SLUSEG4B December   2022  – February 2024 BQ25628 , BQ25629

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power-On-Reset (POR)
      2. 8.3.2  Device Power Up from Battery
      3. 8.3.3  Device Power Up from Input Source
        1. 8.3.3.1 REGN LDO Power Up
        2. 8.3.3.2 Poor Source Qualification
        3. 8.3.3.3 D+/D– Detection Sets Input Current Limit (BQ25629)
        4. 8.3.3.4 ILIM Pin (BQ25628 Only)
        5. 8.3.3.5 Input Voltage Limit Threshold Setting (VINDPM Threshold)
        6. 8.3.3.6 Converter Power-Up
      4. 8.3.4  Power Path Management
        1. 8.3.4.1 Narrow VDC Architecture
        2. 8.3.4.2 Dynamic Power Management
        3. 8.3.4.3 High Impedance Mode
      5. 8.3.5  Battery Charging Management
        1. 8.3.5.1 Autonomous Charging Cycle
        2. 8.3.5.2 Battery Charging Profile
        3. 8.3.5.3 Charging Termination
        4. 8.3.5.4 Thermistor Qualification
          1. 8.3.5.4.1 Advanced Temperature Profile in Charge Mode
          2. 8.3.5.4.2 TS Pin Thermistor Configuration
          3. 8.3.5.4.3 Cold/Hot Temperature Window in OTG Mode
          4. 8.3.5.4.4 JEITA Charge Rate Scaling
          5. 8.3.5.4.5 TS_BIAS Pin
        5. 8.3.5.5 Charging Safety Timers
      6. 8.3.6  USB On-The-Go (OTG)
        1. 8.3.6.1 Boost OTG Mode
        2. 8.3.6.2 Bypass OTG Mode
        3. 8.3.6.3 PMID Voltage Indicator (PMID_GD)
      7. 8.3.7  Integrated 12-Bit ADC for Monitoring
      8. 8.3.8  Status Outputs ( STAT, INT)
        1. 8.3.8.1 Interrupts and Status, Flag and Mask Bits
        2. 8.3.8.2 Charging Status Indicator (STAT)
        3. 8.3.8.3 Interrupt to Host ( INT)
      9. 8.3.9  BATFET Control
        1. 8.3.9.1 Shutdown Mode
        2. 8.3.9.2 Ship Mode
        3. 8.3.9.3 System Power Reset
      10. 8.3.10 Protections
        1. 8.3.10.1 Voltage and Current Monitoring in Battery Only and HIZ Modes
          1. 8.3.10.1.1 Battery Undervoltage Lockout
          2. 8.3.10.1.2 Battery Overcurrent Protection
        2. 8.3.10.2 Voltage and Current Monitoring in Buck Mode
          1. 8.3.10.2.1 Input Overvoltage
          2. 8.3.10.2.2 System Overvoltage Protection (SYSOVP)
          3. 8.3.10.2.3 Forward Converter Cycle-by-Cycle Current Limit
          4. 8.3.10.2.4 System Short
          5. 8.3.10.2.5 Battery Overvoltage Protection (BATOVP)
          6. 8.3.10.2.6 Sleep and Poor Source Comparators
          7. 8.3.10.2.7 PMID OVP and VBUS Overcurrent
        3. 8.3.10.3 Voltage and Current Monitoring in Boost Mode
          1. 8.3.10.3.1 Boost Mode Overvoltage Protection
          2. 8.3.10.3.2 Boost Mode Duty Cycle Protection
          3. 8.3.10.3.3 Boost Mode PMID Undervoltage Protection
          4. 8.3.10.3.4 Boost Mode Battery Undervoltage
          5. 8.3.10.3.5 Boost Converter Cycle-by-Cycle Current Limit
          6. 8.3.10.3.6 Boost Mode SYS Short
        4. 8.3.10.4 Voltage and Current Monitoring in Bypass Mode
          1. 8.3.10.4.1 Bypass Mode Overvoltage Protection
          2. 8.3.10.4.2 Bypass Mode Battery OCP
          3. 8.3.10.4.3 Bypass Mode Reverse-Current Protection
          4. 8.3.10.4.4 Bypass Mode Battery Undervoltage
          5. 8.3.10.4.5 Bypass Mode SYS Short
          6. 8.3.10.4.6 Bypass Mode REGN Fault
        5. 8.3.10.5 Thermal Regulation and Thermal Shutdown
          1. 8.3.10.5.1 Thermal Protection in Buck Mode
          2. 8.3.10.5.2 Thermal Protection in Boost Mode
          3. 8.3.10.5.3 Thermal Protection in Battery-Only Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Host Mode and Default Mode
      2. 8.4.2 Register Bit Reset
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Data Validity
        2. 8.5.1.2 START and STOP Conditions
        3. 8.5.1.3 Byte Format
        4. 8.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.5.1.5 Target Address and Data Direction Bit
        6. 8.5.1.6 Single Write and Read
        7. 8.5.1.7 Multi-Write and Multi-Read
    6. 8.6 Register Maps
      1. 8.6.1 Register Programming
      2. 8.6.2 BQ25628 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitor
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RYK|18
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.6.3 PMID Voltage Indicator (PMID_GD)

In BQ25628 and BQ25629, accessory devices can be connected to charger PMID pin to get power either from the adapter through Q1 direct path or from battery boost mode. An optional external PMOS FET can be placed between the PMID pin and accessory input to disconnect the power path during over-current and over-voltage conditions. PMID_GD is used to drive this external PMOS FET through an inverter. PMID_GD HIGH turns on an inverter to pull the PMOS FET gate low to turn on PMOS FET, and PMID_GD LOW turns off the PMOS FET.

Upon adapter plug-in, PMID_GD goes from LOW to HIGH when VBUS rises above VBAT but below VPMID_OVP and passes poor source detection. An adapter voltage that is greater than VPMID_OVP but less than VVBUS_OVP will drive PMID_GD low, but will charge the battery if all other conditions are valid. In this state, the external PMOS FET will stay off to protect the accessory from over-voltage fault.

When the adapter is removed, PMID_GD goes LOW before battery boost mode starts. In battery boost mode, the device regulates PMID voltage to the VOTG register setting as a stable power supply to the accessory devices. PMID_GOOD goes from LOW to HIGH when PMID voltage rises above VOTG_UVPZ. Once PMID voltage is out of this range, PMID_GOOD goes LOW to disconnect the accessory device from PMID. During boost mode, any of the conditions to exit boost mode will also drive PMID_GD from HIGH to LOW. See Section 8.3.6.1 for a list of these conditions.

If the device enters bypass OTG mode, the PMID_GD goes from LOW to HIGH when HSFET (Q2) is enabled. During bypass OTG mode, any conditions to exit will also drive PMID_GD from HIGH to LOW. See Section 8.3.6.2 for a list of these conditions.