產品詳細資料

DSP type 1 C64x DSP (max) (MHz) 400 CPU 32-/64-bit Rating Catalog Operating temperature range (°C) to
DSP type 1 C64x DSP (max) (MHz) 400 CPU 32-/64-bit Rating Catalog Operating temperature range (°C) to
OMFCBGA (GTS) 288 529 mm² 23 x 23 OMFCBGA (ZTS) 288 529 mm² 23 x 23
  • High-Performance Fixed-Point Digital Signal Processor (TMS320C6413/C6410)
    • TMS320C6413
      • 2-ns Instruction Cycle Time
      • 500-MHz Clock Rate
      • 4000 MIPS
    • TMS320C6410
      • 2.5-ns Instruction Cycle Time
      • 400-MHz Clock Rate
      • 3200 MIPS
    • Eight 32-Bit Instructions/Cycle
    • Fully Software-Compatible With C64x™
    • Extended Temperature Devices Available
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2™ Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
  • Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • VelociTI.2™ Increased Orthogonality
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
  • L1/L2 Memory Architecture
    • 128K-Bit (16K-Byte) L1P Program Cache (Direct Mapped)
    • 128K-Bit (16K-Byte) L1D Data Cache (2-Way Set-Associative)
    • 2M-Bit (256K-Byte) L2 Unified Mapped RAM/Cache [C6413] (Flexible RAM/Cache Allocation)
    • 1M-Bit (128K-Byte) L2 Unified Mapped RAM/Cache [C6410] (Flexible RAM/Cache Allocation)
  • Endianess: Little Endian, Big Endian
  • 32-Bit External Memory Interface (EMIF)
    • Glueless Interface to Asynchronous Memories (SRAM and EPROM) and Synchronous Memories (SDRAM, SBSRAM, ZBT SRAM, and FIFO)
    • 512M-Byte Total Addressable External Memory Space
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • Host-Port Interface (HPI) [32-/16-Bit]
  • Two Multichannel Audio Serial Ports (McASPs) - with Six Serial Data Pins each
  • Two Inter-Integrated Circuit (I2C) Buses
    • Additional GPIO Capability
  • Two Multichannel Buffered Serial Ports
  • Three 32-Bit General-Purpose Timers
  • Sixteen General-Purpose I/O (GPIO) Pins
  • Flexible PLL Clock Generator
  • On-Chip Fundamental Oscillator
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 288-Pin Ball Grid Array (BGA) Package (GTS and ZTS Suffixes), 1.0-mm Ball Pitch
  • 0.13-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V I/Os, 1.2-V Internal

VelociTI.2, VelociTI, and TMS320C64x are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C6000, and C6000 are trademarks of Texas Instruments.

  • High-Performance Fixed-Point Digital Signal Processor (TMS320C6413/C6410)
    • TMS320C6413
      • 2-ns Instruction Cycle Time
      • 500-MHz Clock Rate
      • 4000 MIPS
    • TMS320C6410
      • 2.5-ns Instruction Cycle Time
      • 400-MHz Clock Rate
      • 3200 MIPS
    • Eight 32-Bit Instructions/Cycle
    • Fully Software-Compatible With C64x™
    • Extended Temperature Devices Available
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2™ Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
  • Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • VelociTI.2™ Increased Orthogonality
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
  • L1/L2 Memory Architecture
    • 128K-Bit (16K-Byte) L1P Program Cache (Direct Mapped)
    • 128K-Bit (16K-Byte) L1D Data Cache (2-Way Set-Associative)
    • 2M-Bit (256K-Byte) L2 Unified Mapped RAM/Cache [C6413] (Flexible RAM/Cache Allocation)
    • 1M-Bit (128K-Byte) L2 Unified Mapped RAM/Cache [C6410] (Flexible RAM/Cache Allocation)
  • Endianess: Little Endian, Big Endian
  • 32-Bit External Memory Interface (EMIF)
    • Glueless Interface to Asynchronous Memories (SRAM and EPROM) and Synchronous Memories (SDRAM, SBSRAM, ZBT SRAM, and FIFO)
    • 512M-Byte Total Addressable External Memory Space
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • Host-Port Interface (HPI) [32-/16-Bit]
  • Two Multichannel Audio Serial Ports (McASPs) - with Six Serial Data Pins each
  • Two Inter-Integrated Circuit (I2C) Buses
    • Additional GPIO Capability
  • Two Multichannel Buffered Serial Ports
  • Three 32-Bit General-Purpose Timers
  • Sixteen General-Purpose I/O (GPIO) Pins
  • Flexible PLL Clock Generator
  • On-Chip Fundamental Oscillator
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 288-Pin Ball Grid Array (BGA) Package (GTS and ZTS Suffixes), 1.0-mm Ball Pitch
  • 0.13-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V I/Os, 1.2-V Internal

