SLVSMZ0
September 2026
ADS111S02
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Switching Characteristics
6.8
Timing Diagram
7
Parameter Measurement Information
7.1
Noise Performance
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
Multiplexer
8.3.2
Voltage Reference
8.3.3
Oscillator
8.3.4
Output Data Rate and Conversion Time
8.3.5
Low-Noise PGA
8.3.6
Temperature Sensor
8.3.6.1
12-Bit Temperature Data Format (ADS101S02)
8.3.6.2
Converting from Digital Codes to Temperature, 12-Bit Temperature Sensor Data
8.3.6.3
14-Bit Temperature Data Format (ADS101S02)
8.3.6.4
Converting from Digital Codes to Temperature, 14-Bit Temperature Sensor Data
8.4
Device Functional Modes
8.4.1
Power-Up and Reset
8.4.2
Operating Modes
8.4.2.1
Single-Shot Conversion Mode
8.4.2.2
Continuous-Conversion Mode
8.5
Programming
8.5.1
Serial Interface (SPI)
8.5.2
Chip Select (CS)
8.5.3
Serial Clock (SCLK)
8.5.4
Data Input (DIN)
8.5.5
Data Output and Data Ready (DOUT/DRDY)
8.5.6
Data Retrieval and Device Configuration
8.5.6.1
32-Bit Data Transmission Cycle
8.5.6.2
16-Bit Data Transmission Cycle
8.6
Conversion Data Format
9
Register Maps
10
Application and Implementation
10.1
Application Information
10.1.1
Serial Interface Connections
10.1.2
Connecting Multiple Devices
10.1.3
Single-Ended Inputs
10.1.4
Unused Inputs and Outputs
10.1.5
Input Protection
10.1.6
Analog Input Filtering
10.1.7
Duty Cycling For Low Power
10.1.8
Pseudo Code Example
10.2
Typical Applications
10.2.1
K-Type Thermocouple with Thermistor Cold-Junction Compensation
10.2.1.1
Design Requirements
10.2.1.2
Detailed Design Procedure
10.2.2
Server Card System Monitoring Application
10.3
Power Supply Recommendations
10.3.1
Power-Supply Sequencing
10.3.2
Power-Supply Decoupling
10.4
Layout
10.4.1
Layout Guidelines
10.4.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Revision History
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RUG|10
MPQF216D
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsmz0_oa
11.1
Documentation Support