SBASAP4 April   2025 ADC3664-EP , ADC3664-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - Power Consumption
    6. 5.6 Electrical Characteristics - DC Specifications
    7. 5.7 Electrical Characteristics - AC Specifications
    8. 5.8 Timing Requirements
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
        1. 7.3.1.1 Analog Input Bandwidth
        2. 7.3.1.2 Analog Front End Design
          1. 7.3.1.2.1 Sampling Glitch Filter Design
          2. 7.3.1.2.2 Analog Input Termination and DC Bias
            1. 7.3.1.2.2.1 AC-Coupling
            2. 7.3.1.2.2.2 DC-Coupling
      2. 7.3.2 Clock Input
        1. 7.3.2.1 Single Ended vs Differential Clock Input
      3. 7.3.3 Voltage Reference
        1. 7.3.3.1 Internal voltage reference
        2. 7.3.3.2 External voltage reference (VREF)
        3. 7.3.3.3 External voltage reference with internal buffer (REFBUF/CTRL)
      4. 7.3.4 Digital Down Converter
        1. 7.3.4.1 DDC MUX
        2. 7.3.4.2 Digital Filter Operation
        3. 7.3.4.3 FS/4 Mixing with Real Output
        4. 7.3.4.4 Numerically Controlled Oscillator (NCO) and Digital Mixer
        5. 7.3.4.5 Decimation Filter
        6. 7.3.4.6 SYNC
        7. 7.3.4.7 Output Formatting with Decimation
      5. 7.3.5 Digital Interface
        1. 7.3.5.1 Output Formatter
        2. 7.3.5.2 Output Bit Mapper
          1. 7.3.5.2.1 2-Wire Mode
          2. 7.3.5.2.2 1-Wire Mode
          3. 7.3.5.2.3 ½-Wire Mode
        3. 7.3.5.3 Output Interface and Mode Configuration
          1. 7.3.5.3.1 Configuration Example
        4. 7.3.5.4 Output Data Format
      6. 7.3.6 Test Pattern
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal operation
      2. 7.4.2 Power Down Options
    5. 7.5 Programming
      1. 7.5.1 Configuration using PINs only
      2. 7.5.2 Configuration using the SPI interface
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Signal Path
        2. 8.2.2.2 Sampling Clock
        3. 8.2.2.3 Voltage Reference
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
      1. 8.3.1 Register Initialization During Operation
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Register Maps
    1. 9.1 Detailed Register Description
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSB|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.5.4 Output Data Format

The output data is configured to two's complement (default) or offset binary formatting using SPI register writes (register 0x8F and 0x92). Table 7-8 provides an overview for minimum and maximum output codes for the two formatting options. The actual output resolution is set by the output bit mapper.

Table 7-8 Overview of minimum and maximum output codes vs output resolution for different formatting
Two's Complement (default)Offset Binary
RESOLUTION (BIT)14161416
VIN,MAX0x1FFF0x7FFF0x3FFF0xFFFF
00x00000x20000x8000
VIN,MIN0x20000x80000x0000