VelociTI.2, VelociTI, and TMS320C64x are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C6000, and C6000 are trademarks of Texas Instruments.

The TMS320C64x™ DSPs (including the TMS320C6413, TMS320C6410 devices) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The TMS320C6413 and TMS320C6410 (C6413 and C6410) devices are based on the second-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture (VelociTI.2™) developed by Texas Instruments (TI)™ The high-performance, lower-cost C6413/C6410 DSPs enable customers to reduce system costs for telecom, medical, industrial, office, and photo lab equipment. The C64x™ is a code-compatible member of the C6000™ DSP platform.

With performance of up to 4000 million instructions per second (MIPS) at a clock rate of 500 MHz, the C6413 device offers cost-effective solutions to high-performance DSP programming challenges.

With performance of up to 3200 million instructions per second (MIPS) at a clock rate of 400 MHz, the C6410 device offers cost-effective solutions to high-performance DSP programming challenges. The C6410 device also provides excellent value for packet telephony and for other cost-sensitive applications demanding high performance. The C6410 device also provides excellent value for packet telephony and to other cost-sensitive applications demanding high performance

The C6413/C6410 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x™ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs)— with VelociTI.2™ extensions. The VelociTI.2™ extensions in the eight functional units include new instructions to accelerate the performance in video and imaging applications and extend the parallelism of the VelociTI™ architecture. The C6413 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2000 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4000 MMACS. The C6410 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 1600 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 3200 MMACS. The C6413/C6410 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000™ DSP platform devices.

The C6413/C6410 uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 2-Mbit memory space that is shared between program and data space [for C6413 device] and the Level 2 memory/cache (L2) consists of an 1-Mbit memory space that is shared between program and data space [for C6410 device]. L2 memory can be configured as mapped memory, cache, or combinations of the two. The peripheral set includes: two multichannel buffered audio serial ports (McASPs); two inter-integrated circuit bus modules (I2Cs) ; two multichannel buffered serial ports (McBSPs); three 32-bit general-purpose timers; a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a 16-pin general-purpose input/output port (GP0) with programmable interrupt/event generation modes; and a 32-bit glueless external memory interface (EMIFA), which is capable of interfacing to synchronous and asynchronous memories and peripherals.

The McASP port supports one transmit and one receive clock zone, with eight serial data pins which can be individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin from 2 to 32 time slots. The C6413/C6410 has sufficient bandwidth to support all 8 serial data pins transmitting a 192-kHz stereo signal. Serial data in each zone may be transmitted and received on multiple serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I2S) format.

In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of user data and channel status fields.

McASP also provides extensive error-checking and recovery features, such as the bad clock detection circuit for each high-frequency master clock which verifies that the master clock is within a programmed frequency range.

The I2C ports on the TMS320C6413/C6410 allows the DSP to easily control peripheral devices and communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.

