SPRS999 August   2017 AM5718-HIREL


  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. Revision History
  3. Device Comparison
    1. 3.1 Device Comparison Table
  4. Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Ports (VIP)
      2. 4.4.2  Display Subsystem - Video Output Ports
      3. 4.4.3  Display Subsystem - High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  Camera Serial Interface 2 CAL bridge (CSI2)
      5. 4.4.5  External Memory Interface (EMIF)
      6. 4.4.6  General-Purpose Memory Controller (GPMC)
      7. 4.4.7  Timers
      8. 4.4.8  Inter-Integrated Circuit Interface (I2C)
      9. 4.4.9  HDQ / 1-Wire Interface (HDQ1W)
      10. 4.4.10 Universal Asynchronous Receiver Transmitter (UART)
      11. 4.4.11 Multichannel Serial Peripheral Interface (McSPI)
      12. 4.4.12 Quad Serial Peripheral Interface (QSPI)
      13. 4.4.13 Multichannel Audio Serial Port (McASP)
      14. 4.4.14 Universal Serial Bus (USB)
      15. 4.4.15 SATA
      16. 4.4.16 Peripheral Component Interconnect Express (PCIe)
      17. 4.4.17 Controller Area Network Interface (DCAN)
      18. 4.4.18 Ethernet Interface (GMAC_SW)
      19. 4.4.19 Media Local Bus (MLB) Interface
      20. 4.4.20 eMMC/SD/SDIO
      21. 4.4.21 General-Purpose Interface (GPIO)
      22. 4.4.22 Keyboard controller (KBD)
      23. 4.4.23 Pulse Width Modulation (PWM) Interface
      24. 4.4.24 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      25. 4.4.25 Test Interfaces
      26. 4.4.26 System and Miscellaneous
        1. Sysboot
        2. Power, Reset, and Clock Management (PRCM)
        3. Real-Time Clock (RTC) Interface
        4. System Direct Memory Access (SDMA)
        5. Interrupt Controllers (INTC)
        6. Observability
      27. 4.4.27 Power Supplies
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power On Hours (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  LVCMOS CSI2 DC Electrical Characteristics
      8. 5.7.8  BMLB18 Buffers DC Electrical Characteristics
      9. 5.7.9  BC1833IHHV Buffers DC Electrical Characteristics
      10. 5.7.10 USBPHY DC Electrical Characteristics
      11. 5.7.11 Dual Voltage SDIO1833 DC Electrical Characteristics
      12. 5.7.12 Dual Voltage LVCMOS DC Electrical Characteristics
      13. 5.7.13 SATAPHY DC Electrical Characteristics
      14. 5.7.14 SERDES DC Electrical Characteristics
    8. 5.8 Thermal Characteristics
      1. 5.8.1 Package Thermal Characteristics
    9. 5.9 Power Supply Sequences
  6. Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. OSC0 External Crystal
        2. OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. OSC1 External Crystal
        2. OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. RTC Oscillator External Crystal
        2. RTC Oscillator Input Clock
    2. 6.2 DPLLs, DLLs Specifications
      1. 6.2.1 DPLL Characteristics
      2. 6.2.2 DLL Characteristics
  7. Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 1.8V and 3.3V Signal Transition Levels
        2. 1.8V and 3.3V Signal Transition Rates
        3. Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem - Video Output Ports
    8. 7.8  Display Subsystem - High-Definition Multimedia Interface (HDMI)
    9. 7.9  Camera Serial Interface 2 CAL bridge (CSI2)
      1. 7.9.1 CSI-2 MIPI D-PHY-1.5 V and 1.8 V
    10. 7.10 External Memory Interface (EMIF)
    11. 7.11 General-Purpose Memory Controller (GPMC)
      1. 7.11.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.11.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.11.3 GPMC/NAND Flash Interface Asynchronous Timing
    12. 7.12 Timers
    13. 7.13 Inter-Integrated Circuit Interface (I2C)
    14. 7.14 HDQ / 1-Wire Interface (HDQ1W)
      1. 7.14.1 HDQ / 1-Wire - HDQ Mode
      2. 7.14.2 HDQ/1-Wire-1-Wire Mode
    15. 7.15 Universal Asynchronous Receiver Transmitter (UART)
    16. 7.16 Multichannel Serial Peripheral Interface (McSPI)
    17. 7.17 Quad Serial Peripheral Interface (QSPI)
    18. 7.18 Multichannel Audio Serial Port (McASP)
    19. 7.19 Universal Serial Bus (USB)
      1. 7.19.1 USB1 DRD PHY
      2. 7.19.2 USB2 PHY
    20. 7.20 Serial Advanced Technology Attachment (SATA)
    21. 7.21 Peripheral Component Interconnect Express (PCIe)
    22. 7.22 Controller Area Network Interface (DCAN)
