SBAS652A May   2014  – August 2014 ADS7950-Q1 , ADS7951-Q1 , ADS7952-Q1 , ADS7953-Q1 , ADS7954-Q1 , ADS7956-Q1 , ADS7957-Q1 , ADS7958-Q1 , ADS7959-Q1 , ADS7960-Q1 , ADS7961-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ADS7950-Q1, ADS7951-Q1, ADS7952-Q1, ADS7953-Q1
    6. 7.6  Electrical Characteristics: ADS7954-Q1, ADS7956-Q1, ADS7957-Q1
    7. 7.7  Electrical Characteristics: ADS7958-Q1, ADS7959-Q1, ADS7960-Q1, ADS7961-Q1
    8. 7.8  Timing Requirements
    9. 7.9  Typical Characteristics (All ADS79xx-Q1 Family Devices)
    10. 7.10 Typical Characteristics (12-Bit Devices Only)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Operation
      2. 8.3.2 Device Power-up Sequence
      3. 8.3.3 Analog Input
      4. 8.3.4 Reference
      5. 8.3.5 Power Saving
    4. 8.4 Device Functional Modes
      1. 8.4.1 Channel Sequencing Modes
      2. 8.4.2 Device Programming and Mode Control
        1. 8.4.2.1 Mode Control Register
        2. 8.4.2.2 Program Registers
      3. 8.4.3 Operating In Manual Mode
      4. 8.4.4 Operating In Auto-1 Mode
      5. 8.4.5 Operating In Auto-2 Mode
      6. 8.4.6 Continued Operation In A Selected Mode
    5. 8.5 Digital Output Code
    6. 8.6 Programming: GPIO
      1. 8.6.1 GPIO Registers
      2. 8.6.2 Alarm Thresholds for GPIO Pins
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Unbuffered Multiplexer Output (MXO)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 OPA192 Buffered Multiplexer Output (MXO)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Do's and Don'ts
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 14. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ADS7950-Q1 Click here Click here Click here Click here Click here
ADS7951-Q1 Click here Click here Click here Click here Click here
ADS7952-Q1 Click here Click here Click here Click here Click here
ADS7953-Q1 Click here Click here Click here Click here Click here
ADS7954-Q1 Click here Click here Click here Click here Click here
ADS7956-Q1 Click here Click here Click here Click here Click here
ADS7957-Q1 Click here Click here Click here Click here Click here
ADS7958-Q1 Click here Click here Click here Click here Click here
ADS7959-Q1 Click here Click here Click here Click here Click here
ADS7960-Q1 Click here Click here Click here Click here Click here
ADS7961-Q1 Click here Click here Click here Click here Click here

12.3 Trademarks

SPI is a trademark of Motorola Inc.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.