產品詳細資料

DSP type 0 Operating system Linux Ethernet MAC 10/100 Rating Catalog Operating temperature range (°C) -40 to 85
DSP type 0 Operating system Linux Ethernet MAC 10/100 Rating Catalog Operating temperature range (°C) -40 to 85
NFBGA (ZCE) 338 169 mm² 13 x 13
  • Highlights
    • High-Performance Digital Media System-on-Chip (DMSoC)
    • Up to 300-MHz ARM926EJ-S Clock Rate
    • Two Video Image Co-processors (HDVICP, MJCP) Engines
    • Supports a Range of Encode, Decode, and Video Quality Operations
    • Video Processing Subsystem
      • HW Face Detect Engine
      • Resize Engine from 1/16x to 8x
      • 16-Bit Parallel AFE (Analog Front-End) Interface Up to 120 MHz
      • 4:2:2 (8-/16-bit) Interface
      • 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
      • 3 DACs for HD Analog Video Output
      • Hardware On-Screen Display (OSD)
    • Capable of 720p 30fps H.264 video processing
      Note: 216-MHz is only capable of D1 processing
    • Peripherals include EMAC, USB 2.0 OTG, DDR2/NAND, 5 SPIs, 2 UARTs, 2 MMC/SD/SDIO, Key Scan
    • 8 Different Boot Modes and Configurable Power-Saving Modes
    • Pin-to-pin and software compatible with DM368
    • Extended temperature (-40°C - 85°C) available for 300-Mhz device
    • 3.3-V and 1.8-V I/O, 1.2-V/1.35-V Core
    • 338-Pin Ball Grid Array at 65nm Process Technology
  • High-Performance Digital Media System-on-Chip (DMSoC)
    • 216-, 270-, 300-MHz ARM926EJ-S Clock Rate
    • Fully Software-Compatible With ARM9™
  • ARM926EJ-S™ Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 32K-Byte RAM
    • 16K-Byte ROM
    • Little Endian
  • Two Video Image Co-processors (HDVICP, MJCP) Engines
    • Support a Range of Encode and Decode Operations
    • H.264, MPEG4, MPEG2, MJPEG, JPEG, WMV9/VC1
  • Video Processing Subsystem
    • Front End Provides:
      • HW Face Detect Engine
      • Hardware IPIPE for Real-Time Image Processing
        • Resize Engine
          • Resize Images From 1/16× to 8×
          • Separate Horizontal/Vertical Control
          • Two Simultaneous Output Paths
      • IPIPE Interface (IPIPEIF)
      • Image Sensor Interface (ISIF) and CMOS Imager Interface
      • 16-Bit Parallel AFE (Analog Front End) Interface Up to 120 MHz
      • Glueless Interface to Common Video Decoders
      • BT.601/BT.656/BT.1120 Digital YCbCr 4:2:2 (8-/16-Bit Module
      • Histogram Module
      • Lens distortion correction module (LDC)
      • Hardware 3A statistics collection module (H3A)
    • Back End Provides:
      • Hardware On-Screen Display (OSD)
      • Composite NTSC/PAL video encoder output