    23. 7.23 Ethernet Interface (GMAC_SW)
      1. 7.23.1 GMAC MII Timings
      2. 7.23.2 GMAC MDIO Interface Timings
      3. 7.23.3 GMAC RMII Timings
      4. 7.23.4 GMAC RGMII Timings
    24. 7.24 eMMC/SD/SDIO
      1. 7.24.1 MMC1-SD Card Interface
        1. Default speed, 4-bit data, SDR, half-cycle
        2. High speed, 4-bit data, SDR, half-cycle
        3. SDR12, 4-bit data, half-cycle
        4. SDR25, 4-bit data, half-cycle
        5. UHS-I SDR50, 4-bit data, half-cycle
        6. UHS-I SDR104, 4-bit data, half-cycle
        7. UHS-I DDR50, 4-bit data
      2. 7.24.2 MMC2 - eMMC
        1. Standard JC64 SDR, 8-bit data, half cycle
        2. High-speed JC64 SDR, 8-bit data, half cycle
        3. High-speed HS200 JEDS84, 8-bit data, half cycle
        4. High-speed JC64 DDR, 8-bit data
      3. 7.24.3 MMC3 and MMC4-SDIO/SD
        1. MMC3 and MMC4, SD Default Speed
        2. MMC3 and MMC4, SD High Speed
        3. MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. MMC3 and MMC4, SD SDR25 Mode
        5. MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
    25. 7.25 General-Purpose Interface (GPIO)
    26. 7.26 PRU-ICSS Interfaces
      1. 7.26.1 Programmable Real-Time Unit (PRU-ICSS PRU)
        1. PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
        2. PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
        3. PRU-ICSS PRU Shift Mode Electrical Data and Timing
        4. PRU-ICSS PRU Sigma Delta and EnDAT Modes
      2. 7.26.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
        1. PRU-ICSS ECAT Electrical Data and Timing
      3. 7.26.3 PRU-ICSS MII_RT and Switch
        1. PRU-ICSS MDIO Electrical Data and Timing
        2. PRU-ICSS MII_RT Electrical Data and Timing
      4. 7.26.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
      5. 7.26.5 PRU-ICSS Manual Functional Mapping
    27. 7.27 System and Miscellaneous interfaces
    28. 7.28 Test Interfaces
      1. 7.28.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. JTAG Electrical Data/Timing
      2. 7.28.2 Trace Port Interface Unit (TPIU)
        1. TPIU PLL DDR Mode
  8. Applications, Implementation, and Layout
    1. 8.1 Power Supply Mapping
    2. 8.2 DDR3 Board Design and Layout Guidelines
      1. 8.2.1 DDR3 General Board Layout Guidelines
      2. 8.2.2 DDR3 Board Design and Layout Guidelines
        1.  Board Designs
        2.  DDR3 EMIF
        3.  DDR3 Device Combinations
        4.  DDR3 Interface Schematic
          1. 32-Bit DDR3 Interface
          2. 16-Bit DDR3 Interface
        5.  Compatible JEDEC DDR3 Devices
        6.  PCB Stackup
        7.  Placement
        8.  DDR3 Keepout Region
        9.  Bulk Bypass Capacitors
        10. High-Speed Bypass Capacitors
          1. Return Current Bypass Capacitors
        11. Net Classes
        12. DDR3 Signal Termination
        13. VREF_DDR Routing
        14. VTT
        15. CK and ADDR_CTRL Topologies and Routing Definition
          1. Four DDR3 Devices
            1. CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. Two DDR3 Devices
            1. CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. One DDR3 Device
            1. CK and ADDR_CTRL Topologies, One DDR3 Device
            2. CK and ADDR/CTRL Routing, One DDR3 Device
        16. Data Topologies and Routing Definition
          1. DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. Routing Specification
          1. CK and ADDR_CTRL Routing Specification
          2. DQS and DQ Routing Specification
    3. 8.3 High Speed Differential Signal Routing Guidance
    4. 8.4 Power Distribution Network Implementation Guidance
    5. 8.5 Single-Ended Interfaces
      1. 8.5.1 General Routing Guidelines
      2. 8.5.2 QSPI Board Design and Layout Guidelines
    6. 8.6 Clock Routing Guidelines
      1. 8.6.1 32-kHz Oscillator Routing
      2. 8.6.2 Oscillator Ground Connection
  9. Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 Community Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  10. 10Mechanical Packaging and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZBO|760
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

TI offers an extensive line of development tools, including methods to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules as listed below.

Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, AM571x). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

For orderable part numbers of AM571x devices in the ZBO package type, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the Silicon Errata (literature number SPRZ436).

Standard Package Symbolization

AM5718-HIREL SPRS906_PACK_01.gif Figure 9-1 Printed Device Reference


Some devices have a cosmetic circular marking visible on the top of the device package which results from the production test process. These markings are cosmetic only with no reliability impact.

Device Naming Convention

Table 9-1 Nomenclature Description

a Device evolution stage X Prototype
P Preproduction (production test flow, no reliability data)
BLANK Production
BBBBBB Base production part number AM5718 High Tier (See Table 3-1, Device Comparison)
r Device revision BLANK SR 1.0
A SR 2.0
PPP Package designator ZBO ZBO S-PBGA-N760 (23 mm × 23 mm) Package
z Device Speed X Indicates the speed grade for each of the cores in the device. For more information see Table 5-5, Speed Grade Maximum Frequency
Ss Security Identifier TU Dummy key secure device
BLANK General purpose device
Yy Device type E All industrial protocols enabled (basic protocols plus EtherCAT slave and POWERLINK slave)
BLANK Basic industrial protocols enabled
Yn Letter followed by number indicates HS device with customer key
Tt Temperature (2) EP Extended (see Table 5-4, Recommended Operating Conditions)
XXXXXXX Lot Trace Code (LTC)
YYY Production Code, For TI use only
ZZZ Production Code, For TI use only
O Pin one designator
  1. To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices.
    Prototype devices are shipped against the following disclaimer:
    “This product is still under development and is intended for internal evaluation purposes.”
    Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, of this device.
  2. Applies to device max junction temperature.


BLANK in the symbol or part number is collapsed so there are no gaps between characters.

Tools and Software

The following products support development for AM571x platforms:

AM571x Register Descriptor Tool is an interactive device register configuration tool that allows users to visualize the register state on power-on reset, and then customize the configuration of the device for the specific use-case.

AM571x Clock Tree Tool is interactive clock tree configuration software that allows the user to visualize the device clock tree, interact with clock tree elements and view the effect on PRCM registers, interact with the PRCM registers and view the effect on the device clock tree, and view a trace of all the device registers affected by the user interaction with the clock tree.

AM571x Pin Mux Utility is an interactive application that helps a system designer select the appropriate pin-multiplexing configuration for their device-based product design. The Pin Mux Utility provides a way to select valid IO Sets of specific peripheral interfaces to ensure the pinmultiplexing configuration selected for a design only uses valid IO Sets supported by the device.

For a complete listing of development-support tools for the processor platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

Documentation Support

The following documents describe the AM571x devices.

    TRM AM571x SitaraTM Processors Technical Reference Manual Details the integration, the environment, the functional description, and the programming models for each peripheral and subsystem in the AM571x family of devices.
    Errata AM571x SitaraTM Processors Silicon Errata Describes known advisories, limitations, and cautions on silicon and provides workarounds.

Receiving Notification of Documentation Updates

To receive notification of documentation updates — including silicon errata — go to the product folder for your device on www.ti.com. In the upper right-hand corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI Embedded Processors WikiTexas Instruments Embedded Processors Wiki.

    Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.


ICEPick and SmartReflex are trademarks of Texas Instruments Incorporated.

ARM and Cortex are registered trademark of ARM Limited.

ETB, ARM9, CoreSight, and Neon are trademarks of ARM Limited.

HDMI is a trademark of HDMI Licensing, LLC.

HDQ is a trademark of Benchmarq.

1-Wire is a registered trademark of Maxim Integrated.

PowerVR is a registered trademark of Imagination Technologies Ltd.

SD is a registered trademark of Toshiba Corporation.

MMC and eMMC are trademarks of MultiMediaCard Association.

MIPI is a registered trademark of the Mobile Industry Processor Interface (MIPI) Alliance.

PCI Express is a registered trademark of PCI-SIG.

MediaLB is a trademark of Standard Microsystems Corporation.

Vivante is a registered trademark of Vivante Corporation.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.


    TI Glossary This glossary lists and explains terms, acronyms, and definitions.