TheC6413/C6410 has a complete set of development tools which includes: a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

The TMS320C64x™ DSPs (including the TMS320C6413, TMS320C6410 devices) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The TMS320C6413 and TMS320C6410 (C6413 and C6410) devices are based on the second-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture (VelociTI.2™) developed by Texas Instruments (TI)™ The high-performance, lower-cost C6413/C6410 DSPs enable customers to reduce system costs for telecom, medical, industrial, office, and photo lab equipment. The C64x™ is a code-compatible member of the C6000™ DSP platform.

With performance of up to 4000 million instructions per second (MIPS) at a clock rate of 500 MHz, the C6413 device offers cost-effective solutions to high-performance DSP programming challenges.

With performance of up to 3200 million instructions per second (MIPS) at a clock rate of 400 MHz, the C6410 device offers cost-effective solutions to high-performance DSP programming challenges. The C6410 device also provides excellent value for packet telephony and for other cost-sensitive applications demanding high performance. The C6410 device also provides excellent value for packet telephony and to other cost-sensitive applications demanding high performance

The C6413/C6410 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x™ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs)— with VelociTI.2™ extensions. The VelociTI.2™ extensions in the eight functional units include new instructions to accelerate the performance in video and imaging applications and extend the parallelism of the VelociTI™ architecture. The C6413 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2000 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4000 MMACS. The C6410 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 1600 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 3200 MMACS. The C6413/C6410 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000™ DSP platform devices.

The C6413/C6410 uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 2-Mbit memory space that is shared between program and data space [for C6413 device] and the Level 2 memory/cache (L2) consists of an 1-Mbit memory space that is shared between program and data space [for C6410 device]. L2 memory can be configured as mapped memory, cache, or combinations of the two. The peripheral set includes: two multichannel buffered audio serial ports (McASPs); two inter-integrated circuit bus modules (I2Cs) ; two multichannel buffered serial ports (McBSPs); three 32-bit general-purpose timers; a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a 16-pin general-purpose input/output port (GP0) with programmable interrupt/event generation modes; and a 32-bit glueless external memory interface (EMIFA), which is capable of interfacing to synchronous and asynchronous memories and peripherals.

The McASP port supports one transmit and one receive clock zone, with eight serial data pins which can be individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin from 2 to 32 time slots. The C6413/C6410 has sufficient bandwidth to support all 8 serial data pins transmitting a 192-kHz stereo signal. Serial data in each zone may be transmitted and received on multiple serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I2S) format.

In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of user data and channel status fields.

McASP also provides extensive error-checking and recovery features, such as the bad clock detection circuit for each high-frequency master clock which verifies that the master clock is within a programmed frequency range.

The I2C ports on the TMS320C6413/C6410 allows the DSP to easily control peripheral devices and communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.

TheC6413/C6410 has a complete set of development tools which includes: a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

