SBAS925A August 2018 – November 2018 ADS1119
Good power-supply decoupling is important to achieve optimum performance. As shown in Figure 47, AVDD and DVDD must be decoupled with at least a 0.1-µF capacitor. Place the bypass capacitors as close to the power-supply pins of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground planes. Connect analog and digital grounds together as close to the device as possible.