TPS51116-EP

활성

향상된 제품 DDR1, DDR2, DDR3 스위처 및 LDO

제품 상세 정보

Vin (min) (V) 3 Vin (max) (V) 28 Vout (min) (V) 0.75 Vout (max) (V) 3 Features Complete Solution, Shutdown Pin for S3 Iq (typ) (mA) 0.8 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125 Product type DDR DDR memory type DDR, DDR2, DDR3, DDR3L, DDR4, LPDDR2, LPDDR3
Vin (min) (V) 3 Vin (max) (V) 28 Vout (min) (V) 0.75 Vout (max) (V) 3 Features Complete Solution, Shutdown Pin for S3 Iq (typ) (mA) 0.8 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125 Product type DDR DDR memory type DDR, DDR2, DDR3, DDR3L, DDR4, LPDDR2, LPDDR3
HTSSOP (PWP) 20 41.6 mm² 6.5 x 6.4
  • Synchronous Buck Controller (VDDQ)
    • Wide-Input Voltage Range: 3.0-V to 28-V
    • D−CAP™ Mode with 100-ns Load Step Response
    • Current Mode Option Supports Ceramic Output Capacitors
    • Supports Soft-Off in S4/S5 States
    • Current Sensing from RDS(on) or Resistor
    • 2.5-V (DDR), 1.8-V (DDR2), Adjustable to
      1.5-V (DDR3) or 1.2-V (LPDDR3) or
      Output Range 0.75-V to 3.0-V
    • Equipped with Powergood, Overvoltage Protection and
      Undervoltage Protection
  • 1-A LDO (VTT), Buffered Reference (VREF)
    • Capable to Sink and Source 1 A
    • LDO Input Available to Optimize Power Losses
    • Requires only 20-7micro;F Ceramic Output Capacitor
    • Buffered Low Noise 10-mA VREF Output
    • Accuracy ±20 mV for both VREF and VTT
    • Supports High-Z in S3 and Soft-Off in S4/S5
    • Thermal Shutdown

APPLICATONS

  • DDR/DDR2/DDR3/LPDDR3 Memory Power Supplies
  • SSTL-2, SSTL-18, SSTL-15 and HSTL Termination

SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS

  • Controlled Baseline
  • One Assembly and Test Site
  • One Fabrication Site
  • Available in Military (–55°C to 125°C) Temperature Range
  • Extended Product Life Cycle
  • Extended Product-Change Notification
  • Product Traceability

  • Synchronous Buck Controller (VDDQ)
    • Wide-Input Voltage Range: 3.0-V to 28-V
    • D−CAP™ Mode with 100-ns Load Step Response
    • Current Mode Option Supports Ceramic Output Capacitors
    • Supports Soft-Off in S4/S5 States
    • Current Sensing from RDS(on) or Resistor
    • 2.5-V (DDR), 1.8-V (DDR2), Adjustable to
      1.5-V (DDR3) or 1.2-V (LPDDR3) or
      Output Range 0.75-V to 3.0-V
    • Equipped with Powergood, Overvoltage Protection and
      Undervoltage Protection
  • 1-A LDO (VTT), Buffered Reference (VREF)
    • Capable to Sink and Source 1 A
    • LDO Input Available to Optimize Power Losses
    • Requires only 20-7micro;F Ceramic Output Capacitor
    • Buffered Low Noise 10-mA VREF Output
    • Accuracy ±20 mV for both VREF and VTT
    • Supports High-Z in S3 and Soft-Off in S4/S5
    • Thermal Shutdown

APPLICATONS

  • DDR/DDR2/DDR3/LPDDR3 Memory Power Supplies
  • SSTL-2, SSTL-18, SSTL-15 and HSTL Termination

SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS

  • Controlled Baseline
  • One Assembly and Test Site
  • One Fabrication Site
  • Available in Military (–55°C to 125°C) Temperature Range
  • Extended Product Life Cycle
  • Extended Product-Change Notification
  • Product Traceability

The TPS51116 provides a complete power supply for DDR/SSTL-2, DDR2/SSTL-18, DDR3/SSTL-15, and LPDDR3 memory systems. It integrates a synchronous buck controller with a 1-A sink/source tracking linear regulator and buffered low noise reference. The TPS51116 offers the lowest total solution cost in systems where space is at a premium. The TPS51116 synchronous controller runs fixed 400-kHz, pseudo-constant frequency PWM with an adaptive on-time control that can be configured in D-CAP Mode for ease of use and fastest transient response or in current mode to support ceramic output capacitors. The 1-A sink/source LDO maintains fast transient response only requiring 20-μF (2 × 10 µF) of ceramic output capacitance. In addition, the LDO supply input is available externally to significantly reduce the total power losses. The TPS51116 supports all of the sleep state controls placing VTT at high-Z in S3 (suspend to RAM) and discharging VDDQ, VTT and VTTREF (soft-off) in S4/S5 (suspend to disk). TPS51116 has all of the protection features including thermal shutdown and is offered in a 20-pin HTSSOP PowerPAD package.

The TPS51116 provides a complete power supply for DDR/SSTL-2, DDR2/SSTL-18, DDR3/SSTL-15, and LPDDR3 memory systems. It integrates a synchronous buck controller with a 1-A sink/source tracking linear regulator and buffered low noise reference. The TPS51116 offers the lowest total solution cost in systems where space is at a premium. The TPS51116 synchronous controller runs fixed 400-kHz, pseudo-constant frequency PWM with an adaptive on-time control that can be configured in D-CAP Mode for ease of use and fastest transient response or in current mode to support ceramic output capacitors. The 1-A sink/source LDO maintains fast transient response only requiring 20-μF (2 × 10 µF) of ceramic output capacitance. In addition, the LDO supply input is available externally to significantly reduce the total power losses. The TPS51116 supports all of the sleep state controls placing VTT at high-Z in S3 (suspend to RAM) and discharging VDDQ, VTT and VTTREF (soft-off) in S4/S5 (suspend to disk). TPS51116 has all of the protection features including thermal shutdown and is offered in a 20-pin HTSSOP PowerPAD package.

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기술 문서

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모두 보기3
유형 직함 날짜
* Data sheet DDR SYNCHRONOUS BUCK CONTROLLER datasheet (Rev. A) 2012/11/07
* VID TPS51116-EP VID V6212602 2016/06/21
* Radiation & reliability report TPS51116MPWPEP Reliability Report 2016/02/02

설계 및 개발

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평가 보드

TPS51116EVM-001 — TPS51116 메모리 전원 솔루션, 동기 벅 컨트롤러 평가 모듈

The TPS51116EVM evaluation module (EVM) is a dual-output converter for DDR and DDRII memory modules. It uses a 10 A synchronous buck converter to provide the core voltage (VDDQ) for DDR memory modules. The EVM is designed to use a 4.5 V to 28 V supply voltage and a 4.75 V to (...)

사용 설명서: PDF
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패키지 다운로드
HTSSOP (PWP) 20 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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