SWRS225D February   2019  – May 2021 CC3135MOD

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagrams
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 CC3135MOD Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.     
    4. 7.4 Connections for Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary: 2.4 GHz RF Band
    5. 8.5  Current Consumption Summary: 5 GHz RF Band
    6. 8.6  TX Power Control for 2.4 GHz Band
    7. 8.7  TX Power Control for 5 GHz Band
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for DIO Pins
    10. 8.10 WLAN Receiver Characteristics
      1.     
      2.     
    11. 8.11 WLAN Transmitter Characteristics
      1.     
      2.     
    12. 8.12 BLE and WLAN Coexistence Requirements
    13. 8.13 Reset Requirement
    14. 8.14 Thermal Resistance Characteristics for MOB Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power-Up Sequencing
      2. 8.15.2 Power-Down Sequencing
      3. 8.15.3 Device Reset
      4. 8.15.4 Wakeup From HIBERNATE Mode Timing
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Host Interface
      2. 8.16.2 Host UART Interface
        1. 8.16.2.1 5-Wire UART Topology
        2. 8.16.2.2 4-Wire UART Topology
        3. 8.16.2.3 3-Wire UART Topology
      3. 8.16.3 External Flash Interface
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 FIPS 140-2 Level 1 Certification
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3  Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4  Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5  Restoring Factory Default Configuration
    6. 9.6  Hostless Mode
    7. 9.7  Device Certification and Qualification
      1. 9.7.1 FCC Certification and Statement
      2. 9.7.2 IC/ISED Certification Statement
      3. 9.7.3 ETSI/CE Certification
      4. 9.7.4 Japan MIC Certification
    8. 9.8  Module Markings
    9. 9.9  End Product Labeling
    10. 9.10 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
      4. 10.1.4 Power Supply Decoupling and Bulk Capacitors
      5. 10.1.5 Reset
      6. 10.1.6 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Export Control Notice
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 Tape Specifications

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Features

  • Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives
  • Integrated Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4 GHz and 5 GHz
  • FCC, IC/ISED, ETSI/CE, and MIC certified
  • FIPS 140-2 Level 1 validated IC inside
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4 GHz radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11 a/b/g/n 2.4 GHz and 5 GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct® (only supported on 2.4 GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always on, intermittently connected, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Application throughput
    • UDP: 16 Mbps
    • TCP: 13 Mbps
  • Multilayered Security Features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • File system security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Recovery mechanism – ability to recover to factory defaults
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3 V to 3.6 V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5 µA
      • Low-power deep sleep (LPDS): 115 µA
      • Idle connected (MCU in LPDS): 710 µA
      • RX traffic (MCU active): 53 mA
      • TX traffic (MCU active): 223 mA
  • Wi-Fi TX power
    • 2.4 GHz: 16 dBm at 1 DSSS
    • 5 GHz: 15.1 dBm at 6 OFDM
  • Wi-Fi RX sensitivity
    • 2.4 GHz: –94.5 dBm at 1 DSSS
    • 5 GHz: –89 dBm at 6 OFDM
  • Additional integrated components on module
    • 40.0 MHz crystal with internal oscillator
    • 32.768 kHz crystal (RTC)
    • 32 Mbit SPI Serial Flash
    • RF filters, diplexer, and passive components
  • QFM package
    • 1.27-mm pitch, 63-pin, 20.5-mm × 17.5-mm QFM package for easy assembly and low-cost PCB design
  • Module supports SimpleLink Developers Ecosystem