SLUSEE3 July   2021 BQ51013B-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Details of a Qi Wireless Power System and BQ51013B-Q1 Power Transfer Flow Diagrams
      2. 9.3.2  Dynamic Rectifier Control
      3. 9.3.3  Dynamic Efficiency Scaling
      4. 9.3.4  RILIM Calculations
      5. 9.3.5  Input Overvoltage
      6. 9.3.6  Adapter Enable Functionality and EN1/EN2 Control
      7. 9.3.7  End Power Transfer Packet (WPC Header 0x02)
      8. 9.3.8  Status Outputs
      9. 9.3.9  WPC Communication Scheme
      10. 9.3.10 Communication Modulator
      11. 9.3.11 Adaptive Communication Limit
      12. 9.3.12 Synchronous Rectification
      13. 9.3.13 Temperature Sense Resistor Network (TS)
      14. 9.3.14 3-State Driver Recommendations for the TS/CTRL Pin
      15. 9.3.15 Thermal Protection
      16. 9.3.16 WPC v1.2 Compliance – Foreign Object Detection
      17. 9.3.17 Receiver Coil Load-Line Analysis
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 BQ51013B-Q1 Wireless Power Receiver Used as a Power Supply
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Using The BQ51013B-Q1 as a Wireless Power Supply: (See Figure 1-1 )
          2. 10.2.1.2.2 Series and Parallel Resonant Capacitor Selection
          3. 10.2.1.2.3 Recommended RX Coils
          4. 10.2.1.2.4 COMM, CLAMP, and BOOT Capacitors
          5. 10.2.1.2.5 Control Pins and CHG
          6. 10.2.1.2.6 Current Limit and FOD
          7. 10.2.1.2.7 RECT and OUT Capacitance
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Dual Power Path: Wireless Power and DC Input
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Wireless and Direct Charging of a Li-Ion Battery at 800 mA
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 Development Support
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Pin Configuration and Functions

The exposed thermal pad should be connected to ground.
Figure 7-1 RHL Package20-Pin VQFNTop View
Table 7-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
AC1 2 I AC input from receiver coil.
AC2 19 I
AD 9 I If AD functionality is used, connect this pin to the wired adapter input. When VAD-Pres is applied to this pin wireless charging is disabled and AD_EN is driven low. Connect a 1-µF capacitor from AD to PGND. If unused, the capacitor is not required and AD should be connected directly to PGND.
AD-EN 8 O Push-pull driver for external PFET when wired charging is active. Float if not used.
BOOT1 3 O Bootstrap capacitors for driving the high-side FETs of the synchronous rectifier. Connect a 10-nF ceramic capacitor from BOOT1 to AC1 and from BOOT2 to AC2.
BOOT2 17 O
CHG 7 O Open-drain output – active when OUT is enabled. Float or tie to PGND if unused.
CLAMP2 16 O Open-drain FETs which are used for a non-power dissipative overvoltage AC clamp protection. When the RECT voltage goes above 15 V, both switches will be turned on and the capacitors will act as a low impedance to protect the device from damage. If used, capacitors are used to connect CLAMP1 to AC1 and CLAMP2 to AC2. Recommended connections are 0.47-µF capacitors.
CLAMP1 5 O
COMM1 6 O Open-drain outputs used to communicate with primary by varying reflected impedance. Connect a capacitor from COMM1 to AC1 and a capacitor from COMM2 to AC2 for capacitive load modulation. For resistive modulation connect COMM1 and COMM2 to RECT through a single resistor. See Section 9.3.10 for more information.
COMM2 15 O
EN1 10 I Inputs that allow user to enable and disable wireless and wired charging <EN1 EN2>:
<00> Wireless charging is enabled unless AD voltage > VAD_Pres.
<01> Dynamic communication current limit disabled.
<10> AD-EN pulled low, wireless charging disabled.
<11> Wired and wireless charging disabled.
EN2 11 I
FOD 14 I Input for the rectified power measurement. See Section 9.3.16 for details.
ILIM 12 I/O Programming pin for the over current limit. The total resistance from ILIM to GND (RILIM) sets the current limit. The schematic shown in Figure 10-1 illustrates the RILIM as R1 + RFOD. Details can be found in Section 8.5 and Figure 10-1.
OUT 4 O Output pin, delivers power to the load.
PGND 1, 20 Power ground
RECT 18 O Filter capacitor for the internal synchronous rectifier. Connect a ceramic capacitor to PGND. Depending on the power levels, the value may be 4.7 μF to 22 μF.
TS/CTRL 13 I Dual function pin: Temperature Sense (TS) and Control (CTRL) pin functionality.
For the TS functionality connect TS/CTRL to ground through a Negative Temperature Coefficient (NTC) resistor. If an NTC function is not desired, connect to PGND with a 10-kΩ resistor. See Section 9.3.13 for more details.
For the CTRL functionality pull below VCTRL-Low or pull above VCTRL-High to send an End Power Transfer Packet. See Table 9-4 for more details.
— PAD — The exposed thermal pad should be connected to ground (PGND)