SPRSP77D March   2023  – June 2025 AM62A1-Q1 , AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        17
          2.        18
          3.        19
          4.        20
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        23
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        26
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        29
      6. 5.3.5  DSS
        1. 5.3.5.1 MAIN Domain
          1.        32
      7. 5.3.6  ECAP
        1. 5.3.6.1 MAIN Domain
          1.        35
          2.        36
          3.        37
      8. 5.3.7  Emulation and Debug
        1. 5.3.7.1 MAIN Domain
          1.        40
        2. 5.3.7.2 MCU Domain
          1.        42
      9. 5.3.8  EPWM
        1. 5.3.8.1 MAIN Domain
          1.        45
          2.        46
          3.        47
          4.        48
      10. 5.3.9  EQEP
        1. 5.3.9.1 MAIN Domain
          1.        51
          2.        52
          3.        53
      11. 5.3.10 GPIO
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
        2. 5.3.10.2 MCU Domain
          1.        59
      12. 5.3.11 GPMC
        1. 5.3.11.1 MAIN Domain
          1.        62
      13. 5.3.12 I2C
        1. 5.3.12.1 MAIN Domain
          1.        65
          2.        66
          3.        67
          4.        68
        2. 5.3.12.2 MCU Domain
          1.        70
        3. 5.3.12.3 WKUP Domain
          1.        72
      14. 5.3.13 MCAN
        1. 5.3.13.1 MAIN Domain
          1.        75
        2. 5.3.13.2 MCU Domain
          1.        77
          2.        78
      15. 5.3.14 MCASP
        1. 5.3.14.1 MAIN Domain
          1.        81
          2.        82
          3.        83
      16. 5.3.15 MCSPI
        1. 5.3.15.1 MAIN Domain
          1.        86
          2.        87
          3.        88
        2. 5.3.15.2 MCU Domain
          1.        90
          2.        91
      17. 5.3.16 MDIO
        1. 5.3.16.1 MAIN Domain
          1.        94
      18. 5.3.17 MMC
        1. 5.3.17.1 MAIN Domain
          1.        97
          2.        98
          3.        99
      19. 5.3.18 OSPI
        1. 5.3.18.1 MAIN Domain
          1.        102
      20. 5.3.19 Power Supply
        1.       104
      21. 5.3.20 Reserved
        1.       106
      22. 5.3.21 System and Miscellaneous
        1. 5.3.21.1 Boot Mode Configuration
          1. 5.3.21.1.1 MAIN Domain
            1.         110
        2. 5.3.21.2 Clock
          1. 5.3.21.2.1 MCU Domain
            1.         113
          2. 5.3.21.2.2 WKUP Domain
            1.         115
        3. 5.3.21.3 System
          1. 5.3.21.3.1 MAIN Domain
            1.         118
          2. 5.3.21.3.2 MCU Domain
            1.         120
          3. 5.3.21.3.3 WKUP Domain
            1.         122
        4. 5.3.21.4 VMON
          1.        124
      23. 5.3.22 TIMER
        1. 5.3.22.1 MAIN Domain
          1.        127
        2. 5.3.22.2 MCU Domain
          1.        129
        3. 5.3.22.3 WKUP Domain
          1.        131
      24. 5.3.23 UART
        1. 5.3.23.1 MAIN Domain
          1.        134
          2.        135
          3.        136
          4.        137
          5.        138
          6.        139
          7.        140
        2. 5.3.23.2 MCU Domain
          1.        142
        3. 5.3.23.3 WKUP Domain
          1.        144
      25. 5.3.24 USB
        1. 5.3.24.1 MAIN Domain
          1.        147
          2.        148
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 6.3  ESD Ratings for AEC - Q100 Qualified Devices
    4. 6.4  Power-On Hours (POH)
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Operating Performance Points
