SWRS293 November   2023 CC1312PSIP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagram – MOT Package (Top View)
    2. 7.2 Signal Descriptions – MOT Package
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF) and RF frequency accuracy
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF) and RTC accuracy
        5. 8.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1.       36
          1. 8.14.4.1.1 Synchronous Serial Interface (SSI) Characteristics
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
      7. 8.16.7 Temperature Compensation
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems, production calibration and temperature compensation
    14. 9.14 Network Processor
    15. 9.15 Device Certification and Qualification
      1. 9.15.1 FCC Certification and Statement
      2. 9.15.2 IC/ISED Certification and Statement
    16. 9.16 Module Markings
    17. 9.17 End Product Labeling
    18. 9.18 Manual Information to the End User
  11. 10Application, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application Circuit
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Reset
      2. 10.2.2 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
    4. 10.4 Reference Designs
  12. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
      1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Device Comparison

DEVICE,

Wireless MCU

RADIO SUPPORTFLASH (KB)RAM + Cache (KB)GPIOPACKAGE SIZE
Sub-1 GHz Prop.2.4GHz Prop.Wireless M-Bus

mioty

Wi-SUN®SidewalkBluetooth® LEZigBeeThreadMultiprotocol+20 dBm PA4 × 4 mm VQFN (24)4 × 4 mm VQFN (32)5 × 5 mm VQFN (32)5 × 5 mm VQFN (40)7 × 7 mm VQFN (48)8 × 8mm VQFN (48)
CC1310XX

X

32-12816-20 + 810-30XXX
CC1311R3XX

X

35232 + 822-30XX
CC1311P3XX

X

X35232 + 826X
CC1312RXX

X

X35280 + 830X
CC1312R7XX

X

XXX704144 + 830X
CC1352RXXX

X

XXXXX35280 + 828X
CC1352PXXX

X

XXXXXX35280 + 826X
CC1352P7XXX

X

XXXXXXX704144 + 826XX
CC1314R10

X

X

X

X

X

X

1024

256 + 8

30-46

X

X

CC1354R10

X

X

X

X

X

X

X

X

X

X

1024

256 + 8

28-42

X

X

CC1354P10

X

X

X

X

X

X

X

X

X

X

X

1024

256 + 8

26-42

X

X

CC2340R2XXX2562812X
CC2340R5XXXX5123612-26XX
CC2340R5-Q1X5123619X
CC2640R2FX12820 + 810-31XXX
CC2642RX35280 + 831X
CC2642R-Q1X35280 + 831X
CC2651R3XXX35232 + 823-31XX
CC2651P3XXXX35232 + 822-26XX
CC2652RXXXXX35280 + 831X
CC2652RBXXXXX35280 + 831X
CC2652R7XXXXX704144 + 831X
CC2652PXXXXXX35280 + 826X
CC2652P7XXXXXX704144 + 826X
CC2662R-Q1X35280 + 831X

CC2674R10

X

X

X

X

X

1024

256 + 8

31-42

X

X

CC2674P10

X

X

X

X

X

X

1024

256 + 826-42

X

X
DEVICE,

Wireless System-in-Package

ANTENNARADIO SUPPORTCERTIFICATIONSFLASH (KB)RAM + Cache (KB)GPIOPACKAGE SIZE
ExternalIntegrated

Sub-1GHz Prop.

2.4 GHz Prop.

Wireless M-Bus

mioty

Wi-SUN®Bluetooth® LEZigBee+10 dBm PA+20 dBm PAFCC/ICCERER (UK)Japan7 × 7 QFM (73)7 × 7 QFM (59)
CC2651R3SIPAXX

X

XXXXX35232 + 832X
CC2652RSIPX

X

XXXXX35280 + 832X
CC2652PSIP

X

X

X

X

X

X

X

X

35280 + 8

30

X

CC1312PSIPX

X

X

X

X

XXXX35280 + 830X