      • 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
      • 3 DACs for HD Analog Video Output
      • LCD Controller
      • BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
  • Analog-to-Digital Convertor (ADC)
  • Power Management and Real Time Clock Subsystem (PRTCSS)
    • Real Time Clock
  • 16-Bit Host-Port Interface (HPI)
  • 10/100 Mb/s Ethernet Media Access Controller (EMAC) - Digital Media
    • IEEE 802.3 Compliant
    • Supports Media Independent Interface (MII)
    • Management Data I/O (MDIO) Module
  • Key Scan
  • Voice Codec
  • External Memory Interfaces (EMIFs)
    • DDR2 and mDDR SDRAM 16-bit wide EMIF With 256 MByte Address Space (1.8-V I/O)
    • Asynchronous16-/8-bit Wide EMIF (AEMIF)
      • Flash Memory Interfaces
        • NAND (8-/16-bit Wide Data)
        • 16 MB NOR Flash, SRAM
        • OneNAND(16-bit Wide Data)
  • Flash Card Interfaces
    • Two Multimedia Card (MMC) / Secure Digital (SD/SDIO)
    • SmartMedia/xD
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • USB port with Integrated 2.0 High-Speed PHY that Supports
    • USB 2.0 High-Speed Device
    • USB 2.0 High-Speed Host (mini-host, supporting one external device)
    • USB On The Go (HS-USB OTG)
  • Four 64-Bit General-Purpose Timers (each configurable as two 32-bit timers)
  • One 64-Bit Watch Dog Timer
  • Two UARTs (One fast UART with RTS and CTS Flow Control)
  • Five Serial Port Interfaces (SPI) each with two Chip-Selects
  • One Master/Slave Inter-Integrated Circuit (I2C) Bus™
  • One Multi-Channel Buffered Serial Port (McBSP)
    • I2S
    • AC97 Audio Codec Interface
    • S/PDIF via Software
    • Standard Voice Codec Interface (AIC12)
    • SPI Protocol (Master Mode Only)
    • Direct Interface to T1/E1 Framers
    • Time Division Multiplexed Mode (TDM)
    • 128 Channel Mode
  • Four Pulse Width Modulator (PWM) Outputs
  • Four RTO (Real Time Out) Outputs
  • Up to 104 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • Boot Modes
    • On-Chip ARM ROM Bootloader (RBL) to Boot From NAND Flash, MMC/SD, UART, USB, SPI, EMAC, or HPI
    • AEMIF (NOR and OneNAND)
  • Configurable Power-Saving Modes
  • Crystal or External Clock Input (typically 19.2 Mhz, 24 MHz, 27 Mhz or 36 MHz)
  • Flexible PLL Clock Generators
  • Debug Interface Support
    • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
    • ETB (Embedded Trace Buffer) with 4K-Bytes Trace Buffer memory
    • Device Revision ID Readable by ARM
  • 338-Pin Ball Grid Array (BGA) Package (ZCE Suffix), 0.65-mm Ball Pitch
  • 65nm Process Technology
  • 3.3-V and 1.8-V I/O, 1.2-V/ 1.35-V Internal
  • Community Reesources