    7. 6.7  Power Consumption Summary
    8. 6.8  Electrical Characteristics
      1. 6.8.1 I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.8.2 Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.8.3 High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.8.4 Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.8.5 SDIO Electrical Characteristics
      6. 6.8.6 LVCMOS Electrical Characteristics
      7. 6.8.7 CSI-2 (D-PHY) Electrical Characteristics
      8. 6.8.8 USB2PHY Electrical Characteristics
      9. 6.8.9 DDR Electrical Characteristics
    9. 6.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.9.2 Hardware Requirements
      3. 6.9.3 Programming Sequence
      4. 6.9.4 Impact to Your Hardware Warranty
    10. 6.10 Thermal Resistance Characteristics
      1. 6.10.1 Thermal Resistance Characteristics for AMB and ANF Packages
    11. 6.11 Temperature Sensor Characteristics
    12. 6.12 Timing and Switching Characteristics
      1. 6.12.1 Timing Parameters and Information
      2. 6.12.2 Power Supply Requirements
        1. 6.12.2.1 Power Supply Slew Rate Requirement
        2. 6.12.2.2 Power Supply Sequencing
          1. 6.12.2.2.1 Power-Up Sequencing
          2. 6.12.2.2.2 Power-Down Sequencing
          3. 6.12.2.2.3 Partial IO Power Sequencing
      3. 6.12.3 System Timing
        1. 6.12.3.1 Reset Timing
        2. 6.12.3.2 Error Signal Timing
        3. 6.12.3.3 Clock Timing
      4. 6.12.4 Clock Specifications
        1. 6.12.4.1 Input Clocks / Oscillators
          1. 6.12.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.12.4.1.1.1 Load Capacitance
            2. 6.12.4.1.1.2 Shunt Capacitance
          2. 6.12.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.12.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.12.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.12.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.12.4.2 Output Clocks
        3. 6.12.4.3 PLLs
        4. 6.12.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.12.5 Peripherals
        1. 6.12.5.1  CPSW3G
          1. 6.12.5.1.1 CPSW3G MDIO Timing
          2. 6.12.5.1.2 CPSW3G RMII Timing
          3. 6.12.5.1.3 CPSW3G RGMII Timing
        2. 6.12.5.2  CPTS
        3. 6.12.5.3  CSI-2
        4. 6.12.5.4  DDRSS
        5. 6.12.5.5  DSS
        6. 6.12.5.6  ECAP
        7. 6.12.5.7  Emulation and Debug
          1. 6.12.5.7.1 Trace
          2. 6.12.5.7.2 JTAG
        8. 6.12.5.8  EPWM
        9. 6.12.5.9  EQEP
        10. 6.12.5.10 GPIO
        11. 6.12.5.11 GPMC
          1. 6.12.5.11.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.12.5.11.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.12.5.11.3 GPMC and NAND Flash — Asynchronous Mode
        12. 6.12.5.12 I2C
        13. 6.12.5.13 MCAN
        14. 6.12.5.14 MCASP
        15. 6.12.5.15 MCSPI
          1. 6.12.5.15.1 MCSPI — Controller Mode
          2. 6.12.5.15.2 MCSPI — Peripheral Mode
        16. 6.12.5.16 MMCSD
          1. 6.12.5.16.1 MMC0 - eMMC/SD/SDIO Interface
            1. 6.12.5.16.1.1  Legacy SDR Mode
            2. 6.12.5.16.1.2  High Speed SDR Mode
            3. 6.12.5.16.1.3  High Speed DDR Mode
            4. 6.12.5.16.1.4  HS200 Mode
            5. 6.12.5.16.1.5  Default Speed Mode
            6. 6.12.5.16.1.6  High Speed Mode
            7. 6.12.5.16.1.7  UHS–I SDR12 Mode
            8. 6.12.5.16.1.8  UHS–I SDR25 Mode
            9. 6.12.5.16.1.9  UHS–I SDR50 Mode
            10. 6.12.5.16.1.10 UHS–I DDR50 Mode
            11. 6.12.5.16.1.11 UHS–I SDR104 Mode
          2. 6.12.5.16.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.12.5.16.2.1 Default Speed Mode
