SWAS037B February   2019  – May 2021 CC3135

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.     
    4. 7.4 Connections for Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary: 2.4 GHz RF Band
    6. 8.6  Current Consumption Summary: 5 GHz RF Band
    7. 8.7  TX Power Control for 2.4 GHz Band
    8. 8.8  TX Power Control for 5 GHz
    9. 8.9  Brownout and Blackout Conditions
      1.     
    10. 8.10 Electrical Characteristics for DIO Pins
      1.     
      2.     
    11. 8.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
    12. 8.12 WLAN Receiver Characteristics
      1.     
      2.     
    13. 8.13 WLAN Transmitter Characteristics
      1.     
      2.     
    14. 8.14 WLAN Transmitter Out-of-Band Emissions
      1.     
      2.     
    15. 8.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    16. 8.16 Thermal Resistance Characteristics for RGK Package
    17. 8.17 Timing and Switching Characteristics
      1. 8.17.1 Power Supply Sequencing
      2. 8.17.2 Device Reset
      3. 8.17.3 Reset Timing
        1. 8.17.3.1 nRESET (32-kHz Crystal)
        2.      
        3. 8.17.3.2 nRESET (External 32-kHz Crystal)
          1.       
      4. 8.17.4 Wakeup From HIBERNATE Mode
        1.      
      5. 8.17.5 Clock Specifications
        1. 8.17.5.1 Slow Clock Using Internal Oscillator
          1.       
        2. 8.17.5.2 Slow Clock Using an External Clock
          1.       
        3. 8.17.5.3 Fast Clock (Fref) Using an External Crystal
          1.       
        4. 8.17.5.4 Fast Clock (Fref) Using an External Oscillator
          1.       
      6. 8.17.6 Interfaces
        1. 8.17.6.1 Host SPI Interface Timing
          1.       
        2. 8.17.6.2 Flash SPI Interface Timing
          1.       
        3. 8.17.6.3 DIO Interface Timing
          1. 8.17.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1.        
          2. 8.17.6.3.2 DIO Input Transition Time Parameters
            1.        
    18. 8.18 External Interfaces
      1. 8.18.1 SPI Flash Interface
      2. 8.18.2 SPI Host Interface
      3. 8.18.3 Host UART Interface
        1. 8.18.3.1 5-Wire UART Topology
        2. 8.18.3.2 4-Wire UART Topology
        3. 8.18.3.3 3-Wire UART Topology
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Device Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
      3. 9.2.3 Security
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3 FIPS 140-2 Level 1 Certification
    4. 9.4 Power-Management Subsystem
      1. 9.4.1 VBAT Wide-Voltage Connection
    5. 9.5 Low-Power Operating Modes
      1. 9.5.1 Low-Power Deep Sleep
      2. 9.5.2 Hibernate
      3. 9.5.3 Shutdown
    6. 9.6 Memory
      1. 9.6.1 External Memory Requirements
    7. 9.7 Restoring Factory Default Configuration
    8. 9.8 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1  Third-Party Products Disclaimer
    2. 11.2  Tools and Software
    3. 11.3  Firmware Updates
    4. 11.4  Device Nomenclature
    5. 11.5  Documentation Support
    6. 11.6  Support Resources
    7. 11.7  Trademarks
    8. 11.8  Electrostatic Discharge Caution
    9. 11.9  Export Control Notice
    10. 11.10 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
    2. 12.2 Package Option Addendum
      1. 12.2.1 Packaging Information
      2. 12.2.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Integrated dual-band Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4 GHz and 5 GHz
  • FIPS 140-2 Level 1 certification
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4-GHz radios
  • Industrial temperature: –40°C to +85°C
  • Transferable Wi-Fi Alliance® certification
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11a/b/g/n 2.4 GHz and 5 GHz
      • Modes:
        • Access point (AP)
        • Station (STA)
        • Wi-Fi Direct® (only supported on 2.4 GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always, intermittent, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Multilayered security features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • Application-level security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Application throughput:
    • UDP: 16 Mbps, TCP: 13 Mbps
    • Peak: 72 Mbps
  • Power-management subsystem
    • Integrated DC/DC converters support a wide range of supply voltage:
      • VBAT wide-voltage mode: 2.1 V to 3.6 V
      • VIO is always tied with VBAT
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 4 µA
      • Low-power deep sleep (LPDS): 120 µA
      • Idle connected (MCU in LPDS): 710 µA
      • RX traffic (MCU active): 53 mA
      • TX traffic (MCU active): 223 mA
  • Wi-Fi TX power:
    • 2.4 GHz: 18.0 dBm at 1 DSSS
    • 5 GHz: 18.1 dBm at 6 OFDM
  • Wi-Fi RX sensitivity:
    • 2.4 GHz: –96 dBm at 1 DSSS
    • 5 GHz: –92 dBm at 6 OFDM
  • Clock source:
    • 40.0-MHz crystal with internal oscillator
    • 32.768-kHz crystal or external RTC
  • RGK package
    • 64-pin, 9-mm × 9-mm very thin quad flat nonleaded (VQFN) package, 0.5-mm pitch
  • Device supports SimpleLink™ MCU Platform developer's ecosystem