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.

Windows is a trademark of Microsoft.

All other trademarks are the property of their respective owners.

  • Highlights
    • High-Performance Digital Media System-on-Chip (DMSoC)
    • Up to 300-MHz ARM926EJ-S Clock Rate
    • Two Video Image Co-processors (HDVICP, MJCP) Engines
    • Supports a Range of Encode, Decode, and Video Quality Operations
    • Video Processing Subsystem
      • HW Face Detect Engine
      • Resize Engine from 1/16x to 8x
      • 16-Bit Parallel AFE (Analog Front-End) Interface Up to 120 MHz
      • 4:2:2 (8-/16-bit) Interface
      • 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
      • 3 DACs for HD Analog Video Output
      • Hardware On-Screen Display (OSD)
    • Capable of 720p 30fps H.264 video processing
      Note: 216-MHz is only capable of D1 processing
    • Peripherals include EMAC, USB 2.0 OTG, DDR2/NAND, 5 SPIs, 2 UARTs, 2 MMC/SD/SDIO, Key Scan
    • 8 Different Boot Modes and Configurable Power-Saving Modes
    • Pin-to-pin and software compatible with DM368
    • Extended temperature (-40°C - 85°C) available for 300-Mhz device
    • 3.3-V and 1.8-V I/O, 1.2-V/1.35-V Core
    • 338-Pin Ball Grid Array at 65nm Process Technology
  • High-Performance Digital Media System-on-Chip (DMSoC)
    • 216-, 270-, 300-MHz ARM926EJ-S Clock Rate
    • Fully Software-Compatible With ARM9™
  • ARM926EJ-S™ Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 32K-Byte RAM
    • 16K-Byte ROM
    • Little Endian
  • Two Video Image Co-processors (HDVICP, MJCP) Engines
    • Support a Range of Encode and Decode Operations
    • H.264, MPEG4, MPEG2, MJPEG, JPEG, WMV9/VC1
  • Video Processing Subsystem
    • Front End Provides:
      • HW Face Detect Engine
      • Hardware IPIPE for Real-Time Image Processing
        • Resize Engine
          • Resize Images From 1/16× to 8×
          • Separate Horizontal/Vertical Control
          • Two Simultaneous Output Paths
      • IPIPE Interface (IPIPEIF)
      • Image Sensor Interface (ISIF) and CMOS Imager Interface
      • 16-Bit Parallel AFE (Analog Front End) Interface Up to 120 MHz
      • Glueless Interface to Common Video Decoders
      • BT.601/BT.656/BT.1120 Digital YCbCr 4:2:2 (8-/16-Bit Module
      • Histogram Module
      • Lens distortion correction module (LDC)
      • Hardware 3A statistics collection module (H3A)
    • Back End Provides:
      • Hardware On-Screen Display (OSD)
      • Composite NTSC/PAL video encoder output
      • 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
      • 3 DACs for HD Analog Video Output
      • LCD Controller
      • BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
  • Analog-to-Digital Convertor (ADC)
  • Power Management and Real Time Clock Subsystem (PRTCSS)
    • Real Time Clock
  • 16-Bit Host-Port Interface (HPI)
  • 10/100 Mb/s Ethernet Media Access Controller (EMAC) - Digital Media
    • IEEE 802.3 Compliant
    • Supports Media Independent Interface (MII)
    • Management Data I/O (MDIO) Module
  • Key Scan
  • Voice Codec
  • External Memory Interfaces (EMIFs)
    • DDR2 and mDDR SDRAM 16-bit wide EMIF With 256 MByte Address Space (1.8-V I/O)
    • Asynchronous16-/8-bit Wide EMIF (AEMIF)
      • Flash Memory Interfaces
        • NAND (8-/16-bit Wide Data)
        • 16 MB NOR Flash, SRAM
        • OneNAND(16-bit Wide Data)
  • Flash Card Interfaces
    • Two Multimedia Card (MMC) / Secure Digital (SD/SDIO)
    • SmartMedia/xD
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • USB port with Integrated 2.0 High-Speed PHY that Supports
    • USB 2.0 High-Speed Device
    • USB 2.0 High-Speed Host (mini-host, supporting one external device)
    • USB On The Go (HS-USB OTG)
  • Four 64-Bit General-Purpose Timers (each configurable as two 32-bit timers)
  • One 64-Bit Watch Dog Timer
  • Two UARTs (One fast UART with RTS and CTS Flow Control)
  • Five Serial Port Interfaces (SPI) each with two Chip-Selects
  • One Master/Slave Inter-Integrated Circuit (I2C) Bus™
  • One Multi-Channel Buffered Serial Port (McBSP)
    • I2S
    • AC97 Audio Codec Interface
    • S/PDIF via Software
    • Standard Voice Codec Interface (AIC12)
    • SPI Protocol (Master Mode Only)
    • Direct Interface to T1/E1 Framers
    • Time Division Multiplexed Mode (TDM)
    • 128 Channel Mode
  • Four Pulse Width Modulator (PWM) Outputs
  • Four RTO (Real Time Out) Outputs
  • Up to 104 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • Boot Modes
    • On-Chip ARM ROM Bootloader (RBL) to Boot From NAND Flash, MMC/SD, UART, USB, SPI, EMAC, or HPI
    • AEMIF (NOR and OneNAND)
  • Configurable Power-Saving Modes
  • Crystal or External Clock Input (typically 19.2 Mhz, 24 MHz, 27 Mhz or 36 MHz)
  • Flexible PLL Clock Generators
  • Debug Interface Support
    • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
    • ETB (Embedded Trace Buffer) with 4K-Bytes Trace Buffer memory
    • Device Revision ID Readable by ARM
  • 338-Pin Ball Grid Array (BGA) Package (ZCE Suffix), 0.65-mm Ball Pitch
  • 65nm Process Technology
  • 3.3-V and 1.8-V I/O, 1.2-V/ 1.35-V Internal
  • Community Reesources

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.

Windows is a trademark of Microsoft.

All other trademarks are the property of their respective owners.

