SWRS225E February   2019  – December 2024 CC3135MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 CC3135MOD Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1.      12
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Current Consumption Summary: 2.4GHz RF Band
    5. 7.5  Current Consumption Summary: 5GHz RF Band
    6. 7.6  TX Power Control for 2.4 GHz Band
    7. 7.7  TX Power Control for 5GHz Band
    8. 7.8  Brownout and Blackout Conditions
    9. 7.9  Electrical Characteristics for DIO Pins
    10. 7.10 WLAN Receiver Characteristics
      1.      25
      2.      26
    11. 7.11 WLAN Transmitter Characteristics
      1.      28
      2.      29
    12. 7.12 BLE and WLAN Coexistence Requirements
    13. 7.13 Reset Requirement
    14. 7.14 Thermal Resistance Characteristics for MOB Package
    15. 7.15 Timing and Switching Characteristics
      1. 7.15.1 Power-Up Sequencing
      2. 7.15.2 Power-Down Sequencing
      3. 7.15.3 Device Reset
      4. 7.15.4 Wakeup From HIBERNATE Mode Timing
    16. 7.16 External Interfaces
      1. 7.16.1 SPI Host Interface
      2. 7.16.2 Host UART Interface
        1. 7.16.2.1 5-Wire UART Topology
        2. 7.16.2.2 4-Wire UART Topology
        3. 7.16.2.3 3-Wire UART Topology
      3. 7.16.3 External Flash Interface
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Module Features
      1. 8.2.1 WLAN
      2. 8.2.2 Network Stack
        1. 8.2.2.1 Security
      3. 8.2.3 FIPS 140-2 Level 1 Certification
      4. 8.2.4 Host Interface and Driver
      5. 8.2.5 System
    3. 8.3  Power-Management Subsystem
      1. 8.3.1 VBAT Wide-Voltage Connection
    4. 8.4  Low-Power Operating Modes
      1. 8.4.1 Low-Power Deep Sleep
      2. 8.4.2 Hibernate
      3. 8.4.3 Shutdown
    5. 8.5  Restoring Factory Default Configuration
    6. 8.6  Hostless Mode
    7. 8.7  Device Certification and Qualification
      1. 8.7.1 FCC Certification and Statement
      2. 8.7.2 IC/ISED Certification Statement
      3. 8.7.3 ETSI/CE Certification
      4. 8.7.4 Japan MIC Certification
    8. 8.8  Module Markings
    9. 8.9  End Product Labeling
    10. 8.10 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 BLE/2.4 GHz Radio Coexistence
      2. 9.1.2 Antenna Selection
      3. 9.1.3 Typical Application
      4. 9.1.4 Power Supply Decoupling and Bulk Capacitors
      5. 9.1.5 Reset
      6. 9.1.6 Unused Pins
    2. 9.2 PCB Layout Guidelines
      1. 9.2.1 General Layout Recommendations
      2. 9.2.2 RF Layout Recommendations
      3. 9.2.3 Antenna Placement and Routing
      4. 9.2.4 Transmission Line Considerations
  11. 10Environmental Requirements and SMT Specifications
    1. 10.1 Temperature
      1. 10.1.1 PCB Bending
    2. 10.2 Handling Environment
      1. 10.2.1 Terminals
      2. 10.2.2 Falling
    3. 10.3 Storage Condition
      1. 10.3.1 Moisture Barrier Bag Before Opened
      2. 10.3.2 Moisture Barrier Bag Open
    4. 10.4 PCB Assembly Guide
      1. 10.4.1 PCB Land Pattern & Thermal Vias
      2. 10.4.2 SMT Assembly Recommendations
      3. 10.4.3 PCB Surface Finish Requirements
      4. 10.4.4 Solder Stencil
      5. 10.4.5 Package Placement
      6. 10.4.6 Solder Joint Inspection
      7. 10.4.7 Rework and Replacement
      8. 10.4.8 Solder Joint Voiding
    5. 10.5 Baking Conditions
    6. 10.6 Soldering and Reflow Condition
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Development Tools and Software
    3. 11.3 Firmware Updates
    4. 11.4 Documentation Support
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Export Control Notice
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 Tape Specifications

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Table 6-2 Signal Descriptions
FUNCTION SIGNAL NAME PIN
NO.		 PIN
TYPE		 SIGNAL DIRECTION DESCRIPTION
Antenna selection DIO10 3 I/O O Antenna selection control
DIO12 9 I/O O
DIO13 10 I/O O
DIO23 12 I/O O
DIO24 18 I/O O
DIO28 19(1) I/O O
DIO29 22 I/O O
DIO25 23 O O
DIO30 42(1) I/O O
DIO3 48 I/O O
DIO4 49 I/O O
DIO5 50 I/O O
DIO8 53 I/O O
DIO9 54 I/O O
Bluetooth Low Energy/2.4 GHz Radio coexistence(2) DIO10 3 I/O I/O Coexistence inputs and outputs
DIO12 9 I/O I/O
DIO13 10 I/O I/O
DIO23 12 I/O I/O
DIO24 18 I/O I/O
DIO28 19(1) I/O I/O
DIO29 22 I/O I/O
DIO30 42(1) I/O I/O
DIO3 48 I/O I/O
DIO4 49 I/O I/O
DIO5 50 I/O I/O
DIO8 53 I/O I/O
DIO9 54 I/O I/O
Hostless Mode DIO10 3 I/O I/O Hostless mode inputs and outputs
DIO12 9 I/O I/O
DIO13 10 I/O I/O
DIO23 12 I/O I/O
DIO24 18 I/O I/O
DIO28 19(1) I/O I/O
DIO29 22 I/O I/O
DIO25 23 O O
DIO30 42(1) I/O I/O
DIO3 48 I/O I/O
DIO4 49 I/O I/O
DIO5 50 I/O I/O
DIO8 53 I/O I/O
DIO9 54 I/O I/O
HOST SPI HOST_SPI_CLK 5 I/O I Host SPI clock input
HOST_SPI_MOSI 6 I/O I Data from Host
HOST_SPI_MISO 7 I/O O Data to Host
HOST_SPI_nCS 8 I/O I Device select (active low)
FLASH SPI FLASH_SPI_MISO 13 O I External serial Flash interface: SPI data out
FLASH_SPI_CS 14 I O External serial Flash interface: SPI chip select (active low)
FLASH_SPI_CLK 15 I O External serial Flash interface: SPI clock
FLASH_SPI_MOSI 17 I O External serial Flash interface: SPI data in
UART UART1_nRTS 44 I/O O UART1 request-to-send (active low)
UART1_TX 46 I/O I UART TX data
UART1_RX 47 I/O O UART RX data
UART1_nCTS 51 I/O I UART1 clear-to-send (active low)
Sense-On-Power SOP2 23(3) O I Sense-on-power 2
SOP1 24 I I Configuration sense-on-power 1
SOP0 34 I I Configuration sense-on-power 0
Power VBAT1 37 - - Power supply for the module
VBAT2 40 - - Power supply for the module
nHIB nHIB 4 I I Hibernate signal input to the NWP subsystem (active low)
RF RF_ABG 31 I/O I/O WLAN analog RF 802.11 a/b/g/n bands
Test Port TEST_58 48 O O Test Signal
TEST_59 49 I I Test Signal
TEST_60 50 O O Test Signal
TEST_62 52 O O Test Signal
(1) LPDS retention unavailable.
(2) The CC3135MOD modules are compatible with TI BLE modules using an external RF switch.
(3) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.