Product details

VDS (V) 30 Power loss (W) 2.3 Ploss current (A) 15 Configuration PowerStage ID - continuous drain current at Ta=25degC (A) 25 Package (mm) QFN 3.5 x 4.5 proprietary footprint Operating temperature range (C) -40 to 150
VDS (V) 30 Power loss (W) 2.3 Ploss current (A) 15 Configuration PowerStage ID - continuous drain current at Ta=25degC (A) 25 Package (mm) QFN 3.5 x 4.5 proprietary footprint Operating temperature range (C) -40 to 150
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.5-mm × 4.5-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.5-mm × 4.5-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD97374Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97374Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Technical documentation

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Type Title Date
* Data sheet CSD97374Q4M Synchronous Buck NexFET™ Power Stage datasheet (Rev. D) PDF | HTML 15 Aug 2016
Technical article Understanding the benefits of “lead-free” power MOSFETs 08 Feb 2019
Technical article When to use load switches in place of discrete MOSFETs 03 Feb 2016
Technical article 48V systems: Driving power MOSFETs efficiently and robustly 08 Oct 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

CSD97374CQ4M PSpice Transient Model

SLPM063.ZIP (39 KB) - PSpice Model
Simulation model

CSD97374CQ4M TINA-TI Spice Transient Model

SLPM108.TSM (47 KB) - TINA-TI Spice Model
Reference designs

TIDA-00507 — High Power Density 9 to 15V In Intel Atom C2000 SoC VCCP & VNN Rail for Microservers Ref Design

The TI TPS53625 VR12 reference design (TIDA-00507), supporting Intel® Atom™ C2000, uses TI's driverless PWM architecture with TI power stages for high power density, high efficiency, and low component count while meeting Intel voltage tolerance requirements with low ripple and high (...)
Test report: PDF
Schematic: PDF
Reference designs

TIDA-00572 — High Power Density 9V-15V input Intel® Pentium™ N3700 VCC0+VCC1 design for Industrial PC

The TI TPS1623 VR12.1 reference design, supporting Intel® Pentium™ N3700 , uses TI's driverless PWM architecture with TI power stages for high power density, high efficiency, and low component count  while meeting Intel voltage tolerance requirements with low ripple, tight loadline, (...)
Test report: PDF
Schematic: PDF
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