Developers can now deliver pixel-perfect images at up to 720p H.264 at 30fps in their digital video designs without concerns of video format support, constrained network bandwidth, limited system storage capacity or cost with the new TMS320DM365 digital media processor based on DaVinci technology from Texas Instruments Incorporated (TI). With multi-format HD video, the DM365 also features a suite of peripherals saving developers on system costs.

This ARM9-based DM365 device offers speeds up to 300 MHz and supports production-qualified H.264, MPEG-4, MPEG-2, MJPEG and VC1/WMV9 codecs providing customers with the flexibility to select the right video codec for their application. These codecs are driven from video accelerators offloading compression needs from the ARM core so that developers can utilize the most performance from the ARM for their application. Video surveillance designers achieve greater compression efficiency providing more storage without straining the network bandwidth. Developers of media playback and camera-driven applications, such as video doorbells, digital signage, digital video recorders, portable media players and more can ensure interoperability as well as product scalability by taking advantage of the full suite of codecs supported on the DM365.

Along with multi-format HD video, the DM365 enables seamless interface to most additional external devices required for video applications. The image sensor interface is flexible enough to support CCD, CMOS, and various other interfaces such as BT.656, BT1120. The DM365 also offers a high level of integration with HD display support including, 3 built-in 10-bit HD Analog Video Digital to Analog Converters (DACs), DDR2/mDDR, Ethernet MAC, USB 2.0, integrated audio, Host Port Interface (HPI), Analog to Digital Converter, and many more features saving developers on overall system costs as well as real estate on their circuit boards allowing for a slimmer, sleeker design.

Developers can now deliver pixel-perfect images at up to 720p H.264 at 30fps in their digital video designs without concerns of video format support, constrained network bandwidth, limited system storage capacity or cost with the new TMS320DM365 digital media processor based on DaVinci technology from Texas Instruments Incorporated (TI). With multi-format HD video, the DM365 also features a suite of peripherals saving developers on system costs.

This ARM9-based DM365 device offers speeds up to 300 MHz and supports production-qualified H.264, MPEG-4, MPEG-2, MJPEG and VC1/WMV9 codecs providing customers with the flexibility to select the right video codec for their application. These codecs are driven from video accelerators offloading compression needs from the ARM core so that developers can utilize the most performance from the ARM for their application. Video surveillance designers achieve greater compression efficiency providing more storage without straining the network bandwidth. Developers of media playback and camera-driven applications, such as video doorbells, digital signage, digital video recorders, portable media players and more can ensure interoperability as well as product scalability by taking advantage of the full suite of codecs supported on the DM365.

Along with multi-format HD video, the DM365 enables seamless interface to most additional external devices required for video applications. The image sensor interface is flexible enough to support CCD, CMOS, and various other interfaces such as BT.656, BT1120. The DM365 also offers a high level of integration with HD display support including, 3 built-in 10-bit HD Analog Video Digital to Analog Converters (DACs), DDR2/mDDR, Ethernet MAC, USB 2.0, integrated audio, Host Port Interface (HPI), Analog to Digital Converter, and many more features saving developers on overall system costs as well as real estate on their circuit boards allowing for a slimmer, sleeker design.

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透過第三方支援

此產品沒有 TI 的持續直接設計支援。如在進行設計時需相關支援,您可聯絡以下第三方:D3 Engineering、elnfochips、Ittiam Systems、Path Partner Technology 或 Z3 Technologies。

