전원 관리 DC/DC power modules Power modules (integrated inductor)

TPS826951

활성

고효율 MicroSiP™ 스텝다운 컨버터 모듈(프로파일 <1mm)

제품 상세 정보

Iout (max) (A) 0.8 Vin (max) (V) 4.8 Vin (min) (V) 2.3 Vout (max) (V) 2.5 Vout (min) (V) 2.5 Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Features Enable, Light Load Efficiency Control mode Constant on-time (COT) Switching frequency (max) (Hz) 3300000 Switching frequency (min) (Hz) 2700000
Iout (max) (A) 0.8 Vin (max) (V) 4.8 Vin (min) (V) 2.3 Vout (max) (V) 2.5 Vout (min) (V) 2.5 Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Features Enable, Light Load Efficiency Control mode Constant on-time (COT) Switching frequency (max) (Hz) 3300000 Switching frequency (min) (Hz) 2700000
uSIP (SIP) 8 6.67 mm² 2.3 x 2.9
  • Total Solution Size < 6.7 mm2
  • 95% Efficiency at 3-MHz Operation
  • 23µA Quiescent Current
  • High Duty-Cycle Operation
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • Excellent AC Load Regulation
  • Internal Soft Start, 200-µs Start-Up Time
  • Integrated Active Power-Down Sequencing (Optional)
  • Current Overload and Thermal Shutdown Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size < 6.7 mm2
  • 95% Efficiency at 3-MHz Operation
  • 23µA Quiescent Current
  • High Duty-Cycle Operation
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • Excellent AC Load Regulation
  • Internal Soft Start, 200-µs Start-Up Time
  • Integrated Active Power-Down Sequencing (Optional)
  • Current Overload and Thermal Shutdown Protection
  • Sub 1-mm Profile Solution

The TPS8269xSIP device is a complete 500 mA / 800 mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8269xSIP is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSIP™ DC/DC converter operates at a regulated 3-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 23 µA (typical) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8269xSIP is packaged in a compact (2.9 mm × 2.3 mm) and low profile (1 mm) BGA package suitable for automated assembly by standard surface mount equipment.

The TPS8269xSIP device is a complete 500 mA / 800 mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8269xSIP is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSIP™ DC/DC converter operates at a regulated 3-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 23 µA (typical) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8269xSIP is packaged in a compact (2.9 mm × 2.3 mm) and low profile (1 mm) BGA package suitable for automated assembly by standard surface mount equipment.

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기술 문서

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모두 보기6
유형 직함 날짜
* Data sheet TPS8269x High-Efficiency MicroSIP Step-Down Converter (Profile <1 mm) datasheet (Rev. C) PDF | HTML 2015/04/01
User guide Manufacturing and Rework Design Guide for MicroSiP™ Power Modules (Rev. A) PDF | HTML 2021/06/16
Analog Design Journal Understanding 100% mode in low-power DC/DC converters 2018/06/22
Analog Design Journal Testing tips for applying external power to supply outputs without an input voltage 2016/10/24
White paper SiP Power Modules White Paper 2016/01/26
Analog Design Journal IQ: What it is, what it isn’t, and how to use it 2011/06/17

설계 및 개발

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패키지 다운로드
uSIP (SIP) 8 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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