SBASAA4A July   2023  â€“ January 2025 ADS131B24-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagram
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Offset Drift Measurement
    2. 6.2 Gain Drift Measurement
    3. 6.3 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Naming Conventions
      2. 7.3.2 Precision Voltage References (REFA, REFB)
      3. 7.3.3 Clocking (MCLK, OSCM, OSCD)
      4. 7.3.4 ADC1y
        1. 7.3.4.1 ADC1y Input Multiplexer
        2. 7.3.4.2 ADC1y Programmable Gain Amplifier (PGA)
        3. 7.3.4.3 ADC1y ΔΣ Modulator
        4. 7.3.4.4 ADC1y Digital Filter
        5. 7.3.4.5 ADC1y Offset and Gain Calibration
        6. 7.3.4.6 ADC1y Conversion Data
      5. 7.3.5 ADC2y
        1. 7.3.5.1 ADC2y Input Multiplexer
        2. 7.3.5.2 ADC2y Programmable Gain Amplifier (PGA)
        3. 7.3.5.3 ADC2y ΔΣ Modulator
        4. 7.3.5.4 ADC2y Digital Filter
        5. 7.3.5.5 ADC2y Offset and Gain Calibration
        6. 7.3.5.6 ADC2y Sequencer
        7. 7.3.5.7 VCMy Buffers
        8. 7.3.5.8 ADC2y Measurement Configurations
        9. 7.3.5.9 ADC2y Conversion Data
      6. 7.3.6 General-Purpose Digital Inputs and Outputs (GPIO0 to GPIO4)
        1. 7.3.6.1 GPIOx PWM Output Configuration
        2. 7.3.6.2 GPIOx PWM Input Readback
      7. 7.3.7 General-Purpose Digital Inputs and Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B)
      8. 7.3.8 Monitors and Diagnostics
        1. 7.3.8.1  Supply Monitors
        2. 7.3.8.2  Clock Monitors
        3. 7.3.8.3  Digital Monitors
          1. 7.3.8.3.1 Register Map CRC
          2. 7.3.8.3.2 Memory Map CRC
          3. 7.3.8.3.3 GPIO Readback
        4. 7.3.8.4  Communication Monitors
        5. 7.3.8.5  Fault Flags and Fault Masking
        6. 7.3.8.6  FAULT Pin
        7. 7.3.8.7  Diagnostics and Diagnostic Procedure
        8. 7.3.8.8  Indicators
        9. 7.3.8.9  Conversion and Sequence Counters
        10. 7.3.8.10 Supply Voltage Readback
        11. 7.3.8.11 Temperature Sensors (TSA, TSB)
        12. 7.3.8.12 Test DACs (TDACA, TDACB)
        13. 7.3.8.13 Open-Wire Detection
        14. 7.3.8.14 Missing Host Detection and MHD Pin
        15. 7.3.8.15 Overcurrent Comparators (OCCA, OCCB)
          1. 7.3.8.15.1 OCCA and OCCB Pins
          2. 7.3.8.15.2 Overcurrent Indication Response Time
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Up and Reset
        1. 7.4.1.1 Power-On Reset (POR)
        2. 7.4.1.2 RESETn Pin
        3. 7.4.1.3 RESET Command
      2. 7.4.2 Operating Modes
        1. 7.4.2.1 Active Mode
        2. 7.4.2.2 Standby Mode
        3. 7.4.2.3 Power-Down Mode
      3. 7.4.3 ADC Conversion Modes
        1. 7.4.3.1 ADC1y Conversion Modes
          1. 7.4.3.1.1 Continuous-Conversion Mode
          2. 7.4.3.1.2 Single-Shot Conversion Mode
          3. 7.4.3.1.3 Global-Chop Mode
            1. 7.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode
        2. 7.4.3.2 ADC2y Sequencer Operation and Sequence Modes
          1. 7.4.3.2.1 Continuous Sequence Mode
          2. 7.4.3.2.2 Single-Shot Sequence Mode
          3. 7.4.3.2.3 Synchronized Single-Shot Sequence Mode Based on ADC1y Conversion Starts
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Serial Interface Signals
          1. 7.5.1.1.1 Chip Select (CSn)
          2. 7.5.1.1.2 Serial Data Clock (SCLK)
          3. 7.5.1.1.3 Serial Data Input (SDI)
          4. 7.5.1.1.4 Serial Data Output (SDO)
          5. 7.5.1.1.5 Data Ready (DRDYn)
        2. 7.5.1.2 Serial Interface Communication Structure
          1. 7.5.1.2.1 SPI Communication Frames
          2. 7.5.1.2.2 SPI Communication Words
          3. 7.5.1.2.3 STATUS Word
          4. 7.5.1.2.4 Communication Cyclic Redundancy Check (CRC)
          5. 7.5.1.2.5 Commands
            1. 7.5.1.2.5.1 NULL (0000 0000 0000 0000b)
            2. 7.5.1.2.5.2 RESET (0000 0000 0001 0001b)
            3. 7.5.1.2.5.3 LOCK (0000 0101 0101 0101b)
            4. 7.5.1.2.5.4 UNLOCK (0000 0110 0101 0101b)
            5. 7.5.1.2.5.5 WREG (011a aaaa aaa0 0nnnb)
            6. 7.5.1.2.5.6 RREG (101a aaaa aaan nnnnb)
          6. 7.5.1.2.6 SCLK Counter
          7. 7.5.1.2.7 SPI Timeout
          8. 7.5.1.2.8 Reading ADC1A, ADC1B, ADC2A, and ADC2B Conversion Data
          9. 7.5.1.2.9 DRDYn Pin Behavior
  9. 8 Register Map
    1. 8.1 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Unused Inputs and Outputs
      2. 9.1.2 Minimum Interface Connections
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Current-Shunt Measurement
        2. 9.2.2.2 Battery-Pack Voltage Measurement
        3. 9.2.2.3 Shunt Temperature Measurement
        4. 9.2.2.4 Analog Output Temperature Sensor Measurement
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Supply Options
        1. 9.3.1.1 Single Unregulated External 4-V to 16-V Supply (3.3-V Digital I/O Levels)
        2. 9.3.1.2 Single Regulated External 3.3-V Supply (3.3-V Digital IO Levels)
        3. 9.3.1.3 Single Regulated External 5-V Supply (5-V Digital I/O Levels)
      2. 9.3.2 Power-Supply Sequencing
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
7.5.1.2.2 SPI Communication Words