技術文件

star =TI 所選的此產品重要文件
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類型 標題 日期
* Data sheet TMS320DM365 Digital Media System-on-Chip datasheet (Rev. E) 2011年 7月 1日
* Errata TMS320DM365 Digital Media System-on-Chip Silicon Errata (Silicon Revs 1.1 & 1.2) (Rev. E) 2011年 7月 11日
Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023年 2月 24日
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 2020年 6月 1日
User guide TMS320DM36x DaVinci™ Video Processing Front End (VPFE) User's Guide (Rev. C) 2016年 6月 30日
Application note Powering the TMS320DM365 using the TPS650061 2012年 5月 10日
User guide TMS320DM36x DMSoC Power Management and Real-Time Clock Subsystem User's Guide (Rev. B) 2011年 8月 3日
Application note Migrating From TMS320DM35x to TMS320DM36x Devices (Rev. A) 2011年 6月 2日
User guide TMS320DM36x DMSoC General-Purpose Input/Output User's Guide (Rev. C) 2011年 1月 19日
User guide TMS320DM36x DMSoC Ethernet Media Access Controller (EMAC) User's Guide (Rev. B) 2010年 12月 23日
User guide TMS320DM36x DMSoC Video Processing Front End User's Guide (Rev. C) 2010年 11月 12日
User guide TMS320DM36x DMSoC Video Processing Back End User's Guide (Rev. C) 2010年 8月 26日
User guide TMS320DM36x DMSoC Voice Codec User's Guide (Rev. B) 2010年 7月 30日
User guide TMS320DM36x DMSoC Face Detection User's Guide (Rev. A) 2010年 7月 21日
Application note Application Parameter Settings for TMS320DM365 H.264 Encoder 2010年 4月 29日
User guide TMS320DM36x DMSoC Asynchronous External Memory Interface User's Guide (Rev. C) 2010年 4月 23日
User guide TMS320DM36x DMSoC Multimedia Card/Secure Digital Card Controller User's Guide (Rev. B) 2010年 4月 23日
Application note Migrating from TMS320DM365 to TMS320DM368 2010年 4月 11日
More literature TMS320DM3x DaVinci Video Processors 2010年 4月 11日
User guide TMS320DM36x DMSoC Key Scan User's Guide (Rev. A) 2010年 3月 1日
User guide TMS320DM36x DMSoC Serial Peripheral Interface User's Guide (Rev. B) 2010年 3月 1日
Application note Smart Codec Features in TMS320DM365 2009年 12月 9日
Application note TMS320DM365 Preview of Codec Porting on Linux 2009年 12月 4日
Application note Understanding H.264 Decoder Buffer Mechanism for TMS320DM365 2009年 12月 4日
Application note High-Efficiency Power Solution Using DC/DC Converter for the DM365 (Rev. A) 2009年 9月 11日
Application note Simple Power Solution Using LDOs for the DM365 (Rev. A) 2009年 9月 11日
Application note High Integration, High Efficiency Power Solution using DCDC Converters for DM365 (Rev. A) 2009年 9月 11日
Application note TMS320DM36x Power Consumption Summary 2009年 9月 10日
User guide TMS320DM36x DMSoC Universal Host Port Interface User's Guide (Rev. A) 2009年 8月 9日
User guide TMS320DM36x DMSoC ARM Subsystem Reference Guide (Rev. A) 2009年 8月 7日
User guide TMS320DM36x DMSoC Inter-Integrated Circuit User's Guide (Rev. A) 2009年 8月 7日
User guide TMS320DM36x DMSoC Multichannel Buffered Serial Port User's Guide (Rev. A) 2009年 8月 7日
User guide TMS320DM36x DMSoC Universal Serial Bus User's Guide (Rev. A) 2009年 8月 7日
Application note High Integration, High Efficiency Power Solution using DCDC Converters for DM365 2009年 8月 4日
Application note High-Vin, High-Efficiency Power Solution Using DC/DC Converter for the DM365 2009年 8月 4日
Application note Simple Power Solution Using LDOs for the DM365 2009年 8月 4日
Application note TMS320DM36x SoC Architecture and Throughput 2009年 7月 29日
Application note LSP 2.10 DaVinci Linux Drivers (Rev. A) 2009年 7月 8日
More literature Complimentary Analog Devices for DM365 Digital Media Processor 2009年 3月 3日
User guide TMS320DM36x DMSoC Analog to Digital Converter User's Guide 2009年 3月 3日
User guide TMS320DM36x DMSoC DDR2/mDDR Memory Controller User's Guide 2009年 3月 3日
User guide TMS320DM36x DMSoC Enhanced Direct Memory Access Controller User's Guide 2009年 3月 3日
User guide TMS320DM36x DMSoC Pulse-Width Modulator User's Guide 2009年 3月 3日
User guide TMS320DM36x DMSoC Real Time Out User's Guide 2009年 3月 3日
User guide TMS320DM36x DMSoC Timer/Watchdog Timer User's Guide 2009年 3月 3日
User guide TMS320DM36x DMSoC Universal Asynchronous Receiver/Transmitter User's Guide 2009年 3月 3日
Application note Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A) 2008年 7月 17日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TMDXEVM368 — TMS320DM36x 評估模組