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類型 標題 日期
* Data sheet TMS320C6413, TMS320C6410 Fixed-Point Digital Signal Processors datasheet (Rev. F) 2006年 1月 16日
* Errata TMS320C6413, TMS320C6410 DSPs Silicon Errata (Rev. C) 2004年 11月 24日
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 2021年 5月 19日
User guide TMS320 DSP/BIOS v5.42 User's Guide (Rev. I) 2012年 10月 9日
User guide TMS320C6000 Assembly Language Tools v 7.4 User's Guide (Rev. W) 2012年 8月 21日
User guide TMS320C6000 Optimizing Compiler v 7.4 User's Guide (Rev. U) 2012年 8月 21日
User guide Emulation and Trace Headers Technical Reference Manual (Rev. I) 2012年 8月 9日
Application note Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
User guide TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (Rev. J) 2010年 7月 30日
User guide TMS320C6000 Assembly Language Tools v 7.0 User's Guide (Rev. S) 2010年 3月 18日
User guide TMS320C6000 Optimizing Compiler v 7.0 User's Guide (Rev. Q) 2010年 3月 18日
User guide TMS320C6000 DSP Peripherals Overview Reference Guide (Rev. Q) 2009年 7月 2日
Application note Common Object File Format (COFF) 2009年 4月 15日
User guide TMS320C6000 DSP Multi-channel Audio Serial Port (McASP) Reference Guide (Rev. J) 2008年 11月 20日
User guide TMS320C6000 Assembly Language Tools v 6.1 User's Guide (Rev. Q) 2008年 5月 15日
User guide TMS320C6000 Optimizing Compiler v 6.1 User's Guide (Rev. O) 2008年 5月 15日
Application note TMS320C6000 EMIF-to-External SDRAM Interface (Rev. E) 2007年 9月 4日
Application note Thermal Considerations for the DM64xx, DM64x, and C6000 Devices 2007年 5月 20日
User guide TMS320C6000 DSP External Memory Interface (EMIF) Reference Guide (Rev. E) 2007年 4月 11日
Product overview TMS320C6000 DSP TCP/IP Stack Software (Rev. C) 2007年 4月 4日
User guide TMS320C6000 DSP Inter-Integrated Circuit (I2C) Module Reference Guide (Rev. D) 2007年 3月 26日
User guide TMS320C6000 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (Rev. G) 2006年 12月 14日
User guide TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (Rev. C) 2006年 11月 15日
User guide TMS320C64x DSP Two-Level Internal Memory Reference Guide (Rev. C) 2006年 2月 28日
User guide TMS320C6000 DSP Host-Post Interface (HPI) Reference Guide (Rev. C) 2006年 1月 1日
Application note TMS320C6410 Hardware Designer's Resource Guide (Rev. B) 2005年 10月 24日
Application note Migrating from TMS320C64x to TMS320C64x+ (Rev. A) 2005年 10月 20日
User guide TMS320C6000 DSP Power-Down Logic and Modes Reference Guide (Rev. C) 2005年 3月 1日
User guide TMS320C6000 DSP 32-bit Timer Reference Guide (Rev. B) 2005年 1月 25日
Application note TMS320C6410/13 Power Consumption Summary 2004年 9月 20日
Application note Use and Handling of Semiconductor Packages With ENIG Pad Finishes 2004年 8月 31日
User guide TMS320C6000 Chip Support Library API Reference Guide (Rev. J) 2004年 8月 13日
User guide TMS320C6410/13/18 DSP Inter-Integrated Circuit (I2C) Module Addendum to SPRU175 (Rev. A) 2004年 8月 13日
Application note TMS320C64x Reference Design 2004年 5月 12日
Application note TMS320C6000 Tools: Vector Table and Boot ROM Creation (Rev. D) 2004年 4月 26日
Application note TMS320C6000 Board Design: Considerations for Debug (Rev. C) 2004年 4月 21日
User guide TMS320C6000 DSP General-Purpose Input/Output (GPIO) Reference Guide (Rev. A) 2004年 3月 25日
Application note TMS320C6000 McBSP Initialization (Rev. C) 2004年 3月 8日
Application note TMS320C6000 EDMA IO Scheduling and Performance 2004年 3月 5日
Application note TMS320C64x DSP Host Port Interface (HPI) Performance 2003年 10月 24日
Application note TMS320C6000 EMIF to TMS320C6000 Host Port Interface (Rev. B) 2003年 9月 12日
User guide TMS320C6000 DSP Designing for JTAG Emulation Reference Guide 2003年 7月 31日
User guide TMS320C6000 DSP Cache User's Guide (Rev. A) 2003年 5月 5日
Application note Using IBIS Models for Timing Analysis (Rev. A) 2003年 4月 15日
Application note TMS320C6000 McBSP Interface to an ST-BUS Device (Rev. B) 2002年 6月 4日
Application note TMS320C6000 Board Design for JTAG (Rev. C) 2002年 4月 2日
Application note TMS320C6000 EMIF to External Flash Memory (Rev. A) 2002年 2月 13日
Application note Cache Usage in High-Performance DSP Applications with the TMS320C64x 2001年 12月 13日
Application note Using a TMS320C6000 McBSP for Data Packing (Rev. A) 2001年 10月 31日
Application note TMS320C6000 Enhanced DMA: Example Applications (Rev. A) 2001年 10月 24日
Application note TMS320C6000 Host Port to MC68360 Interface (Rev. A) 2001年 9月 30日
Application note TMS320C6000 EMIF to External Asynchronous SRAM Interface (Rev. A) 2001年 8月 31日
Application note TMS320C6000 Host Port to the i80960 Microprocessors Interface (Rev. A) 2001年 8月 31日
Application note Using the TMS320C6000 McBSP as a High Speed Communication Port (Rev. A) 2001年 8月 31日
Application note TMS320C6000 McBSP to Voice Band Audio Processor (VBAP) Interface (Rev. A) 2001年 7月 23日
Application note TMS320C6000 McBSP: AC'97 Codec Interface (TLV320AIC27) (Rev. A) 2001年 7月 10日
Application note TMS320C6000 McBSP: Interface to SPI ROM (Rev. C) 2001年 6月 30日
Application note TMS320C6000 Host Port to MPC860 Interface (Rev. A) 2001年 6月 21日
Application note TMS320C6000 McBSP: IOM-2 Interface (Rev. A) 2001年 5月 21日
Application note Circular Buffering on TMS320C6000 (Rev. A) 2000年 9月 12日
Application note TMS320C6000 McBSP as a TDM Highway (Rev. A) 2000年 9月 11日
Application note TMS320C6000 Multichannel Communications System Interface 2000年 2月 3日
Application note TMS320C6000 u-Law and a-Law Companding with Software or the McBSP 2000年 2月 2日
Application note General Guide to Implement Logarithmic and Exponential Operations on Fixed-Point 2000年 1月 31日
Application note TMS320C6000 C Compiler: C Implementation of Intrinsics 1999年 12月 7日
Application note TMS320C6000 HPI Boot Operation 1999年 1月 6日

