SWRS225D February   2019  – May 2021 CC3135MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3135MOD Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary: 2.4 GHz RF Band
    5. 8.5  Current Consumption Summary: 5 GHz RF Band
    6. 8.6  TX Power Control for 2.4 GHz Band
    7. 8.7  TX Power Control for 5 GHz Band
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for DIO Pins
    10. 8.10 WLAN Receiver Characteristics
      1.      25
      2.      26
    11. 8.11 WLAN Transmitter Characteristics
      1.      28
      2.      29
    12. 8.12 BLE and WLAN Coexistence Requirements
    13. 8.13 Reset Requirement
    14. 8.14 Thermal Resistance Characteristics for MOB Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power-Up Sequencing
      2. 8.15.2 Power-Down Sequencing
      3. 8.15.3 Device Reset
      4. 8.15.4 Wakeup From HIBERNATE Mode Timing
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Host Interface
      2. 8.16.2 Host UART Interface
        1. 8.16.2.1 5-Wire UART Topology
        2. 8.16.2.2 4-Wire UART Topology
        3. 8.16.2.3 3-Wire UART Topology
      3. 8.16.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 FIPS 140-2 Level 1 Certification
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3  Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4  Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5  Restoring Factory Default Configuration
    6. 9.6  Hostless Mode
    7. 9.7  Device Certification and Qualification
      1. 9.7.1 FCC Certification and Statement
      2. 9.7.2 IC/ISED Certification Statement
      3. 9.7.3 ETSI/CE Certification
      4. 9.7.4 Japan MIC Certification
    8. 9.8  Module Markings
    9. 9.9  End Product Labeling
    10. 9.10 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
      4. 10.1.4 Power Supply Decoupling and Bulk Capacitors
      5. 10.1.5 Reset
      6. 10.1.6 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Export Control Notice
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 Tape Specifications

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

7.4 Connections for Unused Pins

All unused pins must be left as no connect (NC) pins. Table 7-3 provides a list of NC pins.

Table 7-3 Connections for Unused Pins
FUNCTIONSIGNAL DESCRIPTIONPIN NUMBERACCEPTABLE PRACTICE
DIODigital input or output3, 9, 10, 12, 18, 19, 22, 42, 53, 54Wake up I/O source should not be floating during hibernate. All the I/O pins will float while in Hibernate and Reset states. Ensure pullup and pulldown resistors are available on board to maintain the state of the I/O. Leave unused GPIOs as NC
No ConnectNC20, 21, 33, 39, 41, 45Unused pin, leave as NC.
SOPConfiguration sense-on-power23, 24, 34Leave as NC (Modules contain internal 100 kΩ pull down resistors on the SOP lines). An external 10 kΩ pull up resistor is required for factory restore. See Section 9.5.
ResetRESET input for the device35, 36There is an internal 100 kΩ pull-up resistor option from the nRESET pin to VBAT_RESET. Note: VBAT_RESET is not connected to VBAT1 or VBAT2 within the module. The following connection schemes are recommended:
  • Connect nRESET to a GPIO from the host only if nRESET will be in a defined state under all operating conditions. Leave VBAT_RESET unconnected to save power.
  • If nRESET cannot be in a defined state under all operating conditions, connect VBAT_RESET to the main module power supply (VBAT1 and VBAT2). Due to the internal pull-up resistor, a leakage current of 3.3 V / 100 kΩ is expected.