            2. 6.12.5.16.2.2 High Speed Mode
            3. 6.12.5.16.2.3 UHS–I SDR12 Mode
            4. 6.12.5.16.2.4 UHS–I SDR25 Mode
            5. 6.12.5.16.2.5 UHS–I SDR50 Mode
            6. 6.12.5.16.2.6 UHS–I DDR50 Mode
            7. 6.12.5.16.2.7 UHS–I SDR104 Mode
        17. 6.12.5.17 OSPI
          1. 6.12.5.17.1 OSPI0 PHY Mode
            1. 6.12.5.17.1.1 OSPI0 With PHY Data Training
            2. 6.12.5.17.1.2 OSPI0 Without Data Training
              1. 6.12.5.17.1.2.1 OSPI0 PHY SDR Timing
              2. 6.12.5.17.1.2.2 OSPI0 PHY DDR Timing
          2. 6.12.5.17.2 OSPI0 Tap Mode
            1. 6.12.5.17.2.1 OSPI0 Tap SDR Timing
            2. 6.12.5.17.2.2 OSPI0 Tap DDR Timing
        18. 6.12.5.18 Timers
        19. 6.12.5.19 UART
        20. 6.12.5.20 USB
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53 Subsystem
      2. 7.2.2 Device/Power Manager
      3. 7.2.3 MCU Arm Cortex-R5F Subsystem
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 C7xV-256 Deep Learning Accelerator
      2. 7.3.2 Vision Pre-processing Accelerator
      3. 7.3.3 JPEG Encoder
      4. 7.3.4 Video Accelerator
    4. 7.4 Other Subsystems
      1. 7.4.1 Dual Clock Comparator (DCC)
      2. 7.4.2 Data Movement Subsystem (DMSS)
      3. 7.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 7.4.4 Peripheral DMA Controller (PDMA)
      5. 7.4.5 Real-Time Clock (RTC)
    5. 7.5 Peripherals
      1. 7.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 7.5.2  Camera Serial Interface Receiver (CSI_RX_IF)
      3. 7.5.3  Display Subsystem (DSS)
      4. 7.5.4  Enhanced Capture (ECAP)
      5. 7.5.5  Error Location Module (ELM)
      6. 7.5.6  Enhanced Pulse Width Modulation (EPWM)
      7. 7.5.7  Error Signaling Module (ESM)
      8. 7.5.8  Enhanced Quadrature Encoder Pulse (EQEP)
      9. 7.5.9  General-Purpose Interface (GPIO)
      10. 7.5.10 General-Purpose Memory Controller (GPMC)
      11. 7.5.11 Global Timebase Counter (GTC)
      12. 7.5.12 Inter-Integrated Circuit (I2C)
      13. 7.5.13 Modular Controller Area Network (MCAN)
      14. 7.5.14 Multichannel Audio Serial Port (MCASP)
      15. 7.5.15 Multichannel Serial Peripheral Interface (MCSPI)
      16. 7.5.16 Multi-Media Card Secure Digital (MMCSD)
      17. 7.5.17 Octal Serial Peripheral Interface (OSPI)
      18. 7.5.18 Timers
      19. 7.5.19 Universal Asynchronous Receiver/Transmitter (UART)
      20. 7.5.20 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ANF|484
  • AMB|484
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)(2)
PARAMETER MIN MAX UNIT
VDD_CORE Core supply -0.3 1.05 V
VDDR_CORE RAM supply -0.3 1.05 V
VDD_CANUART CANUART core supply -0.3 1.05 V
VDDA_CORE_CSIRX0 CSIRX0 core supply -0.3 1.05 V
VDDA_CORE_USB USB0 and USB1 core supply -0.3 1.05 V
VDDA_DDR_PLL0 DDR Deskew PLL supply -0.3 1.05 V
VDDS_DDR DDR PHY IO supply -0.3 1.57 V
VDDS_DDR_C DDR clock IO supply -0.3 1.57 V
VDDS_OSC0 MCU_OSC0 supply -0.3 1.98 V
VDDA_MCU RCOSC, POR, POK, and MCU_PLL0 analog supply -0.3 1.98 V
VDDA_PLL0 MAIN_PLL0 and MAIN_PLL5 analog supply -0.3 1.98 V
VDDA_PLL1 MAIN_PLL1 and MAIN_PLL2 analog supply -0.3 1.98 V
VDDA_PLL2 MAIN_PLL7 and MAIN_PLL17 analog supply -0.3 2.2 V
VDDA_PLL3 MAIN_PLL8 and MAIN_PLL15 analog supply -0.3 1.98 V
VDDA_PLL4 MAIN_PLL12 analog supply -0.3 1.98 V
VDDA_1P8_CSIRX0 CSIRX0 1.8V analog supply -0.3 1.98 V
VDDA_1P8_USB USB0 and USB1 1.8V analog supply -0.3 1.98 V
VDDA_TEMP0 TEMP0 analog supply -0.3 1.98 V
VDDA_TEMP1 TEMP1 analog supply -0.3 2.2 V
VDDA_TEMP2 TEMP2 analog supply -0.3 1.98 V
VPP eFuse ROM programming supply -0.3 1.98 V
VDDSHV_MCU IO supply for IO MCU -0.3 3.63 V
VDDSHV_CANUART IO supply for IO CANUART -0.3 3.63 V
