홈 전원 관리 멀티 채널 IC(PMIC)
홈
전원 관리
멀티 채널 IC(PMIC)

TPS657052

활성

3채널 전원 관리 IC(PMIC)

지금 주문
데이터시트

TPS657052

활성
데이터시트 지금 주문

제품 상세 정보

Regulated outputs (#) 3 Configurability Factory programmable Vin (min) (V) 1.7 Vin (max) (V) 6 Vout (min) (V) 1.8 Vout (max) (V) 3.3 Iout (max) (A) 0.4 Features Enable pin Step-up DC/DC converter 0 Step-down DC/DC converter 2 Step-down DC/DC controller 0 Step-up DC/DC controller 0 LDO 1 Iq (typ) (mA) 0.005 Rating Catalog Switching frequency (max) (kHz) 2250 Operating temperature range (°C) -40 to 85 Shutdown current (ISD) (typ) (µA) 5 Switching frequency (typ) (kHz) 2250 Product type Processor and FPGA
Regulated outputs (#) 3 Configurability Factory programmable Vin (min) (V) 1.7 Vin (max) (V) 6 Vout (min) (V) 1.8 Vout (max) (V) 3.3 Iout (max) (A) 0.4 Features Enable pin Step-up DC/DC converter 0 Step-down DC/DC converter 2 Step-down DC/DC controller 0 Step-up DC/DC controller 0 LDO 1 Iq (typ) (mA) 0.005 Rating Catalog Switching frequency (max) (kHz) 2250 Operating temperature range (°C) -40 to 85 Shutdown current (ISD) (typ) (µA) 5 Switching frequency (typ) (kHz) 2250 Product type Processor and FPGA
DSBGA (YZH) 16 5.0625 mm² 2.25 x 2.25
  • Two 400-mA Step-Down Converters
  • Up to 92% Efficiency
  • VIN Range for DC-DC Converter
    From 3.3 V to 6 V
  • 2.25-MHz Fixed-Frequency Operation
  • Power Save Mode at Light Load Current
  • Output Voltage Accuracy in PWM Mode ±1.5%
  • 100% Duty Cycle for Lowest Dropout
  • 180° Out-of-Phase Operation
  • 1 General Purpose 200-mA LDO
  • VIN Range for LDO From 1.7 V to 6.0 V
  • Available in a 16-Ball DSBGA (WCSP) With 0.5-
    mm Pitch
  • Two 400-mA Step-Down Converters
  • Up to 92% Efficiency
  • VIN Range for DC-DC Converter
    From 3.3 V to 6 V
  • 2.25-MHz Fixed-Frequency Operation
  • Power Save Mode at Light Load Current
  • Output Voltage Accuracy in PWM Mode ±1.5%
  • 100% Duty Cycle for Lowest Dropout
  • 180° Out-of-Phase Operation
  • 1 General Purpose 200-mA LDO
  • VIN Range for LDO From 1.7 V to 6.0 V
  • Available in a 16-Ball DSBGA (WCSP) With 0.5-
    mm Pitch

The TPS65705x devices are small power management units targeted for embedded camera module or other portable low-power consumer-end equipments. The device contains two highly efficient step-down converters, a low dropout linear regulator, and additional supporting functions. The 2.25-MHz step-down converter enters a low-power mode at light load for maximum efficiency across the widest possible range of load currents. For low-noise applications, the device can be forced into fixed-frequency PWM mode using the MODE pin. The device allows the use of small inductors and capacitors to achieve a small sized solution. The TPS65705x provides an output current of up to 400 mA on both DC-DC converters and integrates one 200-mA LDO with different output settings. The LDO operates with an input voltage range from 1.7 V to 6 V, thus allowing it to be supplied from the output of the step-down converter or directly from the system voltage.

The TPS65705x comes in a small 16-pin wafer chip scale package (WCSP) with 0.5-mm ball pitch.

The TPS65705x devices are small power management units targeted for embedded camera module or other portable low-power consumer-end equipments. The device contains two highly efficient step-down converters, a low dropout linear regulator, and additional supporting functions. The 2.25-MHz step-down converter enters a low-power mode at light load for maximum efficiency across the widest possible range of load currents. For low-noise applications, the device can be forced into fixed-frequency PWM mode using the MODE pin. The device allows the use of small inductors and capacitors to achieve a small sized solution. The TPS65705x provides an output current of up to 400 mA on both DC-DC converters and integrates one 200-mA LDO with different output settings. The LDO operates with an input voltage range from 1.7 V to 6 V, thus allowing it to be supplied from the output of the step-down converter or directly from the system voltage.

The TPS65705x comes in a small 16-pin wafer chip scale package (WCSP) with 0.5-mm ball pitch.
open-in-new 기타 멀티 채널 IC(PMIC) 찾기
다운로드 스크립트와 함께 비디오 보기 동영상

기술 문서

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기3
유형 직함 날짜
* Data sheet TPS65705x PMU for Embedded Camera Module datasheet (Rev. A) PDF | HTML 2015/09/30
Application note LDO Noise Demystified (Rev. B) PDF | HTML 2020/08/18
Application note LDO PSRR Measurement Simplified (Rev. A) PDF | HTML 2017/08/09

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

패키지 핀 다운로드
DSBGA (YZH) 16 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상