SWRS296A July   2023  – February 2024 AWRL1432

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
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  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Supply Specifications
      1. 7.5.1 Power Optimized 3.3V I/O Topology
      2. 7.5.2 BOM Optimized 3.3V I/O Topology
      3. 7.5.3 Power Optimized 1.8V I/O Topology
      4. 7.5.4 BOM Optimized 1.8V I/O Topology
      5. 7.5.5 System Topologies
        1. 7.5.5.1 Power Topologies
          1. 7.5.5.1.1 BOM Optimized Mode
          2. 7.5.5.1.2 Power Optimized Mode
      6. 7.5.6 Noise and Ripple Specifications
    6. 7.6  Power Save Modes
      1. 7.6.1 Typical Power Consumption Numbers
    7. 7.7  Peak Current Requirement per Voltage Rail
    8. 7.8  RF Specification
    9. 7.9  Supported DFE Features
    10. 7.10 CPU Specifications
    11. 7.11 Thermal Resistance Characteristics
    12. 7.12 Timing and Switching Characteristics
      1. 7.12.1  Power Supply Sequencing and Reset Timing
      2. 7.12.2  Synchronized Frame Triggering
      3. 7.12.3  Input Clocks and Oscillators
        1. 7.12.3.1 Clock Specifications
      4. 7.12.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.12.4.1 McSPI Features
        2. 7.12.4.2 SPI Timing Conditions
        3. 7.12.4.3 SPI—Controller Mode
          1. 7.12.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.12.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.12.4.4 SPI—Peripheral Mode
          1. 7.12.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.12.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.12.5  RDIF Interface Configuration
        1. 7.12.5.1 RDIF Interface Timings
        2. 7.12.5.2 RDIF Data Format
      6. 7.12.6  LIN
      7. 7.12.7  General-Purpose Input/Output
        1. 7.12.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.12.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.12.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 7.12.9  Serial Communication Interface (SCI)
        1. 7.12.9.1 SCI Timing Requirements
      10. 7.12.10 Inter-Integrated Circuit Interface (I2C)
        1. 7.12.10.1 I2C Timing Requirements
      11. 7.12.11 Quad Serial Peripheral Interface (QSPI)
        1. 7.12.11.1 QSPI Timing Conditions
        2. 7.12.11.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.12.11.3 QSPI Switching Characteristics
      12. 7.12.12 JTAG Interface
        1. 7.12.12.1 JTAG Timing Conditions
        2. 7.12.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.12.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
      2. 8.3.2 Clock Subsystem
      3. 8.3.3 Transmit Subsystem
      4. 8.3.4 Receive Subsystem
      5. 8.3.5 Processor Subsystem
      6. 8.3.6 Automotive Interface
      7. 8.3.7 Host Interface
      8. 8.3.8 Main Subsystem Cortex-M4F
      9. 8.3.9 Hardware Accelerator (HWA1.2) Features
        1. 8.3.9.1 Hardware Accelerator Feature Differences Between HWA1.1 and HWA1.2
    4. 8.4 Other Subsystems
      1. 8.4.1 GPADC Channels (Service) for User Application
      2. 8.4.2 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Reference Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • AMF|102
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.12.12.2 Timing Requirements for IEEE 1149.1 JTAG

NO.MINTYPMAXUNIT
1tc(TCK)Cycle time TCK66.66ns
1atw(TCKH)Pulse duration TCK high (40% of tc)20ns
1btw(TCKL)Pulse duration TCK low(40% of tc)20ns
3tsu(TDI-TCK)Input setup time TDI valid to TCK high2.5ns
tsu(TMS-TCK)Input setup time TMS valid to TCK high2.5ns
4th(TCK-TDI)Input hold time TDI valid from TCK high18ns
th(TCK-TMS)Input hold time TMS valid from TCK high18ns