VDDSHV0 IO supply for IO group 0 -0.3 3.63 V
VDDSHV1 IO supply for IO group 1 -0.3 3.63 V
VDDSHV2 IO supply for IO group 2 -0.3 3.63 V
VDDSHV3 IO supply for IO group 3 -0.3 3.63 V
VDDSHV4 IO supply for IO group 4 -0.3 3.63 V
VDDSHV5 IO supply for IO group 5 -0.3 3.63 V
VDDSHV6 IO supply for IO group 6 -0.3 3.63 V
VDDA_3P3_USB USB0 and USB1 3.3V analog supply -0.3 3.63 V
Steady-state max voltage at all fail-safe IO pins MCU_PORz -0.3 3.63 V
MCU_I2C0_SCL, MCU_I2C0_SDA,  WKUP_I2C0_SCL,  WKUP_I2C0_SDA,  EXTINTn
When operating at 1.8V		 -0.3 1.98(3) V
MCU_I2C0_SCL, MCU_I2C0_SDA,  WKUP_I2C0_SCL,  WKUP_I2C0_SDA,  EXTINTn
When operating at 3.3V		 -0.3 3.63(3)
VMON_1P8_SOC -0.3 1.98 V
VMON_3P3_SOC -0.3 3.63 V
VMON_VSYS(4) -0.3 1.98 V
Steady-state max voltage at all other IO pins(5) USB0_VBUS, USB1_VBUS(6) -0.3 3.6 V
All other IO pins -0.3 IO supply voltage + 0.3 V
Transient overshoot and undershoot at IO pin 20% of IO supply voltage for up to 20% of the signal period (see Figure 6-1, IO Transient Voltage Ranges) 0.2 × VDD(7) V
Latch-up performance(8) I-Test -100 100 mA
Over-Voltage (OV) Test 1.5 x VDD(7) V
TSTG Storage temperature -55 +150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Section 6.5, Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to VSS, unless otherwise noted.
(3) The absolute maximum ratings for these fail-safe pins depends on their IO supply operating voltage. Therefore, this value is also defined by the maximum VIH value found in the I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics section, where the electrical characteristics table has separate parameter values for 1.8V mode and 3.3V mode.
(4) The VMON_VSYS pin provides a way to monitor the system power supply. For more information, see Section 8.2.4, System Power Supply Monitor Design Guidelines.
(5) This parameter applies to all IO pins which are not fail-safe and the requirement applies to all values of IO supply voltage. For example, if the voltage applied to a specific IO supply is 0 volts the valid input voltage range for any IO powered by that supply will be –0.3 to +0.3 volts. Special attention should be applied anytime peripheral devices are not powered from the same power sources used to power the respective IO supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range, including power supply ramp-up and ramp-down sequences.
(6) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see Section 8.2.3, USB Design Guidelines.
(7) VDD is the voltage on the corresponding power-supply pin(s) for the IO.
(8) For current pulse injection (I-Test):
  • Pins stressed per JEDEC JESD78 (Class II) and passed with specified I/O pin injection current and clamp voltage of 1.5 times maximum recommended I/O voltage and negative 0.5 times maximum recommended I/O voltage.
For over-voltage performance (Over-Voltage (OV) Test):
  • Supplies stressed per JEDEC JESD78 (Class II) and passed specified voltage injection.

Fail-safe IO terminals are designed such they do not have dependencies on the respective IO power supply voltage. This allows external voltage sources to be connected to these IO terminals when the respective IO power supplies are turned off. The MCU_I2C0_SCL, MCU_I2C0_SDA,  WKUP_I2C0_SCL, WKUP_I2C0_SDA,  EXTINTn, VMON_1P8_SOC, VMON_3P3_SOC, and MCU_PORz are the only fail-safe IO terminals. All other IO terminals are not fail-safe and the voltage applied to them should be limited to the value defined by the Steady State Max. Voltage at all IO pins parameter in Section 6.1.

AM62A7 AM62A7-Q1 AM62A3 AM62A3-Q1 AM62A1-Q1 IO Transient Voltage Ranges
A. Tovershoot + Tundershoot < 20% of Tperiod
Figure 6-1 IO Transient Voltage Ranges