SCAS945A June   2015  – September 2015 CDCEL824

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 CLK_IN Timing Requirements
    7. 7.7 SDA/SCL Timing Requirements
    8. 7.8 EEPROM Specification
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Control Pins Settings
      2. 9.3.2 SDA/SCL Serial Interface
      3. 9.3.3 SDA/SCL Hardware Interface
    4. 9.4 Device Functional Modes
      1. 9.4.1 Default Device Setting
    5. 9.5 Programming
      1. 9.5.1 Data Protocol
      2. 9.5.2 Command Code Definition
      3. 9.5.3 Generic Programming Sequence
      4. 9.5.4 Byte Write Programming Sequence
      5. 9.5.5 Byte Read Programming Sequence
      6. 9.5.6 Block Write Programming Sequence
      7. 9.5.7 Block Read Programming Sequence
    6. 9.6 Register Maps
      1. 9.6.1 SDA/SCL Configuration Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 PLL Multiplier/Divider Definition
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD Supply voltage range –0.5 2.5 V
VI Input voltage range(2) (3) –0.5 VDD + 0.5 V
VO Output voltage range(2) –0.5 VDD + 0.5 V
II Input current (VI < 0, VI > VDD) 20 mA
IO Continuous output current 50 mA
TJ Maximum junction temperature 125 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) SDA and SCL can go up to 3.6V as stated in the Recommended Operating Conditions table.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VDD Device supply voltage 1.7 1.8 1.9 V
VDDOUT Output Yx supply voltage for CDCEL824 1.7 1.9 V
VIL Low-level input voltage LVCMOS 0.3 VDD V
VIH High-level input voltage LVCMOS 0.7 VDD V
VI(thresh) Input voltage threshold LVCMOS 0.5 VDD V
VI(S) Input voltage range S0 0 1.9 V
Input voltage range S1, S2, SDA, SCL; V(Ithresh) = 0.5 VDD 0 3.6
VI(CLK) Input voltage range CLK 0 1.9 V
IOH /IOL Output current (VDDOUT = 1.8 V) ±8 mA
CL Output load LVCMOS 15 pF
TA Operating free-air temperature –40 85 °C
RECOMMENDED CRYSTAL/VCXO SPECIFICATIONS(1)
fXtal Crystal input frequency range (fundamental mode) 10 30 MHz
ESR Effective series resistance 100 Ω
fPR Pulling range (0 V ≤ VCtrl ≤ 1.8 V)(2) ±120 ±150 ppm
VCtrl Frequency control voltage 0 VDD V
C0/C1 Pullability ratio 220
CL On-chip load capacitance at Xin and Xout 0 20 pF
(1) For more information about VCXO configuration, and crystal recommendation, see application report (SCAA085).
(2) Pulling range depends on crystal-type, on-chip crystal load capacitance and PCB stray capacitance; pulling range of min ±120 ppm applies for crystal listed in the application report (SCAA085).

