SLUSEG4B December   2022  – February 2024 BQ25628 , BQ25629

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power-On-Reset (POR)
      2. 8.3.2  Device Power Up from Battery
      3. 8.3.3  Device Power Up from Input Source
        1. 8.3.3.1 REGN LDO Power Up
        2. 8.3.3.2 Poor Source Qualification
        3. 8.3.3.3 D+/D– Detection Sets Input Current Limit (BQ25629)
        4. 8.3.3.4 ILIM Pin (BQ25628 Only)
        5. 8.3.3.5 Input Voltage Limit Threshold Setting (VINDPM Threshold)
        6. 8.3.3.6 Converter Power-Up
      4. 8.3.4  Power Path Management
        1. 8.3.4.1 Narrow VDC Architecture
        2. 8.3.4.2 Dynamic Power Management
        3. 8.3.4.3 High Impedance Mode
      5. 8.3.5  Battery Charging Management
        1. 8.3.5.1 Autonomous Charging Cycle
        2. 8.3.5.2 Battery Charging Profile
        3. 8.3.5.3 Charging Termination
        4. 8.3.5.4 Thermistor Qualification
          1. 8.3.5.4.1 Advanced Temperature Profile in Charge Mode
          2. 8.3.5.4.2 TS Pin Thermistor Configuration
          3. 8.3.5.4.3 Cold/Hot Temperature Window in OTG Mode
          4. 8.3.5.4.4 JEITA Charge Rate Scaling
          5. 8.3.5.4.5 TS_BIAS Pin
        5. 8.3.5.5 Charging Safety Timers
      6. 8.3.6  USB On-The-Go (OTG)
        1. 8.3.6.1 Boost OTG Mode
        2. 8.3.6.2 Bypass OTG Mode
        3. 8.3.6.3 PMID Voltage Indicator (PMID_GD)
      7. 8.3.7  Integrated 12-Bit ADC for Monitoring
      8. 8.3.8  Status Outputs ( STAT, INT)
        1. 8.3.8.1 Interrupts and Status, Flag and Mask Bits
        2. 8.3.8.2 Charging Status Indicator (STAT)
        3. 8.3.8.3 Interrupt to Host ( INT)
      9. 8.3.9  BATFET Control
        1. 8.3.9.1 Shutdown Mode
        2. 8.3.9.2 Ship Mode
        3. 8.3.9.3 System Power Reset
      10. 8.3.10 Protections
        1. 8.3.10.1 Voltage and Current Monitoring in Battery Only and HIZ Modes
          1. 8.3.10.1.1 Battery Undervoltage Lockout
          2. 8.3.10.1.2 Battery Overcurrent Protection
        2. 8.3.10.2 Voltage and Current Monitoring in Buck Mode
          1. 8.3.10.2.1 Input Overvoltage
          2. 8.3.10.2.2 System Overvoltage Protection (SYSOVP)
          3. 8.3.10.2.3 Forward Converter Cycle-by-Cycle Current Limit
          4. 8.3.10.2.4 System Short
          5. 8.3.10.2.5 Battery Overvoltage Protection (BATOVP)
          6. 8.3.10.2.6 Sleep and Poor Source Comparators
          7. 8.3.10.2.7 PMID OVP and VBUS Overcurrent
        3. 8.3.10.3 Voltage and Current Monitoring in Boost Mode
          1. 8.3.10.3.1 Boost Mode Overvoltage Protection
          2. 8.3.10.3.2 Boost Mode Duty Cycle Protection
          3. 8.3.10.3.3 Boost Mode PMID Undervoltage Protection
          4. 8.3.10.3.4 Boost Mode Battery Undervoltage
          5. 8.3.10.3.5 Boost Converter Cycle-by-Cycle Current Limit
          6. 8.3.10.3.6 Boost Mode SYS Short
        4. 8.3.10.4 Voltage and Current Monitoring in Bypass Mode
          1. 8.3.10.4.1 Bypass Mode Overvoltage Protection
          2. 8.3.10.4.2 Bypass Mode Battery OCP
          3. 8.3.10.4.3 Bypass Mode Reverse-Current Protection
          4. 8.3.10.4.4 Bypass Mode Battery Undervoltage
          5. 8.3.10.4.5 Bypass Mode SYS Short
          6. 8.3.10.4.6 Bypass Mode REGN Fault
        5. 8.3.10.5 Thermal Regulation and Thermal Shutdown
          1. 8.3.10.5.1 Thermal Protection in Buck Mode
          2. 8.3.10.5.2 Thermal Protection in Boost Mode
          3. 8.3.10.5.3 Thermal Protection in Battery-Only Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Host Mode and Default Mode
      2. 8.4.2 Register Bit Reset
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Data Validity
        2. 8.5.1.2 START and STOP Conditions
        3. 8.5.1.3 Byte Format
        4. 8.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.5.1.5 Target Address and Data Direction Bit
        6. 8.5.1.6 Single Write and Read
        7. 8.5.1.7 Multi-Write and Multi-Read
    6. 8.6 Register Maps
      1. 8.6.1 Register Programming
      2. 8.6.2 BQ25628 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitor
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RYK|18
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.8.1 Interrupts and Status, Flag and Mask Bits

The device incorporates an interrupt pin (INT) to inform a host microcontroller of status changes without requiring microcontroller polling. Each reported event has a status field, a flag bit and a mask bit. The status field reports the status at the time that it is read. The flag bit is latched and, once set to 1, will remain at 1 until the host reads the bit, which will clear it to 0. The mask bit determines whether or not an interrupt pulse will be generated when the flag bit is set.


GUID-20210317-CA0I-KWRC-HQHF-NDSVRXVSQWHW-low.png

Figure 8-6 Relationship Between STAT, FLAG, and MASK

The flag bit is set upon certain transitions of the status field. These transitions also generate an INT pulse if the associated mask bit is set to 0. Because the INT is generated from the status field transition and not the flag bit, an INT pulse is sent to the host even if the associated flag is already set to 1 when the status transition occurs. Details of this behavior are shown in Figure 8-6.

The default behavior is to generate a 256-μs INT pulse when any flag bit is set to 1. These pulses may be masked out on a flag-by-flag basis by setting a flag's mask bit to 1. Setting the mask bit does not affect the transition of the flag bit from 0 to 1, only the generation of the 256-μs INT pulse.