An SPI communication frame of the ADS131B24-Q1 is made of multiple words. The word size is configurable as either 24 bits, or 32 bits using the WORD_LENGTH bit in the DEVICE_CFG register. The content within each word is always most significant bit (MSB) aligned and least significant bit (LSB) padded with zeros to accommodate 24-bit or 32-bit word sizes. Table 7-23 provides an overview of all available word types and the actual unpadded data length of the respective content.

Table 7-23 Unpadded Data Length of Individual Word Types
DIRECTION WORD TYPE UNPADDED DATA LENGTH
SDI Command 16 bits
SDI Command CRC 16 bits
SDI Register data for WREG command 16 bits
SDI Register data CRC for WREG command 16 bits
SDO STATUS 24 bits
SDO ADC1A and ADC1B conversion data 24 bits
SDO Register data for RREG command 16 bits register data + 8 bits register address
SDO Output CRC 16 bits

Figure 7-29 and Figure 7-30 show the bit alignments and zero padding within the individual words for a WREG and RREG command, respectively.

ADS131B24-Q1 Bit Alignment, 24-Bit Word Size, WREG Command Figure 7-29 Bit Alignment, 24-Bit Word Size, WREG Command
ADS131B24-Q1 Bit Alignment, 24-Bit Word Size, RREG Command Figure 7-30 Bit Alignment, 24-Bit Word Size, RREG Command