7.4 Thermal Information

THERMAL METRIC(1)(2) AIRFLOW (lfm) CDCEL824 UNIT
PW (TSSOP)
30 PINS
RθJA Junction-to-ambient thermal resistance 0 101 °C/W
150 85 °C/W
200 84 °C/W
250 82 °C/W
500 74 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42 °C/W
RθJB Junction-to-board thermal resistance 58 °C/W
ψJB Junction-to-board characterization parameter 64 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS MIN TYP(1) MAX UNIT
OVERALL PARAMETER
IDD Supply current (see Figure 1) All outputs off, fCLK = 27 MHz,
fVCO = 135 MHz; fOUT = 27 MHz		 All PLLS on 20 mA
Per PLL 9
IDDOUT Supply current (see Figure 2) No load, all outputs on,
fOUT = 27 MHz		 VDDOUT = 1.8 V 1 mA
IDDPD Power-down current. Every circuit powered down except SDA/SCL fIN = 0 MHz, VDD = 1.9 V 30 μA
VPUC Supply voltage VDD threshold for power-up control circuit 0.85 1.45 V
fVCO VCO frequency range of PLL 80 201 MHz
fOUT LVCMOS output frequency VDDOUT = 1.8 V 201 MHz
LVCMOS PARAMETER
VIK LVCMOS input voltage VDD = 1.7 V; IS = –18 mA –1.2 V
II LVCMOS input current VI = 0 V or VDD; VDD = 1.9 V ±5 μA
IIH LVCMOS input current for S0/S1/S2 VI = VDD; VDD = 1.9 V 5 μA
IIL LVCMOS Input current for S0/S1/S2 VI = 0 V; VDD = 1.9 V –4 μA
CI Input capacitance at Xin/Clk VIClk = 0 V or VDD 6 pF
Input capacitance at Xout VIXout = 0 V or VDD 2
Input capacitance at S0/S1/S2 VIS = 0 V or VDD 3
LVCMOS PARAMETER for VDDOUT = 1.8 V – MODE
VOH LVCMOS high-level output voltage VDDOUT = 1.7 V, IOH = –0.1 mA 1.6 V
VDDOUT = 1.7 V, IOH = –4 mA 1.4
VDDOUT = 1.7 V, IOH = –8 mA 1.1
VOL LVCMOS low-level output voltage VDDOUT = 1.7 V, IOL = 0.1 mA 0.1 V
VDDOUT = 1.7 V, IOL = 4 mA 0.3
VDDOUT = 1.7 V, IOL = 8 mA 0.6
tPLH, tPHL Propagation delay All PLL bypass 2.6 ns
tr/tf Rise and fall time VDDOUT = 1.8 V (20%–80%) 0.7 ns
tjit(cc) Cycle-to-cycle jitter (2) (3) 1 PLL switching, Y1-to-Y2 80 110 ps
2 PLL switching, Y1-to-Y4 130 200
tjit(per) Peak-to-peak period jitter (3) 1 PLL switching, Y1-to-Y2 100 130 ps
2 PLL switching, Y1-to-Y4 150 220
tsk(o) Output skew(4) fOUT = 50 MHz; Y1-to-Y2 50 ps
fOUT = 50 MHz; Y1-to-Y4 110
odc Output duty cycle(5) fVCO = 100 MHz; Pdiv = 1 45% 55%
SDA/SCL PARAMETER
VIK SCL and SDA input clamp voltage VDD = 1.7 V; II = –18 mA –1.2 V
IIH SCL and SDA input current VI = VDD; VDD = 1.9 V ±10 μA
VIH SDA/SCL input high voltage(6) 0.7 VDD V
VIL SDA/SCL input low voltage(6) 0.3 VDD V
VOL SDA low-level output voltage IOL = 3 mA VDD = 1.7 V 0.2 VDD V
CI SCL/SDA Input capacitance VI = 0 V or VDD 3 10 pF
(1) All typical values are at respective nominal VDD.
(2) 10,000 cycles
(3) Jitter depends on configuration. Jitter data is for input frequency = 27 MHz, fVCO = 135 MHz, fOUT = 27 MHz. fOUT = 3.072 MHz or input frequency = 27 MHz, fVCO = 108 MHz, fOUT = 27 MHz. fOUT = 16.384 MHz, fOUT = 25 MHz, fOUT = 74.25 MHz, fOUT = 48 MHz
(4) The tsk(o) specification is only valid for equal loading of each bank of outputs, and the outputs are generated from the same divider, data sampled on rising edge (tr).
(5) odc depends on output rise- and fall time (tr/tf).
(6) SDA and SCL pins are 3.3-V tolerant.

7.6 CLK_IN Timing Requirements

over recommended ranges of supply voltage, load, and operating free-air temperature
MIN NOM MAX UNIT
fCLK LVCMOS clock input frequency PLL bypass mode 0 130 MHz
PLL mode 8 130
tr / tf Rise and fall time CLK signal (20% to 80%) 3 ns
dutyCLK Duty cycle CLK at VDD / 2 40% 60%

7.7 SDA/SCL Timing Requirements

(SeeFigure 5) STANDARD MODE FAST MODE UNIT
MIN MAX MIN MAX
fSCL SCL clock frequency 0 100 0 400 kHz
tsu(START) START setup time (SCL high before SDA low) 4.7 0.6 μs
th(START) START hold time (SCL low after SDA low) 4 0.6 μs
tw(SCLL) SCL low-pulse duration 4.7 1.3 μs
tw(SCLH) SCL high-pulse duration 4 0.6 μs
th(SDA) SDA hold time (SDA valid after SCL low) 0 3.45 0 0.9 μs
tsu(SDA) SDA setup time 250 100 ns
tr SCL/SDA input rise time 1000 300 ns
tf SCL/SDA input fall time 300 300 ns
tsu(STOP) STOP setup time 4 0.6 μs
tBUS Bus free time between a STOP and START condition 4.7 1.3 μs

7.8 EEPROM Specification

MIN TYP MAX UNIT
EEcyc Programming cycles of EEPROM 100 1000 cycles
EEret Data retention 10 years

7.9 Typical Characteristics

CDCEL824 D001_supply_current_vs_pll_freq_SCAS945.gif
Figure 1. Supply Current vs PLL Frequency
CDCEL824 D002_output_current_vs_output_freq_SCAS945.gif
Figure 2. Output Current vs Output Frequency