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偵錯探測器

TMDSEMU560V2STM-U — XDS560v2 System Trace USB 偵錯探測器

XDS560v2 是 XDS560™ 偵錯探測器系列的最高性能表現,支援傳統 JTAG 標準 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。請注意,序列線偵錯 (SWD) 不受支援。

所有 XDS 偵錯探測器均支援所有具有嵌入式追踪緩衝區 (ETB) 的 ARM 和 DSP 處理器中的核心和系統追蹤功能。對於針腳追蹤則需要 XDS560v2 PRO TRACE

XDS560v2 透過 MIPI HSPT 60 針腳接頭 (具有用於 TI 14 針腳、TI 20 針腳和 ARM 20 針腳的多轉接器) 連接到目標電路板,並透過 USB2.0 高速 (480Mbps) (...)

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偵錯探測器

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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驅動程式或資料庫

SPRC264 — TMS320C5000/6000 映像庫 (IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
使用指南: PDF
驅動程式或資料庫

SPRC265 — TMS320C6000 DSP 庫 (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
使用指南: PDF
驅動程式或資料庫

TELECOMLIB — 電信和媒體庫 - 用於 TMS320C64x+ 和 TMS320C55x 處理器的 FAXLIB、VoLIB 和 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

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模擬型號

C6410 GTS BSDL Model (Rev. B)

SPRM148B.ZIP (7 KB) - BSDL Model
模擬型號

C6410 GTS IBIS Model (Rev. A)

SPRM149A.ZIP (96 KB) - IBIS Model
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  • 工具包括 IDE/編譯器、偵錯和追蹤、模擬和建模軟體及快閃程式設計師。
  • OS 包含 TI 處理器支援的作業系統。
  • 應用軟體意指特定應用程式軟體,包括在 TI 處理器上執行的中介軟體和程式庫。
  • SOM 意指系統模組解決方案
配置圖

TMS320C6410 ORCAD Symbol

SPRC172.ZIP (5 KB)
封裝 引腳 下載
OMFCBGA (GTS) 288 檢視選項
OMFCBGA (ZTS) 288 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

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若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

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