Product details


VDS (V) 30 Power loss (W) 2.3 Ploss current (A) 15 Configuration PowerStage ID, continuous drain current at Ta=25degC (A) 25 Package (mm) SON 3.5x4.5 PowerStage Operating temperature range (C) -40 to 150 open-in-new Find other Power stages


  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.5-mm × 4.5-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
open-in-new Find other Power stages


The CSD97374Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

open-in-new Find other Power stages

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 4
Type Title Date
* Datasheet CSD97374Q4M Synchronous Buck NexFET™ Power Stage datasheet (Rev. D) Aug. 15, 2016
Technical articles Understanding the benefits of “lead-free” power MOSFETs Feb. 07, 2019
Technical articles When to use load switches in place of discrete MOSFETs Feb. 03, 2016
Technical articles 48V systems: Driving power MOSFETs efficiently and robustly Oct. 08, 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Design tools & simulation

SLPM063.ZIP (39 KB) - PSpice Model
SLPM108.TSM (47 KB) - TINA-TI Spice Model

Reference designs

High Power Density 9 to 15V In Intel Atom C2000 SoC VCCP & VNN Rail for Microservers Ref Design
TIDA-00507 The TI TPS53625 VR12 reference design (TIDA-00507), supporting Intel® Atom™ C2000, uses TI's driverless PWM architecture with TI power stages for high power density, high efficiency, and low component count while meeting Intel voltage tolerance requirements with low ripple and high (...)
document-generic Schematic
High Power Density 9V-15V input Intel® Pentium™ N3700 VCC0+VCC1 design for Industrial PC
TIDA-00572 The TI TPS1623 VR12.1 reference design, supporting Intel® Pentium™ N3700 , uses TI's driverless PWM architecture with TI power stages for high power density, high efficiency, and low component count  while meeting Intel voltage tolerance requirements with low ripple, tight loadline (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
(DPC) 8 View options

Ordering & quality

Information included:
  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​


Related videos