The TMS320DM36x Digital Video Evaluation Module (DVEVM) enables developers to start immediate evaluation of TI’s Digital Media (DMx) processors and begin building digital video applications such as IP security cameras, action cameras, drones, wearables, digital signage, video doorbells, and (...)

使用指南: PDF
TI.com 無法提供
偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器 (模擬器)。與低成本 XDS110 和高效能 XDS560v2 相比,XDS200 是兼具低成本與優異效能的完美平衡,可在單一 pod 中支援各種標準 (IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探測器均支援具嵌入式追踪緩衝區 (ETB) 的 Arm® 與 DSP 處理器中的核心和系統追蹤功能。透過針腳進行核心追蹤則需要 XDS560v2 PRO TRACE

XDS200 透過 TI 20 針腳連接器 (配備適用 TI 14 針腳、Arm Cortex® 10 針腳和 Arm 20 針腳的多重轉接器) (...)

TI.com 無法提供
偵錯探測器

TMDSEMU560V2STM-U — XDS560v2 System Trace USB 偵錯探測器

XDS560v2 是 XDS560™ 偵錯探測器系列的最高性能表現,支援傳統 JTAG 標準 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。請注意,序列線偵錯 (SWD) 不受支援。

所有 XDS 偵錯探測器均支援所有具有嵌入式追踪緩衝區 (ETB) 的 ARM 和 DSP 處理器中的核心和系統追蹤功能。對於針腳追蹤則需要 XDS560v2 PRO TRACE

XDS560v2 透過 MIPI HSPT 60 針腳接頭 (具有用於 TI 14 針腳、TI 20 針腳和 ARM 20 針腳的多轉接器) 連接到目標電路板,並透過 USB2.0 高速 (480Mbps) (...)

TI.com 無法提供
偵錯探測器

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

TI.com 無法提供
軟體開發套件 (SDK)

LINUXDVSDK-DM36X — 用於 DM365、DM368 數位媒體處理器的 Linux 數位視訊軟體開發套件 (DVSDK)

The Linux™ Digital Video Software Development Kits (DVSDKs) enable DaVinci™ system integrators to quickly develop Linux-based multimedia applications that can be easily ported across different devices in the DaVinci platform. Each DVSDK combines a pre-tested set of operating system, application (...)
軟體轉碼器

DM365CODECS Codecs for DM36x (DM365, DM368) - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into audio, video and voice applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes (...)

支援產品和硬體

支援產品和硬體

產品
數位訊號處理器 (DSP)
TMS320DM365 DaVinci 數位媒體處理器 TMS320DM368 DaVinci 數位媒體處理器
下載選項
模擬型號

DM365 ZCE BSDL Model

SPRM363.ZIP (9 KB) - BSDL Model
模擬型號

DM365 ZCE IBIS Model (Rev. C)

SPRM354C.ZIP (502 KB) - IBIS Model
設計工具

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TI 已與公司合作,提供各種使用 TI 處理器的軟體、工具和 SOM 以加速生產。下載此搜尋工具,以快速瀏覽我們的第三方解決方案,並找出符合您需求的正確協力廠商。此處列出的軟體、工具和模組,皆由獨立第三方而非由德州儀器生產及管理。

搜尋工具會依產品類型分類,如下所示:

  • 工具包括 IDE/編譯器、偵錯和追蹤、模擬和建模軟體及快閃程式設計師。
  • OS 包含 TI 處理器支援的作業系統。
  • 應用軟體意指特定應用程式軟體,包括在 TI 處理器上執行的中介軟體和程式庫。
  • SOM 意指系統模組解決方案
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  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

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