TPS65708
- Two 400-mA Step-Down Converters
- Up to 95% Efficiency
- VIN Range for DC-DC Converters From
3.6 V to 6 V - 2.25-MHz Fixed-Frequency Operation
- Power Save Mode at Light Load Current
- Output Voltage Accuracy in PWM mode ±1.5%
- 100% Duty Cycle for Lowest Dropout
- 180° Out-of-Phase Operation
- 2 General Purpose 200-mA LDOs
- LDOs Optionally Powered From Step-Down
Converters - 7.5-mA PWM Dimmable Current Sink
- Available in a 16-Ball DSBGA (WCSP) With
0.5-mm Pitch - Device Options:
- VDCDC1 = 3.3 V
- VDCDC2 = 1.8 V
- VLDO1 = 2.8 V
- VLDO2 = 1.2 V
- ISINK(PWM=1) = 7.5 mA
- SEQUENCING : DCDC1, LDO1, DCDC2,
LDO2
- APPLICATIONS
- Monitors
- Laptops
- Handheld Equipment
All other trademarks are the property of their respective owners
The TPS65708 device is a power management unit targeted for embedded camera modules or other portable low-power consumer end equipment. The device contains two high-efficiency step-down converters, two low-dropout linear regulators, and a 7.5-mA current sink for driving a LED. The 2.25-MHz step-down converter enters a low-power mode at light load for maximum efficiency across the widest possible range of load currents. For low-noise applications, the devices can be forced into fixed-frequency PWM mode using the MODE pin. The device allows the use of small inductors and capacitors to achieve a small solution size. The TPS65708 device provides an output current of up to 400 mA on both DC-DC converters and up to 200 mA on each of the LDOs. The enable signal to the DC-DC converters and LDOs is generated internally by the undervoltage lockout circuit.
The TPS65708 comes in a small 16-pin wafer chip-scale package (WCSP) with 0.5-mm ball pitch.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TPS65708 PMU for Embedded Camera Module datasheet (Rev. B) | PDF | HTML | 2015/09/23 |
Application note | LDO Noise Demystified (Rev. B) | PDF | HTML | 2020/08/18 | |
Application note | LDO PSRR Measurement Simplified (Rev. A) | PDF | HTML | 2017/08/09 | |
EVM User's guide | TPS65708EVM User Guide | 2010/10/22 |
설계 및 개발
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패키지 | 핀 | 다운로드 |
---|---|---|
DSBGA (YZH) | 16 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치