SCAS891A February   2010  – May 2025 CDCE949-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Resistance Characteristics
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Recommended Crystal/VCXO Specifications
    6. 5.6  EEPROM Specification
    7. 5.7  Electrical Characteristics
    8. 5.8  Timing Requirements
      1. 5.8.1 CLK_IN Timing Requirements
      2. 5.8.2 SDA/SCL Timing Requirements
    9. 5.9  Timing Diagrams
      1. 5.9.1 Timing Diagram for the SDA/SCL Serial Control Interface
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Terminal Configuration
      2. 7.3.2 Default Device Setting
      3. 7.3.3 SDA/SCL Serial Interface
      4. 7.3.4 Data Protocol
      5. 7.3.5 PLL Multiplier/Divider Definition
    4. 7.4 Device Functional Modes
      1. 7.4.1 SDA/SCL Hardware Interface
    5. 7.5 Programming
      1. 7.5.1 Generic Programming Sequence
      2. 7.5.2 Byte Write Programming Sequence
      3. 7.5.3 Byte Read Programming Sequence
      4. 7.5.4 Block Write Programming Sequence
      5. 7.5.5 Block Read Programming Sequence
  9. 8 Register Maps
    1. 8.1 SDA and SCL Registers
    2. 8.2 Configuration Registers
      1. 8.2.1 Generic Configuration Register
      2. 8.2.2 PLL1 Configuration Register
      3. 8.2.3 PLL2 Configuration Register
      4. 8.2.4 PLL3 Configuration Register
      5. 8.2.5 PLL4 Configuration Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Spread Spectrum Clock (SSC)
        2. 9.2.2.2 PLL Frequency Planning
        3. 9.2.2.3 Crystal Oscillator Start-Up
        4. 9.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling
        5. 9.2.2.5 Unused Inputs and Outputs
        6. 9.2.2.6 Switching Between XO and VCXO Mode
      3. 9.2.3 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Layout Guidelines

When the CDCE949-Q1 is used as a crystal buffer, any parasitics across the crystal affects the pulling range of the VCXO. Therefore, take care in placing the crystal units on the board. Crystals must be placed as close to the device as possible, verifying that the routing lines from the crystal terminals to XIN and XOUT have the same length.

If possible, cut out both ground plane and power plane under the area where the crystal and the routing to the device are placed. In this area, always avoid routing any other signal line, to avoid creating a source of noise coupling.

Additional discrete capacitors can be required to meet the load capacitance specification of certain crystal. For example, a 10.7pF load capacitor is not fully programmable on the chip, because the internal capacitor can range from 0pF to 20pF with steps of 1pF. The 0.7pF capacitor therefore can be discretely added on top of an internal 10pF.

To minimize the inductive influence of the trace, TI recommends placing this small capacitor as close to the device as possible and symmetrically with respect to XIN and XOUT.

Figure 5-1 shows a conceptual layout detailing recommended placement of power supply bypass capacitors on the basis of CDCE949-Q1. For component side mounting, use 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low-impedance connection to the ground plane.