SPRS657F February 2010 – January 2017 AM1705
This section describes the device orderable part numbers, packaging options, materials, thermal and mechanical parameters.
The following table(s) show the thermal resistance characteristics for the PowerPADTM PTP mechanical package.
|No.||°C/W(1)||°C/W(2)||°C/W(3)||°C/W(4)||AIR FLOW (m/s)(5)|
This section highlights a few important details about the 176-pin PTP PowerPAD™ package. Texas Instruments' PowerPAD Thermally Enhanced Package Technical Brief (SLMA002) should be consulted when creating a PCB footprint for this device.
As illustrated in Figure 8-1, the standoff height specification for this device (between 0.050 mm and 0.150 mm) is measured from the seating plane established by the three lowest package pins to the lowest point on the package body. Due to warpage, the lowest point on the package body is located in the center of the package at the exposed thermal pad.
Using this definition of standoff height provides the correct result for determining the correct solder paste thickness. According to TI's PowerPAD Thermally Enhanced Package Technical Brief (SLMA002), the recommended range of solder paste thickness for this package is between 0.152 mm and 0.178 mm.
In general, for proper thermal performance, the thermal pad under the package body should be as large as possible. However, the soldermask opening for the PowerPAD™ should be sized to match the pad size on the 176-pin PTP package; as illustrated in Figure 8-2.
The following packaging information and addendum reflect the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document.