SLPS382D January 2013 – August 2016 CSD97374Q4M
There are two key system-level parameters that can be addressed with a proper PCB design: electrical and thermal performance. Properly optimizing the PCB layout will yield maximum performance in both areas. Below is a brief description on how to address each parameter.
The CSD97374Q4M has the ability to switch at voltage rates greater than 10 kV/µs. Special care must be then taken with the PCB layout design and placement of the input capacitors, inductor and output capacitors.
The CSD97374Q4M has the ability to use the GND planes as the primary thermal path. As such, the use of thermal vias is an effective way to pull away heat from the device and into the system board. Concerns of solder voids and manufacturability problems can be addressed by the use of three basic tactics to minimize the amount of solder attach that will wick down the via barrel:
In the end, the number and drill size of the thermal vias should align with the end user’s PCB design rules and manufacturing capabilities.