designed to track VCCB and accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation and level-shifting between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.

The SN74AVC2T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR pin) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess leakage current on the internal CMOS structure.

Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

Gleiche Funktionalität, gleiche Pinbelegung wie verglichener Baustein
TXU0102 AKTIV Zweikanal-Pegelumsetzer mit festgelegter Richtung mit allen Kanälen in derselben Richtung 2 channel fixed direction level translator
TXU0202 AKTIV Zweikanal-Pegelumsetzer mit festgelegter Richtung mit Kanälen in entgegengesetzter Richtung 2 channel fixed direction level translator

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 17
Typ Titel Datum
* Data sheet SN74AVC2T45 2-Bit, Dual Supply, Bus Transceiver With Configurable Level-Shifting and Translation datasheet (Rev. L) PDF | HTML 18 Mai 2017
Application brief Future-Proofing Your Level Shifter Design with TI's Dual Footprint Packages PDF | HTML 05 Sep 2023
EVM User's guide Generic AVC and LVC Direction Controlled Translation EVM (Rev. B) 30 Jul 2021
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
EVM User's guide SN74AXC2T-SMALLPKGEVM Evaluation module user's guide 04 Jun 2019
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
Application note Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B) 30 Apr 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
More literature LCD Module Interface Application Clip 09 Mai 2003
User guide AVC Advanced Very-Low-Voltage CMOS Logic Data Book, March 2000 (Rev. C) 20 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 Mai 2002
Application note Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B) 07 Jul 1999
Application note AVC Logic Family Technology and Applications (Rev. A) 26 Aug 1998

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

5-8-LOGIC-EVM — Generisches Logik-Evaluierungsmodul für 5- bis 8-polige DCK-, DCT-, DCU-, DRL- und DBV-Gehäuse

Flexibles EVM zur Unterstützung aller Geräte mit 5- bis 8-poligem DCK-, DCT-, DCU-, DRL- oder DBV-Gehäuse.
Benutzerhandbuch: PDF
Evaluierungsplatine

AVCLVCDIRCNTRL-EVM — Generisches EVM für richtungsgesteuerte bidirektionale Umsetzungsgeräte mit Unterstützung für AVC un

The generic EVM is designed to support one, two, four and eight channel LVC and AVC direction-controlled translation devices. It also supports the bus hold and automotive -Q1 devices in the same number of channels. The AVC are low voltage translation devices with lower drive strength of 12mA. LVC (...)

Benutzerhandbuch: PDF
Evaluierungsplatine

AXC2T-SMALLPKGEVM — AXC2T Evaluierungsmodul für Bausteine in kleinen DTM- und RSW-Gehäusen

This EVM is designed to support DTM and RSW packages for the AXC and LVC family of DIR controlled bidirectional devices. The AXC and AVC devices belong to the low voltage direction controlled translation family with operating voltage from 0.65V to 3.6V (AXC) and 1.2 to 3.6 (AVC) with 12mA of drive (...)
Benutzerhandbuch: PDF
Treiber oder Bibliothek

CC256XMS432BTBLESW — TI Dual-Mode-Bluetooth-Stack auf MSP432-MCUs

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
Benutzerhandbuch: PDF
Simulationsmodell

SN74AVC2T45 IBIS Model (Rev. B)

SCEM431B.ZIP (122 KB) - IBIS Model
Referenzdesigns

TIDC-CC3200-VIDEO — SimpleLink™ CC32xx-OV788 Video/Audio-Streaming über Wi-Fi – Referenzdesign

The design enables OV788 ultra-low power video compression chip users to bring live streaming capabilities of audio and video data over Wi-Fi® very easily. It showcases a single chip implementation of RTP video streaming + Wi-Fi connection on the SimpleLink™ CC3200 Wi-Fi wireless (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

DLP4500-C350REF — Referenzdesign für hochauflösende, portable Lichtsteuerung mit DLP-Technologie

This reference design, featuring the DLP® 0.45” WXGA chipset and implemented in the DLP® LightCrafter™ 4500 evaluation module (EVM), enables flexible control of high resolution, accurate patterns for industrial, medical, and scientific applications. With a free USB-based GUI and (...)
Test report: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-00254 — Präzise Point-Cloud-Generation für 3D-Bildverarbeitungsanwendungen mit DLP®-Technologie

The 3D Machine Vision reference design employs Texas Instruments DLP® Advanced Light Control Software Development Kit (SDK) for LightCrafter™ series controllers, which allows developers to easily construct 3D point clouds by integrating TI’s digital micromirror device (DMD) (...)
Test report: PDF
Schaltplan: PDF
Gehäuse Pins Herunterladen
DSBGA (YZP) 8 Optionen anzeigen
SSOP (DCT) 8 Optionen anzeigen
VSSOP (DCU) 8 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos