홈 무선 커넥티비티 Wi-Fi 제품
홈
무선 커넥티비티
Wi-Fi 제품

CC2564C

활성

BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy)를 지원하는 Bluetooth® 5.1

지금 주문
데이터시트

CC2564C

활성
데이터시트 지금 주문

제품 상세 정보

Type Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power, LE Link Layer Topology, LE Secure Connections Operating temperature range (°C) -40 to 85 Rating Catalog
Type Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power, LE Link Layer Topology, LE Secure Connections Operating temperature range (°C) -40 to 85 Rating Catalog
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 
open-in-new 기타 Wi-Fi 제품 찾기
다운로드 스크립트와 함께 비디오 보기 동영상

기술 문서

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기24
유형 직함 날짜
* Data sheet CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) 2020/12/02
Cybersecurity advisory CC2564C: BT (BR/EDR) SIG Errata 11838 - LMP Encryption Key Minimum Size Change PDF | HTML 2023/12/20
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 2023/12/06
Cybersecurity advisory CC2564C: CC256x and WL18xx Bluetooth Low Energy - LE scan vulnerability PDF | HTML 2023/11/12
User guide CC256x TI Bluetooth Stack SPPLEDemo App PDF | HTML 2023/08/08
User guide CC256x TI’s Bluetooth Stack Basic HFGAGDemo APP PDF | HTML 2023/08/08
User guide TI Bluetooth Stack HIDDemo App PDF | HTML 2023/08/04
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022/05/13
Selection guide 무선 연결 기술 선택 가이드 (Rev. B) 2022/03/07
User guide CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 2021/12/20
More literature Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 2021/12/20
User guide CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 2021/12/02
User guide CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 2021/12/01
Application brief TI Bluetooth CC2564C Solution (Rev. B) PDF | HTML 2021/12/01
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 2021/01/15
User guide CC2564x Demo Applications User's Guide PDF | HTML 2020/12/17
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 2020/07/17
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020/05/18
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020/05/18
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 2019/01/07
White paper Which TI Bluetooth® solution should I choose? 2017/05/05
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 2017/05/04
Technical article Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 2016/12/13
Application note Application Notes for CC2564C Bluetooth® 4.1 and 4.2 2016/11/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

CC256XCQFN-EM — CC2564C 듀얼 모드 Bluetooth® 컨트롤러 평가 모듈

The TI CC256xC Bluetooth® device is a complete basic rate (BR), enhanced data rate (EDR), and LE host controller interface (HCI) solution that reduces design effort and enables fast time to market. Based on TI's seventh-generation core, the module is a product-proven solution supporting (...)
사용 설명서: PDF | HTML
TI.com에서 구매할 수 없습니다
드라이버 또는 라이브러리

CC2564CMSP432BTBLESW — MSP432 MCU의 CC2564C TI 듀얼 모드 Bluetooth® 스택

TI’s CC2564C Dual-mode Bluetooth® stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.2 specification. The Bluetooth stack is fully qualified (QDID 85355 and QDID (...)
사용 설명서: PDF | HTML
다운로드
드라이버 또는 라이브러리

CC2564CSTBTBLESW — STM32F4 MCU의 CC2564C TI 듀얼 모드 Bluetooth® 스택

TI’s CC2564C Dual-mode Bluetooth® stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.2 specification. The Bluetooth stack is fully qualified (QDID (...)
사용 설명서: PDF | HTML
다운로드
드라이버 또는 라이브러리

CC256XC-BT-SP — CC256xC용 Bluetooth® 서비스 팩

The CC256xC Bluetooth Service Pack (SP) contains the mandatory initialization scripts (BTS files) that have platform specific configurations and bug fixes.

In addition, the Bluetooth Service Pack also contains companion files for the CC2564C device that are useful for testing and debugging. The (...)

사용 설명서: PDF | HTML
다운로드
드라이버 또는 라이브러리

TI-BT-4-2-STACK-LINUX-ADDON — WL183x 및 CC2564C를 지원하는 Linux 플랫폼용 TI Bluetooth 4.2 스택 애드온

This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
다운로드
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.
시작 다운로드 옵션
인증

CC256X-CERTIFICATION — 듀얼 모드 Bluetooth에 대한 무선 인증

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
옵션 보기
인증

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Wi-Fi 제품
CC2564 — EDR(Enhanced Data Rate), LE(Low Energy) 및 ANT를 지원하는 Bluetooth ® 4.0 CC2564C — BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy)를 지원하는 Bluetooth® 5.1 CC2564MODA — 안테나가 통합된 BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy) 모듈이 포함된 Bluetooth ® 4.1 CC2564MODN — BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy) 모듈이 포함된 Bluetooth ® 4.1
하드웨어 개발
BOOST-CC2564MODA — TMP107 온도 센서 데이지 체인 BoosterPack™ 플러그인 모듈 CC2564MODAEM — 통합 안테나 평가 보드를 갖춘 듀얼 모드 Bluetooth® CC2564 모듈 CC2564MODNEM — 듀얼 모드 Bluetooth® CC2564 모듈 평가 보드 CC256XCQFN-EM — CC2564C 듀얼 모드 Bluetooth® 컨트롤러 평가 모듈 CC256XQFNEM — 듀얼 모드 Bluetooth® CC2564 평가 보드
다운로드 옵션
설계 툴

DUALMODE-BT-DESIGN-REVIEWS — CC256x 장치에 대한 하드웨어 설계 검토

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
사용 설명서: PDF
요청
거버(Gerber) 파일

CC256XCQFN-EM Design Files

SWRC329.ZIP (1375 KB)
다운로드
패키지 핀 다운로드
VQFNP-MR (RVM) 76 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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